Modification of the material of dielectric layers

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H01L21/76822

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76822Modification of the material of dielectric layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 11,862,515
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with sidewall having reduced roughness
- Patent number 11,798,979
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connecting structure having a doped layer...
- Patent number 11,791,204
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming high carbon content flowable dielectric film with low proce...
- Patent number 11,756,786
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs for semiconductor device
- Patent number 11,756,864
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and related methods of forming microelectro...
- Patent number 11,690,234
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 11,610,812
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked CMOS with upfront M0 interconnect
- Patent number 11,482,621
- Issue date Oct 25, 2022
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having magnetic core inductors
- Patent number 11,450,560
- Issue date Sep 20, 2022
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional molecules for selective polymer formation on conduc...
- Patent number 11,398,428
- Issue date Jul 26, 2022
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including stair step structures, and related apparatuses an...
- Patent number 11,393,716
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,282,747
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 11,239,156
- Issue date Feb 1, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,227,795
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a device having a doping layer and device formed
- Patent number 11,094,583
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chii-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,037,872
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Kyu-Hee Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact interlayer dielectric replacement with improved SAC cap ret...
- Patent number 11,024,536
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Adra Carr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,998,225
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Hui Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density metal-insulator-metal (MiM) capacitors
- Patent number 10,872,812
- Issue date Dec 22, 2020
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrical contacts in layered structures
- Patent number 10,852,614
- Issue date Dec 1, 2020
- Cambrios Film Solutions Corporation
- Paul Mansky
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming contact plugs for semiconductor device
- Patent number 10,847,413
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 10,804,145
- Issue date Oct 13, 2020
- Samsung Electronics Co., Ltd.
- Yeong Gil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and related methods
- Patent number 10,748,811
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via back end of the line interconnect integration
- Patent number 10,734,277
- Issue date Aug 4, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with components formed by late binding using sel...
- Patent number 10,734,236
- Issue date Aug 4, 2020
- Intel Corporation
- Sasha N. Oster
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multi-buried ULK field in BEOL structure
- Patent number 10,679,892
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interconnection
- Patent number 10,629,479
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a leveling dielectric fill material
- Patent number 10,395,981
- Issue date Aug 27, 2019
- GLOBALFOUNDRIES Inc.
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20240079268
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS
- Publication number 20230420361
- Publication date Dec 28, 2023
- Intel Corporation
- Nita CHANDRASEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230386906
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20230369103
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230369386
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Han LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING ELECTRODE DISCONTINUATION ON MICRODEVICE SIDEWALL
- Publication number 20230154790
- Publication date May 18, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...
- Publication number 20230092242
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20220375789
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20220223518
- Publication date Jul 14, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND RELATED METHODS OF FORMING MICROELECTRO...
- Publication number 20220189827
- Publication date Jun 16, 2022
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220139774
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Lid.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210327818
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20210296231
- Publication date Sep 23, 2021
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210265216
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210225699
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Chen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20210134663
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20210104431
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL MOLECULES FOR SELECTIVE POLYMER FORMATION ON CONDUC...
- Publication number 20210057337
- Publication date Feb 25, 2021
- Intel Corporation
- Eungnak HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED APPARATUSES AN...
- Publication number 20200365452
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT INTERLAYER DIELECTRIC REPLACEMENT WITH IMPROVED SAC CAP RET...
- Publication number 20200335392
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Adra Carr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH MULTIDIELECTRIC SPACERS ON CONDUCTIVE REGIONS OF STA...
- Publication number 20200235005
- Publication date Jul 23, 2020
- Micron Technology, Inc.
- John A. Smythe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCE...
- Publication number 20200234949
- Publication date Jul 23, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20200227314
- Publication date Jul 16, 2020
- Samsung Electronics Co., Ltd.
- Yeong Gil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA BACK END OF THE LINE INTERCONNECT INTEGRATION
- Publication number 20200161175
- Publication date May 21, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20200135548
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU-HUI WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200098620
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Woojin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED CMOS WITH UPFRONT M0 INTERCONNECT
- Publication number 20200098921
- Publication date Mar 26, 2020
- Willy RACHMADY
- H01 - BASIC ELECTRIC ELEMENTS

Modification of the material of dielectric layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structures and methods of fabrication

Multi-wafer capping layer for metal arcing protection

Integrated capacitor with sidewall having reduced roughness

Semiconductor device with connecting structure having a doped layer...

Forming high carbon content flowable dielectric film with low proce...

Contact plugs for semiconductor device

Microelectronic devices and related methods of forming microelectro...

Multi-wafer capping layer for metal arcing protection

Vertically stacked CMOS with upfront M0 interconnect

Microelectronic assemblies having magnetic core inductors

Interconnect structures and methods of fabrication

Multifunctional molecules for selective polymer formation on conduc...

Devices including stair step structures, and related apparatuses an...

Methods of forming microelectronic devices, and related microelectr...

Planar slab vias for integrated circuit interconnects

Integrated circuit package and method

Method of forming a device having a doping layer and device formed

Semiconductor devices and methods of manufacturing the same

Contact interlayer dielectric replacement with improved SAC cap ret...

Semiconductor device and method of forming the same

High-density metal-insulator-metal (MiM) capacitors

Method of forming electrical contacts in layered structures

Method of forming contact plugs for semiconductor device

Methods of fabricating semiconductor devices

Memory devices and related methods

Top via back end of the line interconnect integration

Electronic devices with components formed by late binding using sel...

Multi-buried ULK field in BEOL structure

Structure and method for interconnection

Semiconductor device including a leveling dielectric fill material

Patents Applicationslast 30 patents

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS

Integrated Circuit Package and Method

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

PREVENTING ELECTRODE DISCONTINUATION ON MICRODEVICE SIDEWALL

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS

MICROELECTRONIC DEVICES AND RELATED METHODS OF FORMING MICROELECTRO...

Integrated Circuit Package and Method

CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME

PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

Integrated Circuit Package and Method

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

MULTIFUNCTIONAL MOLECULES FOR SELECTIVE POLYMER FORMATION ON CONDUC...

DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED APPARATUSES AN...

CONTACT INTERLAYER DIELECTRIC REPLACEMENT WITH IMPROVED SAC CAP RET...

APPARATUS WITH MULTIDIELECTRIC SPACERS ON CONDUCTIVE REGIONS OF STA...

FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCE...

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

TOP VIA BACK END OF THE LINE INTERCONNECT INTEGRATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

VERTICALLY STACKED CMOS WITH UPFRONT M0 INTERCONNECT