TREA

Multispectral infra-red imagers, having a stacked pixel-element structure

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Industry

  • CPC
  • H01L27/14652
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14652Multispectral infra-red imagers, having a stacked pixel-element structure
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