of an individual bump connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/16of an individual bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing stress in semiconductor chips
- Patent number 12,261,139
- Issue date Mar 25, 2025
- Ciena Corporation
- Jean-Sébastien Côté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 12,261,093
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold shelf package design and process flow for advanced package arc...
- Patent number 12,261,150
- Issue date Mar 25, 2025
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for on-circuit board de-embedding
- Patent number 12,259,430
- Issue date Mar 25, 2025
- Intel Corporation
- Bishnu Prasad Patra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,261,104
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,105
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,103
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,106
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal and connection method
- Patent number 12,261,138
- Issue date Mar 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jo Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver and manufacturing method thereof
- Patent number 12,253,729
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna chip packaging structure and method for preparing same
- Patent number 12,255,159
- Issue date Mar 18, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yayuan Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detection device
- Patent number 12,255,214
- Issue date Mar 18, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 12,255,149
- Issue date Mar 18, 2025
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device
- Patent number 12,254,949
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD WITH STIFFENER
- Publication number 20250106984
- Publication date Mar 27, 2025
- KYOCCERA CORPORATION
- Suguru KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER
- Publication number 20250105163
- Publication date Mar 27, 2025
- Global Unichip Corporation
- Liang-Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...
- Publication number 20250105194
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
- Publication number 20250105087
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Chunyan RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105088
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...
- Publication number 20250105160
- Publication date Mar 27, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250105192
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Tae Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
- Publication number 20250105207
- Publication date Mar 27, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105231
- Publication date Mar 27, 2025
- Samsung Electronics Co., LTD
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105236
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Publication number 20250106994
- Publication date Mar 27, 2025
- Intel Corporation
- Mukund AYALASOMAYAJULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250105188
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Paofa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250105224
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250105232
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Multichip Package
- Publication number 20250105238
- Publication date Mar 27, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105068
- Publication date Mar 27, 2025
- Siliconware Precision Industries Co., Ltd.
- Chuan-Shun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE CARRIER WITH EMBEDDED ELECTRONIC COMPONENT ELECTRICALLY CO...
- Publication number 20250105129
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Urban MEDIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250105130
- Publication date Mar 27, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL
- Publication number 20250105133
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20250105136
- Publication date Mar 27, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...
- Publication number 20250105156
- Publication date Mar 27, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS

of an individual bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages including antenna pattern

Managing stress in semiconductor chips

Semiconductor packages having a dam structure

Semiconductor package having an encapulant comprising conductive fi...

Mold shelf package design and process flow for advanced package arc...

Electronic device

Technologies for on-circuit board de-embedding

Semiconductor package and method of forming the same

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Semiconductor package

Terminal and connection method

Semiconductor device having package on package structure and method...

Circuit test structure and method of using

Semiconductor packages with an intermetallic layer

Trench contact structures for advanced integrated circuit structure...

Optical transceiver and manufacturing method thereof

Semiconductor package with riveting structure between two rings and...

Antenna chip packaging structure and method for preparing same

Stacked semiconductor device

Secure semiconductor integration and method for making thereof

Electronic substrate having an embedded etch stop to control cavity...

Light detection device

Electronic devices in semiconductor package cavities

Wire bond wires for interference shielding

Chip package structure

Semiconductor device and data transferring method for semiconductor...

Memory device

Patents Applicationslast 30 patents

WIRING BOARD WITH STIFFENER

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE

INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES

PACKAGE STRUCTURE

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE

3D Multichip Package

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

LAMINATE CARRIER WITH EMBEDDED ELECTRONIC COMPONENT ELECTRICALLY CO...

Electronic Device and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...