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CPC
H05K2201/09181

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09181Notches in edge pads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module and method of manufacturing the same
- Patent number 11,337,597
- Issue date May 24, 2022
- Fujikura Ltd.
- Takeshi Ishizuka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,224,125
- Issue date Jan 11, 2022
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible circuit board and test fixture
- Patent number 11,217,131
- Issue date Jan 4, 2022
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Huijian Xia
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for forming laminated circuit board
- Patent number 11,122,693
- Issue date Sep 14, 2021
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with edge soldering for high-density packages...
- Patent number 11,096,290
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relay
- Patent number 11,096,280
- Issue date Aug 17, 2021
- Omron Corporation
- Daichi Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component having groove formed therein
- Patent number 10,905,015
- Issue date Jan 26, 2021
- LG Chem, Ltd.
- Ga Young Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic module with an electrode structure
- Patent number 10,863,622
- Issue date Dec 8, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and display apparatus including the...
- Patent number 10,701,809
- Issue date Jun 30, 2020
- LG Display Co., Ltd.
- Changseok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 10,660,201
- Issue date May 19, 2020
- DexCom, Inc.
- Sean Frick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic apparatus, method for attaching sheet meta...
- Patent number 10,624,216
- Issue date Apr 14, 2020
- Fujitsu Limited
- Nobuo Taketomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, a terminal and a method of assembling a prin...
- Patent number 10,617,007
- Issue date Apr 7, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Igor Perez-Uria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between flat cable and electronic circuit board
- Patent number 10,608,359
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd
- Sung-soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact pre-load structure
- Patent number 10,468,798
- Issue date Nov 5, 2019
- FCI USA LLC
- Christopher J. Kolivoski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed board and image forming apparatus
- Patent number 10,342,123
- Issue date Jul 2, 2019
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Selective deposition of thin film dielectrics using surface blockin...
- Patent number 10,219,373
- Issue date Feb 26, 2019
- Applied Materials, Inc.
- David Thompson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid control apparatus
- Patent number 10,165,684
- Issue date Dec 25, 2018
- HORIBA STEC, Co., Ltd.
- Katsuya Ohtani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
FPC-attached optical modulator and optical transmission device usin...
- Patent number 10,151,959
- Issue date Dec 11, 2018
- Sumitomo Osaka Cement Co., Ltd.
- Norikazu Miyazaki
- G02 - OPTICS
Information Patent Grant
Printed circuit board with edge soldering for high-density packages...
- Patent number 10,098,241
- Issue date Oct 9, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure between optical device and circuit substrate,...
- Patent number 10,091,881
- Issue date Oct 2, 2018
- Sumitomo Osaka Cement Co., Ltd.
- Toshio Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with side access termination pads
- Patent number 10,057,987
- Issue date Aug 21, 2018
- Illinois Tool Works Inc.
- XianBo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate terminal mounted electronic element
- Patent number 10,014,111
- Issue date Jul 3, 2018
- Murata Manufacturing Co., Ltd.
- Kazuo Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate unit, timepiece, and substrate bonding method
- Patent number 9,992,870
- Issue date Jun 5, 2018
- Casio Computer Co., Ltd.
- Koji Namiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED tube lamp
- Patent number 9,955,587
- Issue date Apr 24, 2018
- JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- Tao Jiang
- F21 - LIGHTING
Information Patent Grant
Electronic component
- Patent number 9,947,466
- Issue date Apr 17, 2018
- Murata Manufacturing Co., Ltd.
- Kazuo Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED screen display unit and production method therefor
- Patent number 9,933,120
- Issue date Apr 3, 2018
- Yi Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Vehicle diagnostic interface module
- Patent number 9,930,796
- Issue date Mar 27, 2018
- Texa S.P.A.
- Mauro Fantin
- G07 - CHECKING-DEVICES

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME
- Publication number 20240364291
- Publication date Oct 31, 2024
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB
- Publication number 20240291181
- Publication date Aug 29, 2024
- GUANGZHOU KANGLONG ELECTRONICS CO., LTD.
- Tielong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...
- Publication number 20230170128
- Publication date Jun 1, 2023
- MBDA FRANCE
- Charlotte GAZZANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20220095454
- Publication date Mar 24, 2022
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
RELAY
- Publication number 20210127488
- Publication date Apr 29, 2021
- Omron Corporation
- Daichi Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20200245459
- Publication date Jul 30, 2020
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND TEST FIXTURE
- Publication number 20200068707
- Publication date Feb 27, 2020
- Wuhan Tianma Micro-Electronics Co., Ltd.
- Huijian XIA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD FOR FORMING LAMINATED CIRCUIT BOARD, AND LAMINATED CIRCUIT B...
- Publication number 20190313535
- Publication date Oct 10, 2019
- PI-CRYSTAL INCORPORATION
- Junichi TAKEYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Circuit Board and Display Apparatus Including the...
- Publication number 20190159342
- Publication date May 23, 2019
- LG Display Co., Ltd.
- Changseok OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE,...
- Publication number 20180288874
- Publication date Oct 4, 2018
- Sumitomo Osaka Cement Co., Ltd.
- Toshio KATAOKA
- G02 - OPTICS
Information Patent Application
Selective Deposition of Thin Film Dielectrics Using Surface Blockin...
- Publication number 20180199432
- Publication date Jul 12, 2018
- Applied Materials, Inc.
- David Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD AND IMAGE FORMING APPARATUS
- Publication number 20180049317
- Publication date Feb 15, 2018
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE DIAGNOSTIC INTERFACE MODULE
- Publication number 20170020011
- Publication date Jan 19, 2017
- TEXA S.P.A.
- Mauro Fantin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH SIDE ACCESS TERMINATION PADS
- Publication number 20160374201
- Publication date Dec 22, 2016
- Illinois Tool Works Inc.
- XianBo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20150144985
- Publication date May 28, 2015
- Osram Opto Semiconductors GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Mechanical Support at Interface of Printed Circuit Board
- Publication number 20140301052
- Publication date Oct 9, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20140284089
- Publication date Sep 25, 2014
- Murata Manufacturing Co., Ltd.
- Kazuo HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20140254992
- Publication date Sep 11, 2014
- Masahiro HIRAYAMA
- G02 - OPTICS
Information Patent Application
Assembly Structure with Filter Device and Printed Circuit Board and...
- Publication number 20140254094
- Publication date Sep 11, 2014
- U.D. ELECTRONIC CORP.
- Chih-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FINGERPRINTING SENSING
- Publication number 20140219523
- Publication date Aug 7, 2014
- SYNAPTICS INCORPORATED
- Armando Leon PEREZSELSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE
- Publication number 20140174803
- Publication date Jun 26, 2014
- Jyun Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20140177179
- Publication date Jun 26, 2014
- KYOCERA CORPORATION
- Masatsugu Iiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140166346
- Publication date Jun 19, 2014
- NGK Spark Plug Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Discrete-Pin Printed-Circuit Mounting with Notches
- Publication number 20140160681
- Publication date Jun 12, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20140124256
- Publication date May 8, 2014
- Murata Manufacturing Co., Ltd.
- Kazuo HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20140116768
- Publication date May 1, 2014
- Murata Manufacturing Co., Ltd.
- Kazuo HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND CIRCUIT-BOARD CONNECTION STRUCTURE
- Publication number 20140085856
- Publication date Mar 27, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Mizuki SHIRAO
- H01 - BASIC ELECTRIC ELEMENTS

Notches in edge pads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated circuit board

Sensor interposer employing castellated through-vias

Imaging module and method of manufacturing the same

Sensor interposer employing castellated through-vias

Flexible circuit board and test fixture

Method for forming laminated circuit board

Printed circuit board with edge soldering for high-density packages...

Relay

Printed wiring board and method for manufacturing printed wiring board

Chip component having groove formed therein

Circuit board and electronic module with an electrode structure

Flexible printed circuit board and display apparatus including the...

Sensor interposer employing castellated through-vias

Wiring board, electronic apparatus, method for attaching sheet meta...

Printed circuit board, a terminal and a method of assembling a prin...

Connection structure between flat cable and electronic circuit board

Electrical contact pre-load structure

Printed board and image forming apparatus

Selective deposition of thin film dielectrics using surface blockin...

Fluid control apparatus

FPC-attached optical modulator and optical transmission device usin...

Printed circuit board with edge soldering for high-density packages...

Connection structure between optical device and circuit substrate,...

Printed circuit board with side access termination pads

Substrate terminal mounted electronic element

Substrate unit, timepiece, and substrate bonding method

LED tube lamp

Electronic component

LED screen display unit and production method therefor

Vehicle diagnostic interface module

Patents Applicationslast 30 patents

CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME

Ultra-Thin Sandwich Component

BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

RELAY

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

FLEXIBLE CIRCUIT BOARD AND TEST FIXTURE

METHOD FOR FORMING LAMINATED CIRCUIT BOARD, AND LAMINATED CIRCUIT B...

Flexible Printed Circuit Board and Display Apparatus Including the...

CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE,...

Selective Deposition of Thin Film Dielectrics Using Surface Blockin...

PRINTED BOARD AND IMAGE FORMING APPARATUS

VEHICLE DIAGNOSTIC INTERFACE MODULE

PRINTED CIRCUIT BOARD WITH SIDE ACCESS TERMINATION PADS

Electronic Device

Conductive Mechanical Support at Interface of Printed Circuit Board

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE

FLEXIBLE CIRCUIT BOARD

Assembly Structure with Filter Device and Printed Circuit Board and...

APPARATUS AND METHOD FOR FINGERPRINTING SENSING

WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

Discrete-Pin Printed-Circuit Mounting with Notches

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

FLEXIBLE PRINTED CIRCUIT BOARD AND CIRCUIT-BOARD CONNECTION STRUCTURE