Non-woven fibrous reinforcement

Industry

CPC
H05K2201/0293

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0293Non-woven fibrous reinforcement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board substrate comprising a coated boron nitride
- Patent number 11,895,768
- Issue date Feb 6, 2024
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-clad laminate and manufacturing method of the same
- Patent number 11,818,838
- Issue date Nov 14, 2023
- Taiwan Union Technology Corporation
- Wen-Ren Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for non-combustion type flavor inhaler and non-combus...
- Patent number 11,690,402
- Issue date Jul 4, 2023
- Japan Tobacco Inc.
- Tetsuya Yoshimura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition and prepreg and metal foil-covered...
- Patent number 11,390,735
- Issue date Jul 19, 2022
- Shengyi Technology Co., Ltd.
- Chiji Guan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrally formed product, and composite material, terminal for ele...
- Patent number 11,361,876
- Issue date Jun 14, 2022
- Furukawa Electric Co., Ltd.
- Masayasu Kasahara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Polyphenylene ether resin composition, prepreg, metal-clad laminate...
- Patent number 11,066,548
- Issue date Jul 20, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device and method for manufacturing same
- Patent number 10,499,503
- Issue date Dec 3, 2019
- AMOGREENTECH CO., LTD.
- In Yong Seo
- A41 - WEARING APPAREL
Information Patent Grant
Modified polyphenylene ether, method for preparing same, polyphenyl...
- Patent number 10,240,015
- Issue date Mar 26, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and method of producing the same
- Patent number 10,212,810
- Issue date Feb 19, 2019
- Toppan Printing Co., Ltd.
- Takanori Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film material, electronic component using film material, and method...
- Patent number 9,902,880
- Issue date Feb 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package board and prepreg
- Patent number 9,867,283
- Issue date Jan 9, 2018
- Samsung Electronics Co., Ltd.
- Jin-gyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for producing an electrically conductive pattern on a s...
- Patent number 9,862,000
- Issue date Jan 9, 2018
- Stora Enso Oyj
- Petri Sirviö
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition and dielectric layer and capacitor produced there...
- Patent number 9,779,880
- Issue date Oct 3, 2017
- 3M Innovative Properties Company
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoset resin composition, and prepreg and laminate for printed c...
- Patent number 9,670,362
- Issue date Jun 6, 2017
- Shengyi Technology Co., Ltd.
- Yundong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit materials, circuit laminates, and articles formed therefrom
- Patent number 9,554,463
- Issue date Jan 24, 2017
- Rogers Corporation
- Murali Sethumadhavan
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Resin composition and dielectric layer and capacitor produced there...
- Patent number 9,455,088
- Issue date Sep 27, 2016
- 3M Innovative Properties Company
- Tao Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoplastic resin composition, resin article, and method of manuf...
- Patent number 9,365,693
- Issue date Jun 14, 2016
- Mitsubishi Engineering-Plastics Corporation
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing an electrically conductive pattern on a surface
- Patent number 9,352,351
- Issue date May 31, 2016
- Stora Enso Oyj
- Petri Sirviö
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wiring board
- Patent number 9,155,196
- Issue date Oct 6, 2015
- Ibiden Co., Ltd.
- Haruhiko Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic dissipative composites
- Patent number 9,125,310
- Issue date Sep 1, 2015
- SABIC GLOBAL TECHNOLOGIES B.V.
- Mohammad Moniruzzaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoplastic resin composition, resin molded article, and method o...
- Patent number 8,933,161
- Issue date Jan 13, 2015
- Mitsubishi Chemical Europe GmbH
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi layer circuit board and manufacturing method of the same
- Patent number 8,802,997
- Issue date Aug 12, 2014
- Doosan Corporation
- Jeong Don Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with reinforced insulation layer and manufactu...
- Patent number 8,710,374
- Issue date Apr 29, 2014
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with reinforced thermoplastic resin layer
- Patent number 8,450,618
- Issue date May 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Keung-Jin Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing an insulating sheet, a copper clad laminate, and a pr...
- Patent number 8,397,378
- Issue date Mar 19, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Keung-Jin Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit for five LEDs in series
- Patent number 8,246,201
- Issue date Aug 21, 2012
- Pierre-Alain Dumas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting partially conductive textile materials
- Patent number 8,011,932
- Issue date Sep 6, 2011
- Amphenol- Tuchel Electronics GmbH
- Michael Steffen Bertsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
- Publication number 20240341032
- Publication date Oct 10, 2024
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND...
- Publication number 20240125050
- Publication date Apr 18, 2024
- DUPONT SAFETY & CONSTRUCTION, INC.
- Yuhei Nishimori
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE
- Publication number 20220322517
- Publication date Oct 6, 2022
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...
- Publication number 20200413536
- Publication date Dec 31, 2020
- ITEQ CORPORATION
- TARUN AMLA
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL-CLAD LAMINATE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200404782
- Publication date Dec 24, 2020
- Taiwan Union Technology Corporation
- Wen-Ren CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...
- Publication number 20200283615
- Publication date Sep 10, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20200275550
- Publication date Aug 27, 2020
- FUJIKURA LTD.
- Masahiro KAIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR NON-COMBUSTION TYPE FLAVOR INHALER AND NON-COMBUS...
- Publication number 20200260789
- Publication date Aug 20, 2020
- Japan Tobacco Inc.
- Tetsuya YOSHIMURA
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED...
- Publication number 20200157332
- Publication date May 21, 2020
- Shengyi Technology Co., Ltd.
- Chiji GUAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRALLY FORMED PRODUCT, AND COMPOSITE MATERIAL, TERMINAL FOR ELE...
- Publication number 20200043627
- Publication date Feb 6, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Masayasu KASAHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WEARABLE DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180255636
- Publication date Sep 6, 2018
- AMOGREENTECH CO., LTD.
- In Yong SEO
- A41 - WEARING APPAREL
Information Patent Application
LIGHT EMITTING DIODE BASED DAYLIGHT RUNNING LIGHT
- Publication number 20170283588
- Publication date Oct 5, 2017
- DSM IP Assets B. V.
- Richard Jacques Theodoor FRISSEN
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE BOARD AND PREPREG
- Publication number 20170064818
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Jin-gyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND ARTICLES FORMED THEREFROM
- Publication number 20150257263
- Publication date Sep 10, 2015
- Rogers Corporation
- Murali Sethumadhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED POLYPHENYLENE ETHER, METHOD FOR PREPARING SAME, POLYPHENYL...
- Publication number 20150218326
- Publication date Aug 6, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki Kitai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED C...
- Publication number 20150159016
- Publication date Jun 11, 2015
- Shengyi Technology Co., Ltd.
- Yungdong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH TEMPERATURE MULTILAYER FLEXIBLE PRINTED WIRING BOARD
- Publication number 20150122532
- Publication date May 7, 2015
- Teledyne Technologies Incorporated
- Robert A. Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THERE...
- Publication number 20140362494
- Publication date Dec 11, 2014
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140353022
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING...
- Publication number 20140170412
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young JI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...
- Publication number 20140147682
- Publication date May 29, 2014
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD O...
- Publication number 20140002311
- Publication date Jan 2, 2014
- MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Takahiro Takano
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRICAL INSULATION PAPER, METHODS OF MANUFACTURE, AND ARTICLES M...
- Publication number 20130260123
- Publication date Oct 3, 2013
- SABIC INNOVATIVE PLASTICS IP BV
- John R. Krahn
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY
- Publication number 20130199825
- Publication date Aug 8, 2013
- Atotech Deutschland GmbH
- Alex Bruderer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISSIPATIVE COMPOSITES
- Publication number 20130153832
- Publication date Jun 20, 2013
- Mohammad Moniruzzaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SU...
- Publication number 20130062045
- Publication date Mar 14, 2013
- POLYTRONICS TECHNOLOGY CORP.
- FU HUA CHU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20120211270
- Publication date Aug 23, 2012
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE SUPPORT MATERIAL USEFUL FOR SCREEN PRINTING PROCESSES
- Publication number 20120034382
- Publication date Feb 9, 2012
- Applied Materials, Inc.
- Andrea Baccini
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES
- Publication number 20120012553
- Publication date Jan 19, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board with reinforced thermoplastic resin layer
- Publication number 20110315437
- Publication date Dec 29, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Keung-Jin Sohn
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Non-woven fibrous reinforcement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board substrate comprising a coated boron nitride

Metal-clad laminate and manufacturing method of the same

Circuit board for non-combustion type flavor inhaler and non-combus...

Wiring board and method of manufacturing the same

Thermosetting resin composition and prepreg and metal foil-covered...

Integrally formed product, and composite material, terminal for ele...

Polyphenylene ether resin composition, prepreg, metal-clad laminate...

Wiring board and method of manufacturing the same

Wearable device and method for manufacturing same

Modified polyphenylene ether, method for preparing same, polyphenyl...

Printed wiring board and method of producing the same

Film material, electronic component using film material, and method...

Package board and prepreg

Arrangement for producing an electrically conductive pattern on a s...

Resin composition and dielectric layer and capacitor produced there...

Thermoset resin composition, and prepreg and laminate for printed c...

Manufacturing method for component incorporated substrate and compo...

Circuit materials, circuit laminates, and articles formed therefrom

Resin composition and dielectric layer and capacitor produced there...

Thermoplastic resin composition, resin article, and method of manuf...

Method for producing an electrically conductive pattern on a surface

Wiring board

Electrostatic dissipative composites

Thermoplastic resin composition, resin molded article, and method o...

Multi layer circuit board and manufacturing method of the same

Printed wiring board with reinforced insulation layer and manufactu...

Printed circuit board with reinforced thermoplastic resin layer

Manufacturing an insulating sheet, a copper clad laminate, and a pr...

Printed circuit for five LEDs in series

Method for contacting partially conductive textile materials

Patents Applicationslast 30 patents

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND...

PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE

POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELI...

METAL-CLAD LAMINATE AND MANUFACTURING METHOD OF THE SAME

POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

CIRCUIT BOARD FOR NON-COMBUSTION TYPE FLAVOR INHALER AND NON-COMBUS...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL FOIL-COVERED...

INTEGRALLY FORMED PRODUCT, AND COMPOSITE MATERIAL, TERMINAL FOR ELE...

WEARABLE DEVICE AND METHOD FOR MANUFACTURING SAME

LIGHT EMITTING DIODE BASED DAYLIGHT RUNNING LIGHT

PACKAGE BOARD AND PREPREG

CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND ARTICLES FORMED THEREFROM

MODIFIED POLYPHENYLENE ETHER, METHOD FOR PREPARING SAME, POLYPHENYL...

THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED C...

HIGH TEMPERATURE MULTILAYER FLEXIBLE PRINTED WIRING BOARD

RESIN COMPOSITION AND DIELECTRIC LAYER AND CAPACITOR PRODUCED THERE...

WIRING BOARD

INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING...

THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...

THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD O...

ELECTRICAL INSULATION PAPER, METHODS OF MANUFACTURE, AND ARTICLES M...

COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY

ELECTROSTATIC DISSIPATIVE COMPOSITES

HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SU...

METHOD OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

SUBSTRATE SUPPORT MATERIAL USEFUL FOR SCREEN PRINTING PROCESSES

METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

Printed circuit board with reinforced thermoplastic resin layer