mounting, engaging or coupling of the package to a board, a frame or a panel

Industry

CPC
G02B6/426

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/426mounting, engaging or coupling of the package to a board, a frame or a panel

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Communication systems having optical power supplies
- Patent number 12,164,142
- Issue date Dec 10, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable display device and projection device
- Patent number 12,158,585
- Issue date Dec 3, 2024
- Coretronic Corporation
- Chih-Wei Chang
- G02 - OPTICS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
Fiber optic connector
- Patent number 12,117,660
- Issue date Oct 15, 2024
- Knowledge Development for POF, S.L.
- David Ortiz Rojo
- G02 - OPTICS
Information Patent Grant
System and method of refining optical fiber
- Patent number 12,117,663
- Issue date Oct 15, 2024
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Fiber optic connectors having a keying structure and methods of mak...
- Patent number 12,092,878
- Issue date Sep 17, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS
Information Patent Grant
Silicon photonic package and method of fabricating the same
- Patent number 12,092,874
- Issue date Sep 17, 2024
- OIP TECHNOLOGY PTE LTD.
- Yonggang Jin
- G02 - OPTICS
Information Patent Grant
Optical electrical connector with improved heat dissipation perform...
- Patent number 12,092,882
- Issue date Sep 17, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Yi-Tseng Lin
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,092,881
- Issue date Sep 17, 2024
- InnoLight Technology Pte. Ltd.
- Yuzhou Sun
- G02 - OPTICS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breathable outdoor network terminal enclosure
- Patent number 12,078,858
- Issue date Sep 3, 2024
- FRONTIER COMMUNICATIONS HOLDINGS, LLC
- Erwin Wardojo
- G02 - OPTICS
Information Patent Grant
Pluggable optical module and optical communication system
- Patent number 12,072,530
- Issue date Aug 27, 2024
- NEC Corporation
- Yuuji Minota
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication systems having optical power supplies
- Patent number 12,066,653
- Issue date Aug 20, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic chip coupler connector module
- Patent number 12,068,791
- Issue date Aug 20, 2024
- Molex, LLC
- Thomas R. Marrapode
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 12,066,657
- Issue date Aug 20, 2024
- Furukawa Electric Co., Ltd.
- Yusuke Inaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,066,670
- Issue date Aug 20, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Wei Cui
- G02 - OPTICS
Information Patent Grant
Heat dissipation structure for optical module and communications de...
- Patent number 12,061,369
- Issue date Aug 13, 2024
- Huawei Technologies Co., Ltd.
- Yunchao Han
- G02 - OPTICS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,058,803
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FIBER OPTIC CONNECTORS HAVING A KEYING STRUCTURE AND METHODS OF MAK...
- Publication number 20240418945
- Publication date Dec 19, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS
Information Patent Application
FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...
- Publication number 20240418949
- Publication date Dec 19, 2024
- nLIGHT, Inc.
- C. Geoffrey FANNING
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...
- Publication number 20240402442
- Publication date Dec 5, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...
- Publication number 20240402443
- Publication date Dec 5, 2024
- Intel Corporation
- John M. Heck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20240369767
- Publication date Nov 7, 2024
- NEC Corporation
- Yuuji MINOTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP COUPLER CONNECTOR MODULE
- Publication number 20240372631
- Publication date Nov 7, 2024
- Molex, LLC
- Thomas R. MARRAPODE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...
- Publication number 20240361544
- Publication date Oct 31, 2024
- ALTICE LABS, S.A.
- Cláudio Emanuel GOMES FERREIRINHO LIMA RODRIGUES
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240353633
- Publication date Oct 24, 2024
- Shinko Electric Industries Co., Ltd.
- Hisashi KANEDA
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE
- Publication number 20240353636
- Publication date Oct 24, 2024
- Nitto Denko Corporation
- Naoyuki TANAKA
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL PACKING STRUCTURE
- Publication number 20240353635
- Publication date Oct 24, 2024
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
PACKAGE DEVICE
- Publication number 20240345341
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- G02 - OPTICS
Information Patent Application
SILICON PHOTONIC SYMMETRIC DISTRIBUTED FEEDBACK LASER
- Publication number 20240348006
- Publication date Oct 17, 2024
- OpenLight Photonics, Inc.
- John Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling assembly and method for user-facing surfaces of a pluggable...
- Publication number 20240345342
- Publication date Oct 17, 2024
- CIENA CORPORATION
- Peter Ajersch
- G02 - OPTICS
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
Platform Supports the Shortest Direct Electrical Connections betwee...
- Publication number 20240337798
- Publication date Oct 10, 2024
- Shuang Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
- Publication number 20240329342
- Publication date Oct 3, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...
- Publication number 20240329343
- Publication date Oct 3, 2024
- Nitto Denko Corporation
- Atsushi Yamagishi
- G02 - OPTICS
Information Patent Application
LIGHT SOURCE MODULE AND XR GLASSES
- Publication number 20240329341
- Publication date Oct 3, 2024
- TDK Corporation
- Takashi AOYAGI
- G02 - OPTICS
Information Patent Application
PHOTONIC STRUCTURE WITH HEAT-ACTIVATED OPTICAL TRANSMISSION
- Publication number 20240329338
- Publication date Oct 3, 2024
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
LIGHT MODULATING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20240310693
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Byunggil JEONG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE
- Publication number 20240310591
- Publication date Sep 19, 2024
- Kyocera Corporation
- Tomoyuki AKAHOSHI
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240302588
- Publication date Sep 12, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Yusuke INABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFIBER FIBER OPTIC CONNECTORS, CABLE ASSEMBLIES AND METHODS OF...
- Publication number 20240302602
- Publication date Sep 12, 2024
- Corning Research & Development Corporation
- Joel Christopher Rosson
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240302611
- Publication date Sep 12, 2024
- Huawei Technologies Co., Ltd
- Wenqi Zhang
- G02 - OPTICS
Information Patent Application
MANAGING TEMPERATURES IN INTEGRATED CIRCUITS
- Publication number 20240288633
- Publication date Aug 29, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS

mounting, engaging or coupling of the package to a board, a frame or a panel

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Communication systems having optical power supplies

Compressible thermal link

High speed network device with orthogonal pluggable optics modules

Optical module

Wearable display device and projection device

Active optical coupler

Active bridge enabled co-packaged photonic transceiver

Cooling device, a receptacle assembly, a system and a printed board...

Co-packaging photonic integrated circuits and application specific...

Optical multichip package with multiple system-on-chip dies

Transceiver and interface for IC package

Hydrophobic feature to control adhesive flow

Optical module

Fiber optic connector

System and method of refining optical fiber

Completely encapsulated optical multi chip package

Fiber optic connectors having a keying structure and methods of mak...

Silicon photonic package and method of fabricating the same

Optical electrical connector with improved heat dissipation perform...

Optical module

Integrated circuit device and method

Breathable outdoor network terminal enclosure

Pluggable optical module and optical communication system

Communication systems having optical power supplies

Photonic chip coupler connector module

Optical module

Optical module

Heat dissipation structure for optical module and communications de...

Patch on interposer architecture for low cost optical co-packaging

Circuit board assembly and electronic device

Patents Applicationslast 30 patents

FIBER OPTIC CONNECTORS HAVING A KEYING STRUCTURE AND METHODS OF MAK...

FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...

PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...

OPTICAL MODULE

KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

HEAT DISSIPATER ASSEMBLY

PHOTONIC CHIP COUPLER CONNECTOR MODULE

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...

OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME

PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE

PLUGGABLE OPTICAL PACKING STRUCTURE

PACKAGE DEVICE

SILICON PHOTONIC SYMMETRIC DISTRIBUTED FEEDBACK LASER

Cooling assembly and method for user-facing surfaces of a pluggable...

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

Platform Supports the Shortest Direct Electrical Connections betwee...

CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...

LIGHT SOURCE MODULE AND XR GLASSES

PHOTONIC STRUCTURE WITH HEAT-ACTIVATED OPTICAL TRANSMISSION

LIGHT MODULATING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME

OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

OPTICAL MODULE

MULTIFIBER FIBER OPTIC CONNECTORS, CABLE ASSEMBLIES AND METHODS OF...

PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF

MANAGING TEMPERATURES IN INTEGRATED CIRCUITS