of an individual bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/05of an individual bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having photonic die and electronic die
- Patent number 12,368,147
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
- Patent number 12,368,144
- Issue date Jul 22, 2025
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 12,368,135
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,368,120
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded nanoparticles for on-die thermal enhancement of hybrid bon...
- Patent number 12,368,131
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a porous structure
- Patent number 12,362,290
- Issue date Jul 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,298
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,272
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,364,049
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for measuring a magnetic core layer profile in an integrate...
- Patent number 12,363,920
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- W. C. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 12,362,244
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,362,308
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Hao Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,362,329
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,362,291
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method for manufacturing imaging device
- Patent number 12,356,753
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone isolation capacitor
- Patent number 12,355,025
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239544
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250241056
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Karl GRANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239546
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250239549
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Pierre-Yves PICHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
- Publication number 20250239551
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURELESS SINTERING METHOD FOR THE CONNECTION OF ELECTRONIC COMP...
- Publication number 20250239566
- Publication date Jul 24, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Senthil Kumar BALASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250239215
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyun Joon KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...
- Publication number 20250239545
- Publication date Jul 24, 2025
- Honeywell International Inc.
- Bryan Roger Seppala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239547
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LIN...
- Publication number 20250239550
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250233090
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233112
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HsiaoYun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
- Publication number 20250233078
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20250233082
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20250233086
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...
- Publication number 20250233091
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having photonic die and electronic die

Embedded cooling systems for advanced device packaging and methods...

Driving backplane, transfer method for light-emitting diode chip, d...

Device bonding apparatus and method of manufacturing a package usin...

Display device, and tiled display device including the display device

Semiconductor package and method comprising formation of redistribu...

Semiconductor package

Semiconductor device and method

Embedded nanoparticles for on-die thermal enhancement of hybrid bon...

Bonding layer and process of making

Semiconductor structure with a porous structure

Semiconductor die package with ring structure

Semiconductor device and method of manufacture

Basin-shaped underbump plates and methods of forming the same

Semiconductor device and method of manufacture

Method of making a fan-out semiconductor assembly with an intermedi...

Method for fabricating a chip package

Semiconductor structure and manufacturing method thereof

Semiconductor device

Methods for measuring a magnetic core layer profile in an integrate...

Memory device including circuitry under bond pads

Electronic substrate and electronic device

Semiconductor package with ball grid array connection having improv...

Electronic device

Method of fabricating semiconductor package

Semiconductor device and method

Imaging device and method for manufacturing imaging device

Wafer structure including probe marked test pads

Semiconductor device and method for manufacturing the same

Standalone isolation capacitor

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

PRESSURELESS SINTERING METHOD FOR THE CONNECTION OF ELECTRONIC COMP...

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LIN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER ALIGNMENT MARK STRUCTURE

SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...