Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/90Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
IC package with top-side memory module
- Patent number 11,967,587
- Issue date Apr 23, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible clip with aligner structure
- Patent number 11,908,826
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for heater element, method for mounting heater e...
- Patent number 11,574,852
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sub-assembly
- Patent number 11,574,894
- Issue date Feb 7, 2023
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
- Patent number 11,557,567
- Issue date Jan 17, 2023
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device and method for assembling the electrical device
- Patent number 11,432,439
- Issue date Aug 30, 2022
- Siemens Aktiengesellschaft
- Martin Petricek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly
- Patent number 11,328,977
- Issue date May 10, 2022
- Cobham Colorado Springs Inc.
- Sean Leighton Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a semiconductor device
- Patent number 11,217,529
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sub-assembly
- Patent number 11,195,784
- Issue date Dec 7, 2021
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant die attach systems having spring-driven bond tools
- Patent number 11,134,595
- Issue date Sep 28, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switching module and electronic power device integrating said...
- Patent number 10,998,831
- Issue date May 4, 2021
- INSTITUT VEDECOM
- Friedbald Kiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sub-assembly
- Patent number 10,777,494
- Issue date Sep 15, 2020
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,707,185
- Issue date Jul 7, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power apparatus
- Patent number 10,665,532
- Issue date May 26, 2020
- Nexperia B.V.
- Mark A. Gajda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell module and method for manufacturing the same technical f...
- Patent number 10,665,729
- Issue date May 26, 2020
- GCL SYSTEM INTEGRATION TECHNOLOGY CO., LTD.
- Yujun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having flexible connecting members and meth...
- Patent number 10,654,710
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Yoshiaki Hirata
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solar cell module and conductor
- Patent number 10,644,182
- Issue date May 5, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Hirotaka Inaba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,497,666
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct bonding of substrates including thinning of the e...
- Patent number 10,497,609
- Issue date Dec 3, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
- Patent number 10,388,626
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number 10,293,289
- Issue date May 21, 2019
- Nanopareil, LLC
- Todd J. Menkhaus
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Pressure contact type semiconductor device stack
- Patent number 10,283,478
- Issue date May 7, 2019
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Kenichiro Omote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic switching device, arrangement herewith and methods...
- Patent number 10,269,755
- Issue date Apr 23, 2019
- Semikron Elektronik GmbH & Co. KG
- Harald Kobolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor dev...
- Patent number 10,186,496
- Issue date Jan 22, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CLIP
- Publication number 20230326902
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197590
- Publication date Jun 22, 2023
- Hyundai Motor Company
- Hyeon Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH TOP-SIDE MEMORY MODULE
- Publication number 20230187423
- Publication date Jun 15, 2023
- MARVELL ISRAEL (M.I.S.L) LTD.
- Dan AZEROUAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20230086180
- Publication date Mar 23, 2023
- Intel Corporation
- Onur Ozkan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220359454
- Publication date Nov 10, 2022
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220278072
- Publication date Sep 1, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20210392802
- Publication date Dec 16, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
- Publication number 20210327784
- Publication date Oct 21, 2021
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUB-ASSEMBLY
- Publication number 20210167042
- Publication date Jun 3, 2021
- Dynex Semiconductor Limited
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...
- Publication number 20210050323
- Publication date Feb 18, 2021
- Jusung Engineering Co., Ltd.
- Jung Bae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH TOP-SIDE MEMORY MODULE
- Publication number 20200388598
- Publication date Dec 10, 2020
- MARVELL ISRAEL (M.I.S.L) LTD.
- Dan AZEROUAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200321308
- Publication date Oct 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20200111750
- Publication date Apr 9, 2020
- INFINEON TECHNOLOGIES AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20200077550
- Publication date Mar 5, 2020
- Assembleon B.V.
- Rudolphus H. Hoefs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066675
- Publication date Feb 27, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Sub-Assembly
- Publication number 20190259693
- Publication date Aug 22, 2019
- Dynex Semiconductor Limited
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Sub-Assembly
- Publication number 20190206776
- Publication date Jul 4, 2019
- Zhuzhou CRRC Times Electric Co. Ltd.
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157239
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190127215
- Publication date May 2, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yoshiaki HIRATA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME TECHNICAL F...
- Publication number 20180212073
- Publication date Jul 26, 2018
- GCL SYSTEM INTEGRATION TECHNOLOGY CO., LTD.
- Yujun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SURFACE MOUNT DEVICE AND A METHOD OF ATTACHING SUCH A DEVICE
- Publication number 20180197835
- Publication date Jul 12, 2018
- Lumileds Holding B.V.
- Sander Noijen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE CONTACT TYPE SEMICONDUCTOR DEVICE STACK
- Publication number 20180040581
- Publication date Feb 8, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Kenichiro OMOTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SWITCHING DEVICE, ARRANGEMENT HEREWITH AND METHODS...
- Publication number 20180026005
- Publication date Jan 25, 2018
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- HARALD KOBOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...
- Publication number 20170372987
- Publication date Dec 28, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC package with top-side memory module

Flexible clip with aligner structure

Hybrid felts of electrospun nanofibers

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor device and method for manufacturing semiconductor device

Mounting structure for heater element, method for mounting heater e...

Semiconductor device sub-assembly

Methods of attaching die to substrate using compliant die attach sy...

Electrical device and method for assembling the electrical device

Semiconductor device and method for manufacturing semiconductor device

Flip chip assembly

Semiconductor device and method of forming a semiconductor device

Semiconductor device sub-assembly

Compliant die attach systems having spring-driven bond tools

Circuit board structure and method for manufacturing a circuit boar...

Power switching module and electronic power device integrating said...

Semiconductor device sub-assembly

Semiconductor device and method for manufacturing semiconductor device

Power apparatus

Solar cell module and method for manufacturing the same technical f...

Semiconductor apparatus having flexible connecting members and meth...

Solar cell module and conductor

Semiconductor device and method for manufacturing semiconductor device

Method for direct bonding of substrates including thinning of the e...

Semiconductor device and method of forming flipchip interconnect st...

Hybrid felts of electrospun nanofibers

Pressure contact type semiconductor device stack

Power electronic switching device, arrangement herewith and methods...

Dual lead frame semiconductor package and method of manufacture

Semiconductor device and method for manufacturing semiconductor dev...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CLIP

POWER MODULE AND MANUFACTURING METHOD THEREOF

IC PACKAGE WITH TOP-SIDE MEMORY MODULE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION

NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Circuit board structure and method for manufacturing a circuit boar...

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...

SEMICONDUCTOR DEVICE SUB-ASSEMBLY

ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME...

IC PACKAGE WITH TOP-SIDE MEMORY MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device Sub-Assembly

Semiconductor Device Sub-Assembly

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

ROOM TEMPERATURE METAL DIRECT BONDING

SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME TECHNICAL F...

A SURFACE MOUNT DEVICE AND A METHOD OF ATTACHING SUCH A DEVICE

PRESSURE CONTACT TYPE SEMICONDUCTOR DEVICE STACK

POWER ELECTRONIC SWITCHING DEVICE, ARRANGEMENT HEREWITH AND METHODS...

SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...

Dual Lead Frame Semiconductor Package and Method of Manufacture