Mounting of the optical light guide into a groove

Industry

CPC
G02B6/4243

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4243Mounting of the optical light guide into a groove

Industries

Patents Grantslast 30 patents

Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Packaging structure and packaging method of edge couplers and fiber...
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- Issue date Sep 10, 2024
- SUTENG INNOVATION TECHNOLOGY CO., LTD.
- Lin Zhu
- G02 - OPTICS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
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Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
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Optical assembly for optical transceiver and optical transceiver us...
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- Issue date Jun 4, 2024
- OPTOMIND INC.
- Yung-sung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical transducer for endoscope, endoscope, and manufacturing meth...
- Patent number 11,971,534
- Issue date Apr 30, 2024
- Olympus Corporation
- Yusuke Nakagawa
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Photonic assembly comprising a photonic component optically coupled...
- Patent number 11,971,591
- Issue date Apr 30, 2024
- Scintil Photonics
- Sylvie Menezo
- G02 - OPTICS
Information Patent Grant
Method and system for stabilizing fiber grating optical parameters
- Patent number 11,960,130
- Issue date Apr 16, 2024
- RAM Photonics Industrial, LLC
- John R. Marciante
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
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Optical receptacle, optical module and manufacturing method for opt...
- Patent number 11,927,815
- Issue date Mar 12, 2024
- Enplas Corporation
- Honoka Nara
- G02 - OPTICS
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Alignment structure of optical element
- Patent number 11,921,334
- Issue date Mar 5, 2024
- FOCI Fiber Optic Communications, Inc.
- Ting-Ta Hu
- G02 - OPTICS
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Optical printed circuit board and its fabricating method
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- Issue date Feb 13, 2024
- City University of Hong Kong
- Kin Seng Chiang
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit and opto-electronic system comprising t...
- Patent number 11,899,254
- Issue date Feb 13, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- G02 - OPTICS
Information Patent Grant
Recessed portion in a substrate and method of forming the same
- Patent number 11,886,015
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonic bonding for securing photonic components
- Patent number 11,860,427
- Issue date Jan 2, 2024
- Rockley Photonics Limited
- Albert Benzoni
- G02 - OPTICS
Information Patent Grant
Optical coupling
- Patent number 11,852,876
- Issue date Dec 26, 2023
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Chip-last wafer-level fan-out with optical fiber alignment structure
- Patent number 11,823,990
- Issue date Nov 21, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic averaging coupling
- Patent number 11,808,999
- Issue date Nov 7, 2023
- Senko Advanced Components, Inc.
- Robert Ryan Vallance
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,810,870
- Issue date Nov 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin board-to-board photoelectric conversion device
- Patent number 11,796,748
- Issue date Oct 24, 2023
- HANGZHOU MO-LINK TECHNOLOGY CO. LTD
- Hao Wang
- G02 - OPTICS
Information Patent Grant
Photonics chips and semiconductor products having angled optical fi...
- Patent number 11,774,689
- Issue date Oct 3, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Bartlomiej Jan Pawlak
- G02 - OPTICS
Information Patent Grant
Optical receptacle and optical module
- Patent number 11,768,339
- Issue date Sep 26, 2023
- Enplas Corporation
- Kensuke Hiraka
- G02 - OPTICS
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Optical device
- Patent number 11,733,447
- Issue date Aug 22, 2023
- Nitto Denko Corporation
- Kari Rinko
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
PIC die and package with cover for multiple level and multiple dept...
- Patent number 11,650,381
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Waveguide connecting structure
- Patent number 11,644,629
- Issue date May 9, 2023
- Furuno Electric Co., Ltd.
- Kazuyoshi Fujisaki
- G02 - OPTICS
Information Patent Grant
Photoelectric signal conversion and transmission device
- Patent number 11,630,272
- Issue date Apr 18, 2023
- NIEN-YI INDUSTRIAL CORP.
- Wen-Cheng Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optoelectronic device
- Patent number 11,598,927
- Issue date Mar 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,587,888
- Issue date Feb 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic averaging coupling
- Patent number 11,500,166
- Issue date Nov 15, 2022
- Senko Advanced Components, Inc.
- Robert Ryan Vallance
- G02 - OPTICS
Information Patent Grant
Lateral mounting of optoelectronic chips on organic substrate
- Patent number 11,460,647
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Jean Benoit Héroux
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
METHODS FOR WELDING AN OPTICAL FIBER TO A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240288639
- Publication date Aug 29, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Roy Rudnick
- G02 - OPTICS
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PHOTOELECTRIC HYBRID DEVICE BASED ON GLASS WAVEGUIDE AND MANUFACTUR...
- Publication number 20240288644
- Publication date Aug 29, 2024
- SHENNAN CIRCUITS CO., LTD.
- Xiaofeng Liu
- G02 - OPTICS
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Optical Assembly For Optical Transceiver And Optical Transceiver Us...
- Publication number 20240280770
- Publication date Aug 22, 2024
- Optomind Inc.
- Yung-sung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...
- Publication number 20240272383
- Publication date Aug 15, 2024
- PICadvanced S.A.
- Francisco Manuel RUIVO RODRIGUES
- G02 - OPTICS
Information Patent Application
Optical Coupling Adapter for Fiber-To-Chip Integration
- Publication number 20240272389
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
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ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240264389
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR STABILIZING FIBER GRATING OPTICAL PARAMETERS
- Publication number 20240231019
- Publication date Jul 11, 2024
- RAM Photonics Industrial, LLC
- John R. Marciante
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE DEVICE, OPTICAL CHIP, AND COMMUNICATION DEVICE
- Publication number 20240192531
- Publication date Jun 13, 2024
- Huawei Technologies Co., Ltd
- Shiyang Zhu
- G02 - OPTICS
Information Patent Application
Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure
- Publication number 20240170387
- Publication date May 23, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240168238
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT STRUCTURE OF OPTICAL ELEMENT
- Publication number 20240159976
- Publication date May 16, 2024
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
REFLECTIVE OPTICAL COUPLING AND BEAM PROFILE SHAPING UNIT, OPTO-ELE...
- Publication number 20240118504
- Publication date Apr 11, 2024
- EFFECT PHOTONICS B.V.
- Rinze Frederik van der KLUIT
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20240118505
- Publication date Apr 11, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
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Optical Engine Including Fiber Deflection Unit and Method Forming t...
- Publication number 20240103236
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Tseng
- G02 - OPTICS
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Optical fiber combiner with a heat sink and method of dissipating h...
- Publication number 20240085647
- Publication date Mar 14, 2024
- Yu-Hsiang Lin
- G02 - OPTICS
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ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT
- Publication number 20240085645
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- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
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OPTICAL ENGINE ASSEMBLY, OPTICAL INTERCONNECTION SYSTEM, AND NETWOR...
- Publication number 20240085649
- Publication date Mar 14, 2024
- Huawei Technologies Co., Ltd
- Xiaokang XIAO
- G02 - OPTICS
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FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...
- Publication number 20240061192
- Publication date Feb 22, 2024
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
OPTICAL PRINTED CIRCUIT BOARD AND ITS FABRICATING METHOD
- Publication number 20230408779
- Publication date Dec 21, 2023
- City University of Hong Kong
- Kin Seng Chiang
- G02 - OPTICS
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OPTICAL CONNECTING STRUCTURE, OPTICAL MODULE AND MANUFACTURING METH...
- Publication number 20230384542
- Publication date Nov 30, 2023
- Nippon Telegraph and Telephone Corporation
- Yohei Saito
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OPTICAL CONNECTION STRUCTURE
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- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Tsutaru KUMAGAI
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Optical Transceiver and Manufacturing Method Thereof
- Publication number 20230350142
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
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APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...
- Publication number 20230314735
- Publication date Oct 5, 2023
- Intel Corporation
- Santosh SHAW
- H01 - BASIC ELECTRIC ELEMENTS
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OPTICAL ALIGNMENT DEVICE
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- Publication date Aug 17, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Joong-Seon CHOE
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND MANUFACTURING METHOD FOR OPTICAL DEVICE
- Publication number 20230221505
- Publication date Jul 13, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kazushige OKI
- G02 - OPTICS
Information Patent Application
ALIGNMENT STRUCTURE OF OPTICAL ELEMENT
- Publication number 20230221509
- Publication date Jul 13, 2023
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...
- Publication number 20230204878
- Publication date Jun 29, 2023
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS

Mounting of the optical light guide into a groove

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Completely encapsulated optical multi chip package

Packaging structure and packaging method of edge couplers and fiber...

Patch on interposer architecture for low cost optical co-packaging

Silicon groove architectures and manufacturing processes for passiv...

Optical assembly for optical transceiver and optical transceiver us...

Optical transducer for endoscope, endoscope, and manufacturing meth...

Photonic assembly comprising a photonic component optically coupled...

Method and system for stabilizing fiber grating optical parameters

Package structure

Optical receptacle, optical module and manufacturing method for opt...

Alignment structure of optical element

Optical printed circuit board and its fabricating method

Photonic integrated circuit and opto-electronic system comprising t...

Recessed portion in a substrate and method of forming the same

Thermosonic bonding for securing photonic components

Optical coupling

Chip-last wafer-level fan-out with optical fiber alignment structure

Elastic averaging coupling

Moisture seal for photonic devices

Ultra-thin board-to-board photoelectric conversion device

Photonics chips and semiconductor products having angled optical fi...

Optical receptacle and optical module

Optical device

PIC die and package with cover for multiple level and multiple dept...

Waveguide connecting structure

Photoelectric signal conversion and transmission device

Optoelectronic device

Moisture seal for photonic devices

Elastic averaging coupling

Lateral mounting of optoelectronic chips on organic substrate

Patents Applicationslast 30 patents

OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES

METHODS FOR WELDING AN OPTICAL FIBER TO A PHOTONIC INTEGRATED CIRCUIT

PHOTOELECTRIC HYBRID DEVICE BASED ON GLASS WAVEGUIDE AND MANUFACTUR...

Optical Assembly For Optical Transceiver And Optical Transceiver Us...

MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...

Optical Coupling Adapter for Fiber-To-Chip Integration

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR STABILIZING FIBER GRATING OPTICAL PARAMETERS

PACKAGE STRUCTURE

OPTICAL WAVEGUIDE DEVICE, OPTICAL CHIP, AND COMMUNICATION DEVICE

Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

ALIGNMENT STRUCTURE OF OPTICAL ELEMENT

REFLECTIVE OPTICAL COUPLING AND BEAM PROFILE SHAPING UNIT, OPTO-ELE...

Optical Coupling

Optical Engine Including Fiber Deflection Unit and Method Forming t...

Optical fiber combiner with a heat sink and method of dissipating h...

ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT

OPTICAL ENGINE ASSEMBLY, OPTICAL INTERCONNECTION SYSTEM, AND NETWOR...

FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...

OPTICAL PRINTED CIRCUIT BOARD AND ITS FABRICATING METHOD

OPTICAL CONNECTING STRUCTURE, OPTICAL MODULE AND MANUFACTURING METH...

OPTICAL CONNECTION STRUCTURE

Optical Transceiver and Manufacturing Method Thereof

APPROACH TO PREVENT PLATING AT V-GROOVE ZONE IN PHOTONICS SILICON D...

OPTICAL ALIGNMENT DEVICE

OPTICAL DEVICE AND MANUFACTURING METHOD FOR OPTICAL DEVICE

ALIGNMENT STRUCTURE OF OPTICAL ELEMENT

PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...