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Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package having routable encapsulated conductive subst...
Patent number
12,062,588
Issue date
Aug 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
Patent number
12,027,465
Issue date
Jul 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated circuit board
Patent number
11,985,768
Issue date
May 14, 2024
Pi-Crystal Incorporation
Junichi Takeya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
Patent number
11,955,346
Issue date
Apr 9, 2024
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
Patent number
11,901,322
Issue date
Feb 13, 2024
MagnaChip Semiconductor, Ltd.
Jin Won Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid felts of electrospun nanofibers
Patent number
RE49773
Issue date
Jan 2, 2024
NANOPAREIL, LLC
Todd J. Menkhaus
Information
Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
Patent number
11,810,882
Issue date
Nov 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and structures for die-to-die bonding
Patent number
11,798,914
Issue date
Oct 24, 2023
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor system
Patent number
11,784,161
Issue date
Oct 10, 2023
Illumina, Inc.
Tracy Helen Fung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing package-on-package device and bonding appar...
Patent number
11,776,946
Issue date
Oct 3, 2023
Samsung Electronics Co., Ltd.
Junho Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and fabrication method thereof
Patent number
11,728,326
Issue date
Aug 15, 2023
Yangtze Memory Technologies Co., Ltd.
Ziqi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
11,640,953
Issue date
May 2, 2023
Mitsubishi Electric Corporation
Masatake Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for through silicon die level interconnect
Patent number
11,621,219
Issue date
Apr 4, 2023
Rockwell Collins, Inc.
Reginald D. Bean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having routable encapsulated conductive subst...
Patent number
11,508,635
Issue date
Nov 22, 2022
Amkor Technology Singapore Holding Pte Ltd.
Won Bae Bang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic-part-reinforcing thermosetting resin composition, semico...
Patent number
11,495,564
Issue date
Nov 8, 2022
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Jin Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
Patent number
11,456,255
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and fabrication method thereof
Patent number
11,410,983
Issue date
Aug 9, 2022
Yangtze Memory Technologies Co., Ltd.
Ziqi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor die and chip-on-plastic packagi...
Patent number
11,380,640
Issue date
Jul 5, 2022
MagnaChip Semiconductor, Ltd.
Jin Won Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
11,342,309
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor power module and method for producing a semiconductor...
Patent number
11,316,292
Issue date
Apr 26, 2022
Infineon Technologies AG
Tomas Manuel Reiter
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing power semiconductor device and power semico...
Patent number
11,270,982
Issue date
Mar 8, 2022
Mitsubishi Electric Corporation
Norikazu Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming laminated circuit board
Patent number
11,122,693
Issue date
Sep 14, 2021
Pi-Crystal Incorporation
Junichi Takeya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment method, method for connecting electronic component, metho...
Patent number
11,049,842
Issue date
Jun 29, 2021
Dexerials Corporation
Yasushi Akutsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive film, preparation method of semiconductor device, and semi...
Patent number
11,021,634
Issue date
Jun 1, 2021
LG Chem, Ltd.
Jung Hak Kim
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
Patent number
11,004,697
Issue date
May 11, 2021
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing package-on-package device and bonding appar...
Patent number
10,998,303
Issue date
May 4, 2021
Samsung Electronics Co., Ltd.
Junho Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
10,971,471
Issue date
Apr 6, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
Patent number
10,961,411
Issue date
Mar 30, 2021
Sekisui Chemical Co., Ltd.
Mitsuru Tanikawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Three-dimensional memory device and fabrication method thereof
Patent number
10,867,983
Issue date
Dec 15, 2020
Yangtze Memory Technologies Co., Ltd.
Ziqi Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
Publication number
20240404902
Publication date
Dec 5, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Won Bae BANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
Publication number
20240387427
Publication date
Nov 21, 2024
NEXPERIA B.V.
Siu Lung Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
Publication number
20240222145
Publication date
Jul 4, 2024
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
Publication number
20240170457
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20240162402
Publication date
May 16, 2024
AUO Corporation
Chia-Hui Pai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240071999
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tseng Hsing Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR SYSTEM
Publication number
20240014179
Publication date
Jan 11, 2024
Illumina, Inc.
Tracy Helen FUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
Publication number
20230317554
Publication date
Oct 5, 2023
Qorvo US, Inc.
Christine Blair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20230282605
Publication date
Sep 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
Publication number
20230083412
Publication date
Mar 16, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Won Bae BANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230018676
Publication date
Jan 19, 2023
Samsung Electronics Co., Ltd.
YeongBeom KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20220392979
Publication date
Dec 8, 2022
SAMSUNG DISPLAY CO., LTD.
Sang Duk LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20220285323
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGI...
Publication number
20220278064
Publication date
Sep 1, 2022
Magnachip Semiconductor, Ltd.
Jin Won JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT
Publication number
20220262715
Publication date
Aug 18, 2022
Rockwell Collins, Inc.
Reginald D. Bean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20220084983
Publication date
Mar 17, 2022
Mitsubishi Electric Corporation
Masatake HARADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGI...
Publication number
20210296271
Publication date
Sep 23, 2021
Magnachip Semiconductor, Ltd.
Jin Won JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
Publication number
20210257226
Publication date
Aug 19, 2021
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING PACKAGE-ON-PACKAGE DEVICE AND BONDING APPAR...
Publication number
20210225829
Publication date
Jul 22, 2021
Samsung Electronics Co., Ltd.
JUNHO CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC-PART-REINFORCING THERMOSETTING RESIN COMPOSITION, SEMICO...
Publication number
20210202421
Publication date
Jul 1, 2021
Panasonic Intellectual Property Management Co., Ltd.
Jin JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF
Publication number
20210118866
Publication date
Apr 22, 2021
Yangtze Memory Technologies Co., Ltd.
Ziqi CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF
Publication number
20210118867
Publication date
Apr 22, 2021
Yangtze Memory Technologies Co., Ltd.
Ziqi CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES FOR DIE-TO-DIE BONDING
Publication number
20210111150
Publication date
Apr 15, 2021
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR SYSTEM
Publication number
20210050329
Publication date
Feb 18, 2021
Illumina, Inc.
Tracy Helen FUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20200343224
Publication date
Oct 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Integrated Circuits with Redistribution Lines
Publication number
20200258865
Publication date
Aug 13, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
Publication number
20200258803
Publication date
Aug 13, 2020
Amkor Technology Singapore Holding Pte. Ltd
Won Bae BANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20200212001
Publication date
Jul 2, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS