-
SEMICONDUCTOR PACKAGE
-
Publication number 20240153919
-
Publication date May 9, 2024
-
Samsung Electronics Co., LTD
-
Hyeonjeong KIM
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240128147
-
Publication date Apr 18, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Sey-Ping SUN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
-
Publication number 20240128216
-
Publication date Apr 18, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Hao-Lin Yang
-
H01 - BASIC ELECTRIC ELEMENTS
-
BONDED STRUCTURES
-
Publication number 20240120245
-
Publication date Apr 11, 2024
-
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
-
Rajesh Katkar
-
B81 - MICRO-STRUCTURAL TECHNOLOGY
-
CHIP STRUCTURE
-
Publication number 20240120277
-
Publication date Apr 11, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Hong-Seng SHUE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
PACKAGE FOR POWER ELECTRONICS
-
Publication number 20240105651
-
Publication date Mar 28, 2024
-
Wolfspeed, Inc.
-
Brice McPherson
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Fan-Out Package with Cavity Substrate
-
Publication number 20240105705
-
Publication date Mar 28, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Po-Hao Tsai
-
H01 - BASIC ELECTRIC ELEMENTS
-
INTERPOSER CIRCUIT
-
Publication number 20240094289
-
Publication date Mar 21, 2024
-
TEXAS INSTRUMENTS INCORPORATED
-
Lee D. Whetsel
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
TSV AS PAD
-
Publication number 20240088101
-
Publication date Mar 14, 2024
-
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
-
Guilian Gao
-
H01 - BASIC ELECTRIC ELEMENTS
-
SEMICONDUCTOR PACKAGE
-
Publication number 20240088108
-
Publication date Mar 14, 2024
-
Samsung Electronics Co., Ltd.
-
Joonghyun BAEK
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
CHIP PACKAGE STRUCTURE
-
Publication number 20240088090
-
Publication date Mar 14, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Ling-Wei LI
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240079362
-
Publication date Mar 7, 2024
-
SK HYNIX INC.
-
Jin Won PARK
-
H01 - BASIC ELECTRIC ELEMENTS
-
-