Non-uniform distribution or concentration of particles

Industry

CPC
H05K2201/0269

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0269Non-uniform distribution or concentration of particles

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 11,617,264
- Issue date Mar 28, 2023
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and component built-in wiring substrate
- Patent number 11,363,719
- Issue date Jun 14, 2022
- Ibiden Co., Ltd.
- Hiroyasu Noto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,122,679
- Issue date Sep 14, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,114,774
- Issue date Sep 7, 2021
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion
- Patent number 11,104,813
- Issue date Aug 31, 2021
- Asahi Kasei Kabushiki Kaisha
- Hirotaka Ooi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Prepreg, metal-clad laminate, printed wiring board, and method for...
- Patent number 11,027,458
- Issue date Jun 8, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroyuki Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number 10,485,102
- Issue date Nov 19, 2019
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body and method of manufacturing connection body
- Patent number 10,373,927
- Issue date Aug 6, 2019
- Dexerials Corporation
- Reiji Tsukao
- G02 - OPTICS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,368,438
- Issue date Jul 30, 2019
- Ibiden Co., Ltd.
- Hiroyuki Nishioka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Component-embedded substrate
- Patent number 9,918,381
- Issue date Mar 13, 2018
- Murata Manufacturing Co., Ltd.
- Satoru Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film forming composition, conductive film, and wiring board
- Patent number 9,859,036
- Issue date Jan 2, 2018
- FUJIFILM Corporation
- Yasuaki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, mounting structure equipped with the wiring board, an...
- Patent number 9,814,136
- Issue date Nov 7, 2017
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, component embedded substrate, and package structure
- Patent number 9,807,874
- Issue date Oct 31, 2017
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, mounting structure using same, and method of manufact...
- Patent number 9,693,451
- Issue date Jun 27, 2017
- KYOCERA Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting: structure including the same
- Patent number 9,578,738
- Issue date Feb 21, 2017
- KYOCERA Corporation
- Takeshi Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered structure and photosensitive dry film to be used therefor
- Patent number 9,423,691
- Issue date Aug 23, 2016
- TAIYO HOLDINGS CO., LTD.
- Takahiro Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic substrate and manufacturing method therefor
- Patent number 9,386,696
- Issue date Jul 5, 2016
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride substrate, circuit substrate and electronic device...
- Patent number 9,293,384
- Issue date Mar 22, 2016
- Kyocera Corporation
- Yuusaku Ishimine
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 9,237,649
- Issue date Jan 12, 2016
- KYOCERA Circuit Solutions, Inc.
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered structure and photosensitive dry film to be used therefor
- Patent number 9,091,921
- Issue date Jul 28, 2015
- Taiyo Holdings Co., Ltd.
- Takahiro Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure
- Patent number 8,895,866
- Issue date Nov 25, 2014
- Quanta Computer Inc.
- Steven Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer and device bonding substrate using the same and method...
- Patent number 8,747,579
- Issue date Jun 10, 2014
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer chip carrier and process for making
- Patent number 8,484,839
- Issue date Jul 16, 2013
- E I du Pont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and electronic equipment
- Patent number 8,319,108
- Issue date Nov 27, 2012
- Panasonic Corporation
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint structure, joining method, wiring board and method for produc...
- Patent number 8,241,760
- Issue date Aug 14, 2012
- Sumitomo Bakelite Company, Ltd.
- Toshiaki Chuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection board
- Patent number 8,207,452
- Issue date Jun 26, 2012
- Murata Manufacturing Co., Ltd.
- Issey Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power element mounting substrate, method of manufacturing the same,...
- Patent number 8,198,540
- Issue date Jun 12, 2012
- Mitsubishi Materials Corporation
- Yoshirou Kuromitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic substrate and method for manufacturing the same
- Patent number 8,168,288
- Issue date May 1, 2012
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20250048560
- Publication date Feb 6, 2025
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240206061
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Ryo ANDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...
- Publication number 20240043654
- Publication date Feb 8, 2024
- LG Innotek Co., Ltd.
- Byeong Kyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230104567
- Publication date Apr 6, 2023
- KYOCERA CORPORATION
- Takayuki UMEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20220124911
- Publication date Apr 21, 2022
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND COMPONENT BUILT-IN WIRING SUBSTRATE
- Publication number 20210282266
- Publication date Sep 9, 2021
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210212198
- Publication date Jul 8, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200194906
- Publication date Jun 18, 2020
- SAMSUNG DISPLAY CO., LTD.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD
- Publication number 20190215957
- Publication date Jul 11, 2019
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE EQUIPPED WITH THE WIRING BOARD, AN...
- Publication number 20150305154
- Publication date Oct 22, 2015
- KYOCERA CORPORATION
- Katsura HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353021
- Publication date Dec 4, 2014
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME
- Publication number 20140284088
- Publication date Sep 25, 2014
- Kiyotaka Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140239504
- Publication date Aug 28, 2014
- Hwei-Ling Yau
- G02 - OPTICS
Information Patent Application
WIRING SUBSTRATE, COMPONENT EMBEDDED SUBSTRATE, AND PACKAGE STRUCTURE
- Publication number 20140226290
- Publication date Aug 14, 2014
- KYOCERA CORPORATION
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM STRUCTURE, CIRCUIT BOARD MANUFACTURED USING THE SAME,...
- Publication number 20140174797
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hye SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN, METHOD FOR FORMING THE SAME, PRINTED WIRING BOA...
- Publication number 20140161971
- Publication date Jun 12, 2014
- FUJIFILM CORPORATION
- Seishi KASAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140124250
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Akito Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140116769
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140110160
- Publication date Apr 24, 2014
- Murata Manufacturing Co., Ltd.
- Shinichiro BANBA
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...
- Publication number 20140071639
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20140041903
- Publication date Feb 13, 2014
- TECH-FRONT (SHANGHAI) COMPUTER CO., LTD.
- Steven Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR
- Publication number 20120301824
- Publication date Nov 29, 2012
- TAIYO HOLDINGS CO., LTD.
- Takahiro YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR
- Publication number 20120301825
- Publication date Nov 29, 2012
- TAIYO HOLDINGS CO., LTD.
- Takahiro YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON NITRIDE SUBSTRATE, CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE...
- Publication number 20120281362
- Publication date Nov 8, 2012
- Kyocera Corporation
- Yuusaku Ishimine
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING
- Publication number 20120178260
- Publication date Jul 12, 2012
- E I DU PONT DE NEMOURS AND COMPANY
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RFID TAG ANTENNA AND METHOD FOR MAKING SAME
- Publication number 20110220722
- Publication date Sep 15, 2011
- HON HAI Precision Industry CO., LTD.
- TAI-CHERNG YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER BUMP, SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SEMICO...
- Publication number 20100213609
- Publication date Aug 26, 2010
- PANASONIC CORPORATION
- Shigeru Kondou
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING
- Publication number 20100065314
- Publication date Mar 18, 2010
- E.I. DuPont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE
- Publication number 20100055393
- Publication date Mar 4, 2010
- Samsung Electro-Mechanics CO., LTD.
- Yun Hwi PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT
- Publication number 20100032190
- Publication date Feb 11, 2010
- Atsushi YAMAGUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Non-uniform distribution or concentration of particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Substrate for high-frequency printed wiring board

Interconnect substrate and method of making the same

Wiring substrate and component built-in wiring substrate

Printed circuit board

Display device and manufacturing method thereof

Dispersion

Prepreg, metal-clad laminate, printed wiring board, and method for...

Substrate for high-frequency printed wiring board

Connection body and method of manufacturing connection body

Printed wiring board and method for manufacturing the same

Component-embedded substrate

Conductive film forming composition, conductive film, and wiring board

Wiring board, mounting structure equipped with the wiring board, an...

Wiring substrate, component embedded substrate, and package structure

Wiring board, mounting structure using same, and method of manufact...

Wiring board and mounting: structure including the same

Layered structure and photosensitive dry film to be used therefor

Multilayer ceramic substrate and manufacturing method therefor

Silicon nitride substrate, circuit substrate and electronic device...

Wiring board and method of manufacturing the same

Layered structure and photosensitive dry film to be used therefor

Printed circuit board structure

Solder layer and device bonding substrate using the same and method...

Multi-layer chip carrier and process for making

Mounting structure and electronic equipment

Joint structure, joining method, wiring board and method for produc...

Multilayer interconnection board

Power element mounting substrate, method of manufacturing the same,...

Multilayer ceramic substrate and method for manufacturing the same

Patents Applicationslast 30 patents

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

WIRING SUBSTRATE

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...

WIRING BOARD

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

WIRING SUBSTRATE AND COMPONENT BUILT-IN WIRING SUBSTRATE

PRINTED CIRCUIT BOARD

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD

WIRING BOARD, MOUNTING STRUCTURE EQUIPPED WITH THE WIRING BOARD, AN...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME

MULTI-LAYER MICRO-WIRE STRUCTURE

WIRING SUBSTRATE, COMPONENT EMBEDDED SUBSTRATE, AND PACKAGE STRUCTURE

BUILD-UP FILM STRUCTURE, CIRCUIT BOARD MANUFACTURED USING THE SAME,...

CONDUCTIVE PATTERN, METHOD FOR FORMING THE SAME, PRINTED WIRING BOA...

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR

FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...

PRINTED CIRCUIT BOARD STRUCTURE

LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR

LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR

SILICON NITRIDE SUBSTRATE, CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE...

MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING

RFID TAG ANTENNA AND METHOD FOR MAKING SAME

SOLDER BUMP, SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SEMICO...

MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING

MULTILAYER CERAMIC SUBSTRATE

MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT