Mixed conductive particles, i.e. using different conductive particles

Industry

CPC
H05K2201/0272

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0272Mixed conductive particles, i.e. using different conductive particles

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 11,274,224
- Issue date Mar 15, 2022
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Device having a substrate configured to be thermoformed coupled to...
- Patent number 11,019,729
- Issue date May 25, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Mohammed Benwadih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible conductive ink
- Patent number 10,995,232
- Issue date May 4, 2021
- Henkel AG & Co. KGaA
- Jie Cao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,966,317
- Issue date Mar 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board, electronic circuit device, and production method of...
- Patent number 10,932,373
- Issue date Feb 23, 2021
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining material and method for manufacturing joined body
- Patent number 10,888,961
- Issue date Jan 12, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihiro Kawaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive ink
- Patent number 10,723,902
- Issue date Jul 28, 2020
- DST Innovations Limited
- Anthony Miles
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Electroconductive paste, electronic substrate, and method for manuf...
- Patent number 10,575,412
- Issue date Feb 25, 2020
- Mitsuboshi Belting Ltd.
- Hiroji Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printing of multi-layer circuits
- Patent number 10,446,412
- Issue date Oct 15, 2019
- PRINTCB LTD.
- Yiftah Karni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,299,379
- Issue date May 21, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Attenuation reduction structure for flexible circuit board
- Patent number 10,159,143
- Issue date Dec 18, 2018
- Advanced Flexible Circuits Co., Ltd.
- Kuo-Fu Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable compositions comprising composite particles
- Patent number 9,914,855
- Issue date Mar 13, 2018
- Henkel AG & Co. KGaA
- Anja Henckens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite nanometal paste containing copper filler and joining method
- Patent number 9,796,052
- Issue date Oct 24, 2017
- APPLIED NANOPARTICLE LABORATORY CORPORATION
- Teruo Komatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,614,295
- Issue date Apr 4, 2017
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 9,610,655
- Issue date Apr 4, 2017
- LG Innotek Co., Ltd
- Deok Ki Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Conductive metal ink composition, and method for preparing a conduc...
- Patent number 9,449,734
- Issue date Sep 20, 2016
- LG Chem, Ltd.
- Jiehyun Seong
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multilayer wiring board
- Patent number 9,420,706
- Issue date Aug 16, 2016
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 9,402,313
- Issue date Jul 26, 2016
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering electronic part
- Patent number 9,301,403
- Issue date Mar 29, 2016
- Fuji Electric Co., Ltd.
- Mitsuo Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 9,247,652
- Issue date Jan 26, 2016
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper particles, copper paste, process for producing conductive co...
- Patent number 9,221,979
- Issue date Dec 29, 2015
- Toda Kogyo Corporation
- Chiho Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Joining method, joint structure, electronic device, method for manu...
- Patent number 9,209,527
- Issue date Dec 8, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and solder joint
- Patent number 9,162,324
- Issue date Oct 20, 2015
- Senju Metal Industry Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure
- Patent number 9,105,987
- Issue date Aug 11, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND DISPLAY DEVICE
- Publication number 20240023248
- Publication date Jan 18, 2024
- KYOCERA CORPORATION
- Nobuyuki HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20210243893
- Publication date Aug 5, 2021
- YAZAKI CORPORATION
- Yukito AOYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electroconductive Paste, Electronic Substrate, and Method for Manuf...
- Publication number 20190132961
- Publication date May 2, 2019
- MITSUBOSHI BELTING LTD.
- Hiroji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...
- Publication number 20190110361
- Publication date Apr 11, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKATOSHI ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE INK
- Publication number 20180022952
- Publication date Jan 25, 2018
- DST Innovations Limited
- Anthony Miles
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...
- Publication number 20160157343
- Publication date Jun 2, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TAKATOSHI ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A BODY COMPRISING A PARTICLE STRUCTURE FIXATED I...
- Publication number 20150176147
- Publication date Jun 25, 2015
- INSTITUTT FOR ENERGITEKNIKK
- Henrik Høyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NANO-COPPER SOLDER FOR FILLING THERMAL VIAS
- Publication number 20150114707
- Publication date Apr 30, 2015
- Flextronics AP, LLC
- Michael James Glickman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT, CONDUCTIVE CIRCUIT, AND CONDUCTIVE...
- Publication number 20140374905
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRO STATIC DISCHARGE PROTECTION DEVICE
- Publication number 20140368963
- Publication date Dec 18, 2014
- TDK Corporation
- Shingo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE
- Publication number 20140332116
- Publication date Nov 13, 2014
- LG Innotek Co., Ltd.
- Deok Ki Hwang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CON...
- Publication number 20140332734
- Publication date Nov 13, 2014
- Showa Denko K.K.
- Hiroshi Uchida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE
- Publication number 20140287158
- Publication date Sep 25, 2014
- Intrinsiq Materials, Inc.
- Janet Heyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140239504
- Publication date Aug 28, 2014
- Hwei-Ling Yau
- G02 - OPTICS
Information Patent Application
COPPER PARTICLES, COPPER PASTE, PROCESS FOR PRODUCING CONDUCTIVE CO...
- Publication number 20140203222
- Publication date Jul 24, 2014
- TODA KOGYO CORPORATION
- Chiho Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140166347
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yoon Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140138126
- Publication date May 22, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20140140030
- Publication date May 22, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140124250
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Akito Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140110153
- Publication date Apr 24, 2014
- PANASONIC CORPORATION
- Takafumi Kashiwagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...
- Publication number 20140071639
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140008104
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...
- Publication number 20130299236
- Publication date Nov 14, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE METAL INK COMPOSITION, AND METHOD FOR PREPARING A CONDUC...
- Publication number 20130277096
- Publication date Oct 24, 2013
- LG CHEM Ltd.
- Jiehyun Seong
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Connection Structure
- Publication number 20130270001
- Publication date Oct 17, 2013
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...
- Publication number 20130140069
- Publication date Jun 6, 2013
- Fujitsu Limited
- Masayuki KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...
- Publication number 20130087605
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takashi KUBOTA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS

Mixed conductive particles, i.e. using different conductive particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a glass substrate with a plurality of vias

Ink composition, method for forming a conductive member, and conduc...

Filling materials and methods of filling through holes of a substrate

Device having a substrate configured to be thermoformed coupled to...

Flexible conductive ink

Sheet-shaped stretchable structure, and resin composition for stret...

Circuit board, electronic circuit device, and production method of...

Joining material and method for manufacturing joined body

Conductive ink

Electroconductive paste, electronic substrate, and method for manuf...

Adhesive composition, electronic-component-mounted substrate and se...

Printing of multi-layer circuits

Sheet-shaped stretchable structure, and resin composition for stret...

Attenuation reduction structure for flexible circuit board

Solder paste, joining method using the same and joined structure

Curable compositions comprising composite particles

Composite nanometal paste containing copper filler and joining method

Joining method, joint structure, electronic device, method for manu...

Solder paste

Copper metal film, method for producing same, copper metal pattern,...

Conductive metal ink composition, and method for preparing a conduc...

Multilayer wiring board

Conductive material, conductive paste, circuit board, and semicondu...

Method of soldering electronic part

Adhesive composition, electronic-component-mounted substrate and se...

Copper particles, copper paste, process for producing conductive co...

Joining method, joint structure, electronic device, method for manu...

Solder paste and solder joint

Connection structure

Solder paste, joining method using the same and joined structure

Patents Applicationslast 30 patents

WIRING BOARD AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

Electroconductive Paste, Electronic Substrate, and Method for Manuf...

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...

CONDUCTIVE INK

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...

SOLDER PASTE AND ELECTRONIC PART

METHOD FOR FORMING A BODY COMPRISING A PARTICLE STRUCTURE FIXATED I...

NANO-COPPER SOLDER FOR FILLING THERMAL VIAS

FORMATION OF CONDUCTIVE CIRCUIT, CONDUCTIVE CIRCUIT, AND CONDUCTIVE...

ELECTRO STATIC DISCHARGE PROTECTION DEVICE

SOLDER PASTE

CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CON...

PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE

MULTI-LAYER MICRO-WIRE STRUCTURE

COPPER PARTICLES, COPPER PASTE, PROCESS FOR PRODUCING CONDUCTIVE CO...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...

RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MAN...

CONDUCTIVE METAL INK COMPOSITION, AND METHOD FOR PREPARING A CONDUC...

Connection Structure

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE