Mirror polishing

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CPC
H01L21/02024

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02024Mirror polishing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Automated semiconductor substrate polishing and cleaning
- Patent number 12,154,810
- Issue date Nov 26, 2024
- GlobalWafers Co., Ltd.
- ShinBae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Silicon epitaxial wafer production method and silicon epitaxial wafer
- Patent number 12,119,375
- Issue date Oct 15, 2024
- Sumco Corporation
- Masayuki Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride single crystal substrate and method for productio...
- Patent number 12,116,697
- Issue date Oct 15, 2024
- Tokuyama Corporation
- Toru Nagashima
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon carbide substrate
- Patent number 12,104,278
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicon carbide substrate
- Patent number 12,071,708
- Issue date Aug 27, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon carbide substrate
- Patent number 12,031,233
- Issue date Jul 9, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor wafer evaluation method and manufacturing method and...
- Patent number 12,027,428
- Issue date Jul 2, 2024
- Sumco Corporation
- Takahiro Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and wafer
- Patent number 11,969,856
- Issue date Apr 30, 2024
- Sumco Corporation
- Kantarou Torii
- B24 - GRINDING POLISHING
Information Patent Grant
Laminate of aluminum nitride single-crystal substrate
- Patent number 11,952,677
- Issue date Apr 9, 2024
- Tokuyama Corporation
- Masao Ariyuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer production method
- Patent number 11,948,789
- Issue date Apr 2, 2024
- Sumco Corporation
- Toshiyuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of CMP integration for improved optical uniformity in advanc...
- Patent number 11,908,678
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,897,081
- Issue date Feb 13, 2024
- FUJIMI INCORPORATED
- Shinichiro Takami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,826,870
- Issue date Nov 28, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Hard abrasive particle-free polishing of hard materials
- Patent number 11,820,918
- Issue date Nov 21, 2023
- Entegris, Inc.
- Rajiv K. Singh
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,788,203
- Issue date Oct 17, 2023
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing composition and polishing method
- Patent number 11,791,164
- Issue date Oct 17, 2023
- NITTA DUPONT INCORPORATED
- Takayuki Matsushita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of double-side polishing semiconductor wafer
- Patent number 11,731,234
- Issue date Aug 22, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer thermal removal control
- Patent number 11,707,813
- Issue date Jul 25, 2023
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,648,641
- Issue date May 16, 2023
- FUJIMI INCORPORATED
- Makoto Tabata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silicon wafer single-side polishing method
- Patent number 11,628,534
- Issue date Apr 18, 2023
- Sumco Corporation
- Toshiharu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing using polishing pad provided with adsorption l...
- Patent number 11,602,819
- Issue date Mar 14, 2023
- Maruishi Sangyo Co., Ltd.
- Toshiyasu Yajima
- B24 - GRINDING POLISHING
Information Patent Grant
Optical adjustable filter sub-assembly
- Patent number 11,550,170
- Issue date Jan 10, 2023
- II-VI DELAWARE, INC.
- Li Zhang
- G02 - OPTICS
Information Patent Grant
Surface protectant for semiconductor wafer
- Patent number 11,542,406
- Issue date Jan 3, 2023
- Daicel Corporation
- Yuichi Sakanishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing laser-marked silicon wafer and laser-marked sil...
- Patent number 11,515,263
- Issue date Nov 29, 2022
- Sumco Corporation
- Yoichiro Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate polishing methods
- Patent number 11,367,649
- Issue date Jun 21, 2022
- GlobalWafers Co., Ltd.
- Hui Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of using a polishing system
- Patent number 11,358,252
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chi Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing wafer
- Patent number 11,361,959
- Issue date Jun 14, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuya Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition and polishing method using same
- Patent number 11,332,640
- Issue date May 17, 2022
- FUJIMI INCORPORATED
- Megumi Taniguchi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20240387162
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20240278381
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
- Publication number 20240242960
- Publication date Jul 18, 2024
- EBARA CORPORATION
- MITSUNORI SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTUR...
- Publication number 20240241064
- Publication date Jul 18, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER MANUFACTURING METHOD
- Publication number 20240203745
- Publication date Jun 20, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...
- Publication number 20240145254
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON W...
- Publication number 20240120192
- Publication date Apr 11, 2024
- Shin-Etsu Handotai Co., Ltd.
- Kota FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION
- Publication number 20240018390
- Publication date Jan 18, 2024
- Fujimi Incorporated
- Yukinobu YOSHIZAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230392289
- Publication date Dec 7, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230378274
- Publication date Nov 23, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
- Publication number 20230347469
- Publication date Nov 2, 2023
- GLOBALWAFERS CO., LTD.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION
- Publication number 20230136485
- Publication date May 4, 2023
- Fujimi Incorporated
- Shinichiro TAKAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MEASURING DIC DEFECT SHAPE ON SILICON WAFER AND POLISHIN...
- Publication number 20230125000
- Publication date Apr 20, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazuya TOMII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTING APPARATUS, PEELING APPARATUS, AND LEARNED MODEL GENERATI...
- Publication number 20230075359
- Publication date Mar 9, 2023
- Disco Corporation
- Yuta MIZUMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20230064958
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B08 - CLEANING
Information Patent Application
METHOD OF SiC WAFER PROCESSING
- Publication number 20230052218
- Publication date Feb 16, 2023
- GLOBALWAFERS CO., LTD.
- Shih-Che Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...
- Publication number 20230033545
- Publication date Feb 2, 2023
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE AND METHOD FOR PRODUCTIO...
- Publication number 20220364267
- Publication date Nov 17, 2022
- Tokuyama Corporation
- Toru NAGASHIMA
- C30 - CRYSTAL GROWTH
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE
- Publication number 20220336203
- Publication date Oct 20, 2022
- GLOBALWAFERS CO., LTD.
- Chin Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...
- Publication number 20220316092
- Publication date Oct 6, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON CARBIDE SUBSTRATE
- Publication number 20220220637
- Publication date Jul 14, 2022
- Sumitomo Electric Industries, Ltd.
- Tsubasa HONKE
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON CARBIDE SUBSTRATE
- Publication number 20220220638
- Publication date Jul 14, 2022
- Sumitomo Electric Industries, Ltd.
- Kyoko OKITA
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF CMP INTEGRATION FOR IMPROVED OPTICAL UNIFORMITY IN ADVANC...
- Publication number 20220223402
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE
- Publication number 20220208549
- Publication date Jun 30, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...
- Publication number 20220199770
- Publication date Jun 23, 2022
- JX NIPPON MINING & METALS CORPORATION
- Kenya ITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...
- Publication number 20220189883
- Publication date Jun 16, 2022
- JX NIPPON MINING & METALS CORPORATION
- Kenya ITANI
- C30 - CRYSTAL GROWTH
Information Patent Application
POLISHING COMPOSITION
- Publication number 20220162477
- Publication date May 26, 2022
- FUJIMI INCORPORATED
- Yoshiko YAMAGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER MANUFACTURING METHOD AND WAFER
- Publication number 20220097200
- Publication date Mar 31, 2022
- SUMCO CORPORATION
- Kantarou TORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER EVALUATION METHOD AND MANUFACTURING METHOD AND...
- Publication number 20220102225
- Publication date Mar 31, 2022
- SUMCO CORPORATION
- Takahiro NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON EPITAXIAL WAFER PRODUCTION METHOD AND SILICON EPITAXIAL WAFER
- Publication number 20220028969
- Publication date Jan 27, 2022
- SUMCO CORPORATION
- Masayuki ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS

Mirror polishing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Automated semiconductor substrate polishing and cleaning

SiC wafer and manufacturing method for SiC wafer

Method for wafer backside polishing

Silicon epitaxial wafer production method and silicon epitaxial wafer

Group III nitride single crystal substrate and method for productio...

Silicon carbide substrate

Silicon carbide substrate

Silicon carbide substrate

Semiconductor wafer evaluation method and manufacturing method and...

Wafer manufacturing method and wafer

Laminate of aluminum nitride single-crystal substrate

Wafer production method

Method of CMP integration for improved optical uniformity in advanc...

Method for polishing silicon substrate and polishing composition set

Apparatus and method for double-side polishing work

Hard abrasive particle-free polishing of hard materials

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Polishing composition and polishing method

Method of double-side polishing semiconductor wafer

Semiconductor wafer thermal removal control

Method for polishing silicon substrate and polishing composition set

Silicon wafer single-side polishing method

Method for polishing using polishing pad provided with adsorption l...

Optical adjustable filter sub-assembly

Surface protectant for semiconductor wafer

Method of producing laser-marked silicon wafer and laser-marked sil...

Semiconductor substrate polishing methods

Method of using a polishing system

Method for manufacturing wafer

Polishing composition and polishing method using same

Patents Applicationslast 30 patents

METHOD FOR WAFER BACKSIDE POLISHING

POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...

INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD

METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTUR...

SILICON WAFER MANUFACTURING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING S...

METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON W...

POLISHING COMPOSITION

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL

POLISHING COMPOSITION

METHOD FOR MEASURING DIC DEFECT SHAPE ON SILICON WAFER AND POLISHIN...

INSPECTING APPARATUS, PEELING APPARATUS, AND LEARNED MODEL GENERATI...

METHOD FOR WAFER BACKSIDE POLISHING

METHOD OF SiC WAFER PROCESSING

METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...

GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE AND METHOD FOR PRODUCTIO...

FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE

INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...

SILICON CARBIDE SUBSTRATE

SILICON CARBIDE SUBSTRATE

METHOD OF CMP INTEGRATION FOR IMPROVED OPTICAL UNIFORMITY IN ADVANC...

INDIUM PHOSPHIDE SUBSTRATE

INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...

INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHID...

POLISHING COMPOSITION

WAFER MANUFACTURING METHOD AND WAFER

SEMICONDUCTOR WAFER EVALUATION METHOD AND MANUFACTURING METHOD AND...

SILICON EPITAXIAL WAFER PRODUCTION METHOD AND SILICON EPITAXIAL WAFER