of a plurality of high density interconnect connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/25of a plurality of high density interconnect connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink with vertical heat path
- Patent number 11,929,299
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,908,783
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 11,901,296
- Issue date Feb 13, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead semiconductor device, and corresponding method of manu...
- Patent number 11,887,959
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,855,030
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structures for integrated circuit package
- Patent number 11,848,271
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,848,335
- Issue date Dec 19, 2023
- Samsung Display Co., Ltd.
- Won Sik Oh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240128250
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Seung Lyong BOK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240128237
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20240120283
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096837
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088085
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Structures for Integrated Circuit Package
- Publication number 20240079324
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240063163
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...
- Publication number 20240030174
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240021562
- Publication date Jan 18, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20240006367
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411230
- Publication date Dec 21, 2023
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230395572
- Publication date Dec 7, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS
- Publication number 20230387097
- Publication date Nov 30, 2023
- Apple Inc.
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
- Publication number 20230369303
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230369273
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-on-wafer Cascode HEMT Device
- Publication number 20230343693
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haw-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230335535
- Publication date Oct 19, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20230317665
- Publication date Oct 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA ELEMENT
- Publication number 20230317645
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES WITH POWER ELECTRONIC DEVICES AND THREE-DIME...
- Publication number 20230307406
- Publication date Sep 28, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290650
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230268321
- Publication date Aug 24, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of high density interconnect connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated system-in-package with radiation shielding

Encapsulated package including device dies connected via interconne...

3D semiconductor device and structure with metal layers

Fan-out package having a main die and a dummy die

Semiconductor package and manufacturing method thereof

Interconnect layout for semiconductor device

3D semiconductor device and structure with metal layers

Package stacking using chip to wafer bonding

High-power die heat sink

Semiconductor package and manufacturing method thereof

Die and package structure

High-power die heat sink with vertical heat path

3D semiconductor device and structure with metal layers

Wiring substrate, semiconductor package having the wiring substrate...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Die interconnect substrate, an electrical device and a method for f...

Semiconductor package and method of manufacturing the semiconductor...

Integrated fan-out package and manufacturing method thereof

Microelectronic device with embedded die substrate on interposer

Chip-on-lead semiconductor device, and corresponding method of manu...

Molded semiconductor package having a negative standoff

Semiconductor package structure and method of manufacturing the same

Asymmetric stackup structure for SoC package substrates

Package structure and method of manufacturing the same

Display device

Wafer chip scale packages with visible solder fillets

Redistribution layer structures for integrated circuit package

Display device

Semiconductor package and manufacturing method thereof

Semiconductor device package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

DISPLAY DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

INTERPOSERS FOR MICROELECTRONIC DEVICES

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Redistribution Layer Structures for Integrated Circuit Package

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS

IPD Modules with Flexible Connection Scheme in Packaging

PACKAGE STRUCTURE

Process Including a Re-etching Process for Forming a Semiconductor...

Wafer-on-wafer Cascode HEMT Device

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE WITH ANTENNA ELEMENT

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

ELECTRONICS ASSEMBLIES WITH POWER ELECTRONIC DEVICES AND THREE-DIME...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS