mounting, engaging or coupling of the package to a board, a frame or a panel

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/426mounting, engaging or coupling of the package to a board, a frame or a panel

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transceiver handle heat dissipation airflow channeling system
- Patent number 12,225,681
- Issue date Feb 11, 2025
- Dell Products L.P.
- Shree Rathinasamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data processor cartridge
- Patent number 12,218,447
- Issue date Feb 4, 2025
- AMULET HOTKEY LTD
- Sean Andrew Copeland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of recovery of optical fiber expended during launch of a spa...
- Patent number 12,210,192
- Issue date Jan 28, 2025
- Stone Aerospace, Inc.
- William C. Stone
- E21 - EARTH DRILLING MINING
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 12,210,199
- Issue date Jan 28, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module having laser chips illuminating a light transmitting...
- Patent number 12,197,021
- Issue date Jan 14, 2025
- Hisense Broadband Multimedia Technologies Co., Ltd
- Guangchao Du
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical connector and optical connector module and operation method...
- Patent number 12,189,199
- Issue date Jan 7, 2025
- Mei-Miao Liu
- G02 - OPTICS
Information Patent Grant
Optical waveguide package and light-emitting device
- Patent number 12,181,723
- Issue date Dec 31, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module with slotted laser assembly box
- Patent number 12,174,437
- Issue date Dec 24, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Guangchao Du
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fiber optic connectors and connectorization employing adhesive admi...
- Patent number 12,174,432
- Issue date Dec 24, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS
Information Patent Grant
Optical module with structured protective cover
- Patent number 12,174,438
- Issue date Dec 24, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Guangchao Du
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package expanded beam connector for on-package optics
- Patent number 12,174,436
- Issue date Dec 24, 2024
- Intel Corporation
- Wesley Morgan
- G02 - OPTICS
Information Patent Grant
Micro patterns created on the surface to control placement and unif...
- Patent number 12,176,474
- Issue date Dec 24, 2024
- Intel Corporation
- Asako Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication systems having optical power supplies
- Patent number 12,164,142
- Issue date Dec 10, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable display device and projection device
- Patent number 12,158,585
- Issue date Dec 3, 2024
- Coretronic Corporation
- Chih-Wei Chang
- G02 - OPTICS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
Fiber optic connector
- Patent number 12,117,660
- Issue date Oct 15, 2024
- Knowledge Development for POF, S.L.
- David Ortiz Rojo
- G02 - OPTICS
Information Patent Grant
System and method of refining optical fiber
- Patent number 12,117,663
- Issue date Oct 15, 2024
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Fiber optic connectors having a keying structure and methods of mak...
- Patent number 12,092,878
- Issue date Sep 17, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250052963
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan HUANG
- G02 - OPTICS
Information Patent Application
OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION
- Publication number 20250054929
- Publication date Feb 13, 2025
- SAMTEC, INC.
- Marc EPITAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...
- Publication number 20250044537
- Publication date Feb 6, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
Light Detection and Ranging (LIDAR) Sensor System Including Integra...
- Publication number 20250035869
- Publication date Jan 30, 2025
- AURORA OPERATIONS, INC.
- James Ferrara
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE OPTICAL MODULE
- Publication number 20250023294
- Publication date Jan 16, 2025
- Cloud Light Technology Limited
- CHIEH-TSE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF
- Publication number 20250020879
- Publication date Jan 16, 2025
- GEMTEK TECHNOLOGY CO., LTD.
- Yen-Yu LAI
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL CIRCUIT
- Publication number 20250012988
- Publication date Jan 9, 2025
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHOD OF REFINING OPTICAL FIBER
- Publication number 20250012994
- Publication date Jan 9, 2025
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE ASSEMBLY
- Publication number 20250012986
- Publication date Jan 9, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250004216
- Publication date Jan 2, 2025
- OIP Technology Pte Ltd
- How Yuan HWANG
- G02 - OPTICS
Information Patent Application
ROTATING CIRCULAR WAVEGUIDE CHANNEL FOR FOLDABLE ELECTRONIC DEVICES
- Publication number 20250004222
- Publication date Jan 2, 2025
- Intel Corporation
- Debabani Choudhury
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
FIBER OPTIC CONNECTORS HAVING A KEYING STRUCTURE AND METHODS OF MAK...
- Publication number 20240418945
- Publication date Dec 19, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS
Information Patent Application
FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...
- Publication number 20240418949
- Publication date Dec 19, 2024
- nLIGHT, Inc.
- C. Geoffrey FANNING
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...
- Publication number 20240402442
- Publication date Dec 5, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...
- Publication number 20240402443
- Publication date Dec 5, 2024
- Intel Corporation
- John M. Heck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20240369767
- Publication date Nov 7, 2024
- NEC Corporation
- Yuuji MINOTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP COUPLER CONNECTOR MODULE
- Publication number 20240372631
- Publication date Nov 7, 2024
- Molex, LLC
- Thomas R. MARRAPODE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...
- Publication number 20240361544
- Publication date Oct 31, 2024
- ALTICE LABS, S.A.
- Cláudio Emanuel GOMES FERREIRINHO LIMA RODRIGUES
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240353633
- Publication date Oct 24, 2024
- Shinko Electric Industries Co., Ltd.
- Hisashi KANEDA
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE
- Publication number 20240353636
- Publication date Oct 24, 2024
- Nitto Denko Corporation
- Naoyuki TANAKA
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL PACKING STRUCTURE
- Publication number 20240353635
- Publication date Oct 24, 2024
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS

mounting, engaging or coupling of the package to a board, a frame or a panel

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transceiver handle heat dissipation airflow channeling system

Data processor cartridge

Method of recovery of optical fiber expended during launch of a spa...

Integration of power and optics through cold plates for delivery to...

Optical module having laser chips illuminating a light transmitting...

Optical connector and optical connector module and operation method...

Optical waveguide package and light-emitting device

Apparatus and methods for optical interconnects

Optical module with slotted laser assembly box

Fiber optic connectors and connectorization employing adhesive admi...

Optical module with structured protective cover

Package expanded beam connector for on-package optics

Micro patterns created on the surface to control placement and unif...

Communication systems having optical power supplies

Compressible thermal link

High speed network device with orthogonal pluggable optics modules

Optical module

Wearable display device and projection device

Active optical coupler

Active bridge enabled co-packaged photonic transceiver

Cooling device, a receptacle assembly, a system and a printed board...

Co-packaging photonic integrated circuits and application specific...

Optical multichip package with multiple system-on-chip dies

Transceiver and interface for IC package

Hydrophobic feature to control adhesive flow

Optical module

Fiber optic connector

System and method of refining optical fiber

Completely encapsulated optical multi chip package

Fiber optic connectors having a keying structure and methods of mak...

Patents Applicationslast 30 patents

OPTICAL DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION

TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

OPTICAL MODULE

Light Detection and Ranging (LIDAR) Sensor System Including Integra...

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

PLUGGABLE OPTICAL MODULE

COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF

ELECTRO-OPTICAL CIRCUIT

SYSTEM AND METHOD OF REFINING OPTICAL FIBER

SUBSTRATE ASSEMBLY

INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME

ROTATING CIRCULAR WAVEGUIDE CHANNEL FOR FOLDABLE ELECTRONIC DEVICES

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

FIBER OPTIC CONNECTORS HAVING A KEYING STRUCTURE AND METHODS OF MAK...

FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...

PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...

OPTICAL MODULE

KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

HEAT DISSIPATER ASSEMBLY

PHOTONIC CHIP COUPLER CONNECTOR MODULE

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...

OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME

PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE

PLUGGABLE OPTICAL PACKING STRUCTURE