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Liquid cooling device for memory module
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Publication number 20240145333
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Publication date May 2, 2024
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Celestica Technology Consultancy (Shanghai) Co. Ltd.
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Mingqing LUO
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H01 - BASIC ELECTRIC ELEMENTS
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COOLING DEVICE
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Publication number 20240125561
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Publication date Apr 18, 2024
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Fujitsu Limited
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KENTO OHGA
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F28 - HEAT EXCHANGE IN GENERAL
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Integrated Circuit Package and Method
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Publication number 20240113071
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Publication date Apr 4, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chung-Shi Liu
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H01 - BASIC ELECTRIC ELEMENTS
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MODULE DEVICE
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Publication number 20240105546
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Publication date Mar 28, 2024
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Industrial Technology Research Institute
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Ji-Yuan Syu
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H01 - BASIC ELECTRIC ELEMENTS
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POWER CONVERSION APPARATUS
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Publication number 20240038628
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Publication date Feb 1, 2024
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Panasonic Intellectual Property Management Co., Ltd.
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Hayata ONAGA
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE INCLUDING INTERPOSER
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Publication number 20230403795
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Publication date Dec 14, 2023
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Samsung Electronics Co., Ltd.
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Sangwon HA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR PACKAGE WITH GUIDE PIN
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Publication number 20230317579
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Publication date Oct 5, 2023
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Chee Hiong CHEW
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H01 - BASIC ELECTRIC ELEMENTS
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Battery Disconnect Unit
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Publication number 20230309278
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Publication date Sep 28, 2023
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LG ENERGY SOLUTION, LTD.
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Yong-Hwan Yu
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT DISSIPATION DEVICE
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Publication number 20230307317
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Publication date Sep 28, 2023
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AURAS Technology Co., Ltd.
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Cheng-Ju CHANG
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F28 - HEAT EXCHANGE IN GENERAL
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SEMICONDUCTOR DEVICE
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Publication number 20230260859
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Publication date Aug 17, 2023
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Fuji Electric Co., Ltd.
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Motohito HORI
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H01 - BASIC ELECTRIC ELEMENTS
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