of a metallic layer

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H01L21/02244

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02244of a metallic layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High pressure oxidation of metal films
- Patent number 12,173,413
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming method for forming self-assembled monolayer on substrate
- Patent number 12,152,304
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Shuji Azumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,131,955
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulation of oxidation profile for substrate processing
- Patent number 12,087,573
- Issue date Sep 10, 2024
- Lam Research Corporation
- Gerald Joseph Brady
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for manufacturing a trench power MOSFET
- Patent number 12,062,717
- Issue date Aug 13, 2024
- SK keyfoundry Inc.
- Hyun Kwang Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for etching metal nitrides
- Patent number 12,009,224
- Issue date Jun 11, 2024
- ASM IP Holding B.V.
- Ren-Jie Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming asymmetric differential spacers for optimized MOS...
- Patent number 11,973,130
- Issue date Apr 30, 2024
- X-FAB France SAS
- Sébastien Daveau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and manufacturing method therefor, and display de...
- Patent number 11,961,848
- Issue date Apr 16, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having multiple chips and method for manufacturing th...
- Patent number 11,942,466
- Issue date Mar 26, 2024
- Kioxia Corporation
- Mutsumi Okajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,935,926
- Issue date Mar 19, 2024
- SK Hynix Inc.
- Hyeng-Woo Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,427
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,403
- Issue date Feb 13, 2024
- SK Hynix Inc.
- Jun Hyuk Seo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for manufacturing semiconductor memory
- Patent number 11,854,797
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Haodong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for seamless gap filling of dielectric material
- Patent number 11,830,728
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Chengyu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric capacitor, a ferroelectric memory cell, an array of f...
- Patent number 11,825,662
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Clement Jacob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of hafnium oxide within a high aspect ratio hole
- Patent number 11,791,153
- Issue date Oct 17, 2023
- ASM IP Holding B.V.
- Jiyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,784,053
- Issue date Oct 10, 2023
- Sumitomo Electric Device Innovations, Inc.
- Yukinori Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 11,664,236
- Issue date May 30, 2023
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivated nanoparticles
- Patent number 11,656,231
- Issue date May 23, 2023
- Tectus Corporation
- Lianhua Qu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device structure with fine conductive contact and met...
- Patent number 11,652,151
- Issue date May 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,646,193
- Issue date May 9, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-stoichiometric metal-oxide thin films
- Patent number 11,646,199
- Issue date May 9, 2023
- International Business Machines Corporation
- John Rozen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,615,952
- Issue date Mar 28, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,588,026
- Issue date Feb 21, 2023
- SK Hynix Inc.
- Hyeng-Woo Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,552,181
- Issue date Jan 10, 2023
- United Microelectronics Corp.
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,502,180
- Issue date Nov 15, 2022
- United Microelectronics Corp.
- Chia-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING METHOD
- Publication number 20250034715
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- Shuji AZUMO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING A DEVICE HAVING A PASSIVATING LAYER
- Publication number 20250006486
- Publication date Jan 2, 2025
- Microsoft Technology Licensing, LLC
- Asbjørn Cennet Cliff Drachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSING
- Publication number 20240404822
- Publication date Dec 5, 2024
- LAM RESEARCH CORPORATION
- Gerald Joseph Brady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures For Semiconductor Devices
- Publication number 20240347393
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240304439
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Koji AKIYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...
- Publication number 20240249936
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS FORMED USING A WIDE BANDGAP SEMICONDUCTOR...
- Publication number 20240250126
- Publication date Jul 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS
- Publication number 20240203747
- Publication date Jun 20, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170551
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162221
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Hiroyoshi KUDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ETCHING OF RUTHENIUM
- Publication number 20240153781
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Hisashi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240096990
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Tomohiro MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...
- Publication number 20230386830
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Xiaolin C. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230369437
- Publication date Nov 16, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Hiroaki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD SUPPRESSED METAL GAPFILL
- Publication number 20230326744
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307346
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT LIQUID AND SUBSTRATE TREATMENT METHOD
- Publication number 20230287304
- Publication date Sep 14, 2023
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD OF REMOVING BARRIER LAYER
- Publication number 20230223301
- Publication date Jul 13, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING AN ANODIC POROUS REGION SURROUNDED BY A TRENCH HA...
- Publication number 20230197440
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Brigitte SOULIER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230163176
- Publication date May 25, 2023
- SK hynix Inc.
- Hyeng-Woo EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEAMLESS GAP FILLING USING GRADIENT OXIDATION
- Publication number 20230113514
- Publication date Apr 13, 2023
- Applied Materials, Inc.
- Shih Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEAMLESS GAP FILLING OF DIELECTRIC MATERIAL
- Publication number 20230113965
- Publication date Apr 13, 2023
- Chengyu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...
- Publication number 20230098746
- Publication date Mar 30, 2023
- Kokusai Electric Corporation
- Yoshimasa NAGATOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230100606
- Publication date Mar 30, 2023
- UNITED MICROELECTRONICS CORP.
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING METAL CONTACT FEATURES
- Publication number 20230037334
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FINE CONDUCTIVE CONTACT AND MET...
- Publication number 20230034084
- Publication date Feb 2, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-LING YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSING
- Publication number 20230005740
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Gerald Joseph Brady
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR TREATING OBJECT TO BE TREATED AND TREATMENT LIQUID
- Publication number 20220406596
- Publication date Dec 22, 2022
- FUJIFILM CORPORATION
- Atsushi MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING A SHAPE OF A PATTERN OVER A SU...
- Publication number 20220375764
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Takayuki KATSUNUMA
- H01 - BASIC ELECTRIC ELEMENTS

of a metallic layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High pressure oxidation of metal films

Metal oxide composite as etch stop layer

Film forming method for forming self-assembled monolayer on substrate

Gate structures for semiconductor devices

Modulation of oxidation profile for substrate processing

Structure and method for manufacturing a trench power MOSFET

Encapsulated top via interconnects

Apparatus and method for etching metal nitrides

Method of forming asymmetric differential spacers for optimized MOS...

Display substrate and manufacturing method therefor, and display de...

Memory device having multiple chips and method for manufacturing th...

Semiconductor device and method for fabricating the same

Semiconductor device

Semiconductor device and method for fabricating the same

Methods for manufacturing semiconductor memory

Methods for seamless gap filling of dielectric material

Ferroelectric capacitor, a ferroelectric memory cell, an array of f...

Method of forming copper interconnect structure with manganese barr...

Deposition of hafnium oxide within a high aspect ratio hole

Semiconductor device manufacturing method

Multi-step pre-clean for selective metal gap fill

Method of etching film and plasma processing apparatus

Passivated nanoparticles

Semiconductor device structure with fine conductive contact and met...

Manufacturing of foreign oxide or foreign nitride on semiconductor

Sub-stoichiometric metal-oxide thin films

Manufacturing of foreign oxide or foreign nitride on semiconductor

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method of forming the same

Patents Applicationslast 30 patents

FILM FORMING METHOD

METHOD OF FABRICATING A DEVICE HAVING A PASSIVATING LAYER

MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSING

Gate Structures For Semiconductor Devices

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHODS FOR REDUCING MICRO AND MACRO SCALLOPING ON SEMICONDUCTOR DE...

FIELD-EFFECT TRANSISTORS FORMED USING A WIDE BANDGAP SEMICONDUCTOR...

ISOTROPIC ECHING METHOD FOR TWO-DIMENSIONAL SEMICONDUCTOR MATERIALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THERMAL ETCHING OF RUTHENIUM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FIELD SUPPRESSED METAL GAPFILL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TREATMENT LIQUID AND SUBSTRATE TREATMENT METHOD

METHOD OF REMOVING BARRIER LAYER

DEVICE COMPRISING AN ANODIC POROUS REGION SURROUNDED BY A TRENCH HA...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS FOR SEAMLESS GAP FILLING USING GRADIENT OXIDATION

METHODS FOR SEAMLESS GAP FILLING OF DIELECTRIC MATERIAL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE HAVING METAL CONTACT FEATURES

SEMICONDUCTOR DEVICE STRUCTURE WITH FINE CONDUCTIVE CONTACT AND MET...

MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSING

METHOD FOR TREATING OBJECT TO BE TREATED AND TREATMENT LIQUID

METHOD AND APPARATUS FOR CONTROLLING A SHAPE OF A PATTERN OVER A SU...