of an individual layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/29of an individual layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging stacking flip chip
- Patent number 12,293,984
- Issue date May 6, 2025
- Hebei Beixin Semiconductor Technology Co., Ltd.
- Honglei Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor, production method therefor, and semicon...
- Patent number 12,283,565
- Issue date Apr 22, 2025
- Toshiyasu Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alumina-based thermally conductive oxide and method for producing same
- Patent number 12,281,254
- Issue date Apr 22, 2025
- Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Akira Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method therefor
- Patent number 12,278,320
- Issue date Apr 15, 2025
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,278,218
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
- Patent number 12,278,206
- Issue date Apr 15, 2025
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-color LED display using ultra-thin LED element and method for...
- Patent number 12,266,740
- Issue date Apr 1, 2025
- Kookmin University Industry Academy Cooperation Foundation
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,262,605
- Issue date Mar 25, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining material, production method for joining material, and joine...
- Patent number 12,257,622
- Issue date Mar 25, 2025
- Senju Metal Industry Co., Ltd.
- Jinting Jiu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joined structure, joining method, and joining material
- Patent number 12,257,650
- Issue date Mar 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Kumakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and display panel
- Patent number 12,256,570
- Issue date Mar 18, 2025
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Yanxi Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
- Publication number 20250149493
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Dae Keun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149505
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149504
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20250149492
- Publication date May 8, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140686
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
- Publication number 20250140732
- Publication date May 1, 2025
- Resonac Corporation
- Tomoya MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
- Publication number 20250140639
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140721
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF
- Publication number 20250140437
- Publication date May 1, 2025
- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
- Yunhui Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR
- Publication number 20250140764
- Publication date May 1, 2025
- Linhai Qinghui Light Electricity Lamp Co., Ltd.
- Yongfu ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20250140670
- Publication date May 1, 2025
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20250132279
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
- Publication number 20250132163
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Raghuveer Satya MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132281
- Publication date Apr 24, 2025
- DENSO CORPORATION
- Nobuyuki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...
- Publication number 20250132283
- Publication date Apr 24, 2025
- Brewer Science, Inc.
- Xin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...
- Publication number 20250132280
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit package and method of forming same

Semiconductor packages and methods of forming same

Method for packaging stacking flip chip

Semiconductor device and method for manufacturing the same

Adhesive composition for semiconductor circuit connection, adhesive...

Adhesive for semiconductor, production method therefor, and semicon...

Method for manufacturing semiconductor device

Alumina-based thermally conductive oxide and method for producing same

Light emitting device and manufacturing method therefor

Method for producing nitride mesas each intended to form an electro...

Hybrid embedded packaging structure and manufacturing method thereof

Semiconductor device

Semiconductor package with conductive adhesive that overflows for r...

Thermal structure for semiconductor device and method of forming th...

Adhesive member, display device, and manufacturing method of displa...

Heat-dissipating structures for semiconductor devices and methods o...

Substrate bonding method

Full-color LED display using ultra-thin LED element and method for...

Flip chip package unit and associated packaging method

Semiconductor device and method for manufacturing the same

Display panel and display device

Joining material, production method for joining material, and joine...

Joined structure, joining method, and joining material

Semiconductor packages with an intermetallic layer

Display substrate and display panel

Bond pads for semiconductor die assemblies and associated methods a...

Electronic device with multi-layer contact and system

Wire bond wires for interference shielding

Semiconductor structure and manufacturing method thereof

Semiconductor device arrangement with compressible adhesive

Patents Applicationslast 30 patents

POWER MODULE AND POWER CONVERSION APPARATUS

INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS

SEMICONDUCTOR PACKAGE AND METHODS

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...

Integrated Circuit with Enhanced Thermal Dissipation Structure

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF

Semiconductor Device and Method of Forming Fan-Out Package Structur...

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR

SEMICONDUCTOR DEVICE

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

ELECTRONIC DEVICE

NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY

ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING

SEMICONDUCTOR DEVICE

VERSATILE DUAL-LAYER TEMPORARY WAFER BONDING FOR HARSH PROCESSING C...

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...