Mounting of the optical light guide into a groove

Industry

CPC
G02B6/4243

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4243Mounting of the optical light guide into a groove

Industries

Patents Grantslast 30 patents

Information Patent Grant
PIC die and package with cover for multiple level and multiple dept...
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- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
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Moisture seal for photonic devices
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Elastic averaging coupling
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- Issue date Nov 15, 2022
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- Robert Ryan Vallance
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Lateral mounting of optoelectronic chips on organic substrate
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- Issue date Oct 4, 2022
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- Jean Benoit Héroux
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Optical transceiver and manufacturing method thereof
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- Manabu Sakai
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Optical member and method for producing same
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- Nitto Denko Corporation
- Kari Rinko
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Optical connector
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- Issue date Oct 19, 2021
- OPTICIS CO., LTD.
- Hee Dae Kim
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Information Patent Grant
Light receiving element unit
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- Issue date Oct 12, 2021
- Kyoto Semiconductor Co., Ltd.
- Yu Itazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical assembly and method of forming the same
- Patent number 11,105,989
- Issue date Aug 31, 2021
- Agency for Science, Technology and Research
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- BLOVELIGHT (GUANGDONG) INTELLIGENT TECHNOLOGY CO., LTD.
- Xinde Cai
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Method for manufacturing optical electrical module and substrate of...
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- Centera Photonics Inc.
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Photonic component and method for production thereof
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Dispersion compensation for light coupling through slanted facet of...
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- Issue date Mar 9, 2021
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- Wanli Chi
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Information Patent Grant
Lateral mounting of optoelectronic chips on organic substrate
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- Jean Benoit Héroux
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Information Patent Grant
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Optical module and associated methods
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- Issue date Nov 24, 2020
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Information Patent Grant
High-density optical fiber ribbon and ribbon cable interconnects em...
- Patent number 10,816,743
- Issue date Oct 27, 2020
- Corning Incorporated
- Scott Robertson Bickham
- G02 - OPTICS

Patents Applicationslast 30 patents

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PHOTONICS CHIPS AND SEMICONDUCTOR PRODUCTS HAVING ANGLED OPTICAL FI...
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DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...
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DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION
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ELASTIC AVERAGING COUPLING
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OPTICAL RECEPTACLE, OPTICAL MODULE AND MANUFACTURING METHOD FOR OPT...
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Optical Transceiver and Manufacturing Method Thereof
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PHOTONIC ASSEMBLY COMPRISING A PHOTONIC COMPONENT OPTICALLY COUPLED...
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THERMOSONIC BONDING FOR SECURING PHOTONIC COMPONENTS
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- ROCKLEY PHOTONICS LIMITED
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PACKAGE STRUCTURE
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ULTRA-THIN BOARD-TO-BOARD PHOTOELECTRIC CONVERSION DEVICE
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- HANGZHOU MO-LINK TECHNOLOGY CO. LTD
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METHOD TO COUPLE LIGHT USING INTEGRATED HEAT SPREADER
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- Kazuyoshi FUJISAKI
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RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
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SILICON GROOVE ARCHITECTURES AND MANUFACTURING PROCESSES FOR PASSIV...
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PATCH ON INTERPOSER ARCHITECTURE FOR LOW COST OPTICAL CO-PACKAGING
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- Publication date Jun 23, 2022
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- Xiaoqian LI
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TERMINAL PORTION STRUCTURE OF OPTICAL TRANSMISSION ELEMENT
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- TAIWAN CLOUD LIGHT TECHNOLOGY LIMITED
- EN-HUNG LIN
- G02 - OPTICS

Mounting of the optical light guide into a groove

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

PIC die and package with cover for multiple level and multiple dept...

Waveguide connecting structure

Photoelectric signal conversion and transmission device

Optoelectronic device

Moisture seal for photonic devices

Elastic averaging coupling

Lateral mounting of optoelectronic chips on organic substrate

Optical transceiver and manufacturing method thereof

Optical device

Interposer

Optical fiber guide component, optical connection structure and met...

Optical device

Optical member and method for producing same

Optical subassembly and optical module

Recessed portion in a substrate and method of forming the same

Photonic interface for electronic circuit

Line illuminating device

Optical member and method for producing same

Optical connector

Light receiving element unit

Optical assembly and method of forming the same

Optical signal transmission device

Method for manufacturing optical electrical module and substrate of...

Photonic component and method for production thereof

Dispersion compensation for light coupling through slanted facet of...

Lateral mounting of optoelectronic chips on organic substrate

Optical transceiver and manufacturing method thereof

Optical module

Optical module and associated methods

High-density optical fiber ribbon and ribbon cable interconnects em...

Patents Applicationslast 30 patents

FIBER BLOCK ALIGNMENT STRUCTURE

KEEP-OUT ZONE (KOZ) BARRIERS TO PREVENT EPOXY FLOW INTO V-GROOVE ZO...

PHOTONICS CHIPS AND SEMICONDUCTOR PRODUCTS HAVING ANGLED OPTICAL FI...

DETACHABLE CONNECTOR FOR CO-PACKAGED OPTICS

MOISTURE SEAL FOR PHOTONIC DEVICES

DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...

DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION

OPTOELECTRONIC DEVICE

ELASTIC AVERAGING COUPLING

PACKAGING STRUCTURE AND PACKAGING METHOD OF EDGE COUPLERS AND FIBER...

OPTICAL RECEPTACLE, OPTICAL MODULE AND MANUFACTURING METHOD FOR OPT...

Optical Transceiver and Manufacturing Method Thereof

Optical Circuit Module

PHOTONIC ASSEMBLY COMPRISING A PHOTONIC COMPONENT OPTICALLY COUPLED...

THERMOSONIC BONDING FOR SECURING PHOTONIC COMPONENTS

OPTICAL RECEPTACLE AND OPTICAL MODULE

PACKAGE STRUCTURE

ULTRA-THIN BOARD-TO-BOARD PHOTOELECTRIC CONVERSION DEVICE

OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE

MANUFACTURING METHOD AND APPLICATION OF OPTICAL INTERCONNECTION MODULE

PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING T...

METHOD TO COUPLE LIGHT USING INTEGRATED HEAT SPREADER

WAVEGUIDE CONNECTING STRUCTURE

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

METHOD AND SYSTEM FOR STABILIZING FIBER GRATING OPTICAL PARAMETERS

MOLDED FIBER CONNECTOR ASSEMBLY FOR PLUGGABLE OPTICAL MCP

SILICON GROOVE ARCHITECTURES AND MANUFACTURING PROCESSES FOR PASSIV...

COMPLETELY ENCAPSULATED OPTICAL MULTI CHIP PACKAGE

PATCH ON INTERPOSER ARCHITECTURE FOR LOW COST OPTICAL CO-PACKAGING

TERMINAL PORTION STRUCTURE OF OPTICAL TRANSMISSION ELEMENT