Mounting on semiconductor conductive members

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CPC
H01L2021/6027

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/6027Mounting on semiconductor conductive members

Industries

Patents Grantslast 30 patents

Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profiled thermode
- Patent number 11,910,533
- Issue date Feb 20, 2024
- Pragmatic Printing Ltd
- Neil Davies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,862,542
- Issue date Jan 2, 2024
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame package having conductive surfaces
- Patent number 11,694,945
- Issue date Jul 4, 2023
- Silanna Asia Pte Ltd
- Ariel Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting a leadframe assembly with a plurality of punching tools
- Patent number 11,626,350
- Issue date Apr 11, 2023
- Texas Instruments Incorporated
- Chong Han Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,545,369
- Issue date Jan 3, 2023
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bio-inspired, highly stretchable and conductive dry adhesive patch,...
- Patent number 11,490,859
- Issue date Nov 8, 2022
- Korea Advanced Institute of Science and Technology
- Seok-woo Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 11,482,500
- Issue date Oct 25, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging method
- Patent number 11,410,856
- Issue date Aug 9, 2022
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including a semicondu...
- Patent number 11,367,675
- Issue date Jun 21, 2022
- Kabushiki Kaisha Toshiba
- Katsuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,289,452
- Issue date Mar 29, 2022
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,251,112
- Issue date Feb 15, 2022
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 11,139,177
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic, biocompatible feedthrough for hermetically sealed elect...
- Patent number 11,107,703
- Issue date Aug 31, 2021
- NEURALINK CORP.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,094,559
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,094,561
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,075,091
- Issue date Jul 27, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,069,538
- Issue date Jul 20, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 11,043,606
- Issue date Jun 22, 2021
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame package having conductive surface with integral lead finger
- Patent number 10,971,434
- Issue date Apr 6, 2021
- Silanna Asia Pte Ltd
- Ariel Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 10,847,478
- Issue date Nov 24, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 10,825,795
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yeong-Seok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell edge interconnects
- Patent number 10,749,061
- Issue date Aug 18, 2020
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- Mohamed M. Hilali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor package and method of fabr...
- Patent number 10,679,866
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD
- Publication number 20230402294
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
- Publication number 20230290649
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Sophie GABORIEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20230178442
- Publication date Jun 8, 2023
- HUAWEI TECHNOLOGIES CO., LTD.
- Zhimin DOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20230060603
- Publication date Mar 2, 2023
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...
- Publication number 20230036009
- Publication date Feb 2, 2023
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...
- Publication number 20220415834
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD
- Publication number 20220148887
- Publication date May 12, 2022
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FASTENING A SEMICONDUCTOR CHIP ON A LEAD FRAME, AND ELECT...
- Publication number 20210327725
- Publication date Oct 21, 2021
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILED THERMODE
- Publication number 20210307225
- Publication date Sep 30, 2021
- PRAGMATIC PRINTING LTD.
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210287969
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Katsuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE HAVING CONDUCTIVE SURFACES
- Publication number 20210210418
- Publication date Jul 8, 2021
- Silanna Asia Pte Ltd
- Ariel Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY
- Publication number 20210202356
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Chong Han LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...
- Publication number 20210043589
- Publication date Feb 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...
- Publication number 20210013051
- Publication date Jan 14, 2021
- Neuralink Corp.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLAR CELL EDGE INTERCONNECTS
- Publication number 20200373447
- Publication date Nov 26, 2020
- ZHEJIANG KAIYING NEW MATERIALS CO., LTD.
- MOHAMED M. HILALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE HAVING CONDUCTIVE SURFACE WITH INTEGRAL LEAD FINGER
- Publication number 20200350237
- Publication date Nov 5, 2020
- Silanna Asia Pte Ltd
- Ariel Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH,...
- Publication number 20200337640
- Publication date Oct 29, 2020
- Korea Advanced Institute of Science and Technology
- Seok-woo Jeon
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303214
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303213
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200227280
- Publication date Jul 16, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200227279
- Publication date Jul 16, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200185310
- Publication date Jun 11, 2020
- Hyundai Autron Co., Ltd.
- HanSin CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20200161279
- Publication date May 21, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FASTENING A SEMICONDUCTOR CHIP ON A LEAD FRAME, AND ELECT...
- Publication number 20200152480
- Publication date May 14, 2020
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200144222
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Yeong-Seok KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
- Publication number 20190148138
- Publication date May 16, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A SURFACE-MOUNT SEMICONDUCTOR DEVICE, AND...
- Publication number 20180053710
- Publication date Feb 22, 2018
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180012815
- Publication date Jan 11, 2018
- NXP USA, Inc.
- LI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS

Mounting on semiconductor conductive members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

III-nitride-based semiconductor packaged structure and method for m...

Profiled thermode

Dual side cooling power module and manufacturing method of the same

Method of using processing oven

Lead frame package having conductive surfaces

Cutting a leadframe assembly with a plurality of punching tools

Power module package and method of manufacturing the same

Method of fastening a semiconductor chip on a lead frame, and elect...

Bio-inspired, highly stretchable and conductive dry adhesive patch,...

Method of forming an electronic device structure having an electron...

Method of using processing oven

Chip packaging method

Method for manufacturing semiconductor device including a semicondu...

Component carrier and method of manufacturing the same

Dual side cooling power module and manufacturing method of the same

Method of fabricating semiconductor package structure

Monolithic, biocompatible feedthrough for hermetically sealed elect...

Method of fastening a semiconductor chip on a lead frame, and elect...

Semiconductor package structure

Method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Solar cell edge interconnects

Power module package

Lead frame package having conductive surface with integral lead finger

Method of forming an electronic device structure having an electron...

Method of manufacturing semiconductor devices

Semiconductor device package and methods of manufacture thereof

Solar cell edge interconnects

Printed adhesion deposition to mitigate integrated circuit package...

Interconnect structure for semiconductor package and method of fabr...

Patents Applicationslast 30 patents

3D Stacking Structure and Method of Fabricating the Same

METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD

METHOD OF MANUFACTURING AN INTERPOSER PRODUCT

PACKAGE STRUCTURE AND ELECTRONIC APPARATUS

METHOD OF USING PROCESSING OVEN

III-NITRIDE-BASED SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR M...

METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...

CHIP PACKAGING METHOD

METHOD OF FASTENING A SEMICONDUCTOR CHIP ON A LEAD FRAME, AND ELECT...

PROFILED THERMODE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

LEAD FRAME PACKAGE HAVING CONDUCTIVE SURFACES

LEADFRAME ASSEMBLY

METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...

Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...

SOLAR CELL EDGE INTERCONNECTS

LEAD FRAME PACKAGE HAVING CONDUCTIVE SURFACE WITH INTEGRAL LEAD FINGER

BIO-INSPIRED, HIGHLY STRETCHABLE AND CONDUCTIVE DRY ADHESIVE PATCH,...

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME

Component Carrier and Method of Manufacturing the Same

METHOD OF FASTENING A SEMICONDUCTOR CHIP ON A LEAD FRAME, AND ELECT...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...

PROCESS FOR MANUFACTURING A SURFACE-MOUNT SEMICONDUCTOR DEVICE, AND...

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...