of an individual layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/29of an individual layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a layer stack, semiconductor arrangemen...
- Patent number 12,159,854
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a low brightness area
- Patent number 12,159,963
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 12,154,881
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising antenna and communication m...
- Patent number 12,154,870
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,154,884
- Issue date Nov 26, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,142,545
- Issue date Nov 12, 2024
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,652
- Issue date Nov 5, 2024
- Sumitomo Electric Industries, Ltd.
- Taku Horii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having lead frame with semiconductor die and...
- Patent number 12,125,771
- Issue date Oct 22, 2024
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME
- Publication number 20240424614
- Publication date Dec 26, 2024
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429148
- Publication date Dec 26, 2024
- Mitsubishi Electric Corporation
- Yuki YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421046
- Publication date Dec 19, 2024
- Kabushiki Kaisha Toshiba
- Yoshiki ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240421114
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...
- Publication number 20240413119
- Publication date Dec 12, 2024
- ZF Friedrichshafen AG
- Fabian Hohmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404971
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240404924
- Publication date Dec 5, 2024
- MEDIATEK INC.
- Tsung-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240404883
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY
- Publication number 20240395758
- Publication date Nov 28, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- MC Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395681
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240395658
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masashi WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Method for manufacturing display panel, display panel, and display...

Dicing die attach film, and semiconductor package using the same an...

Semiconductor chip structure

Lead frame for improving adhesive fillets on semiconductor die corners

Direct bonded copper substrates fabricated using silver sintering

Semiconductor device and temperature measurement method

Semiconductor device having a soldered joint with one or more inter...

Solder thermal interface material (STIM) with dopant

Semiconductor device with lead between a plurality of encapsulated...

Semiconductor device having a layer stack, semiconductor arrangemen...

Display apparatus including a low brightness area

Light emitting diode and display apparatus having the same

Seamless interconnect thresholds using dielectric fluid channels

Integrated circuit device having redistribution pattern

Semiconductor device package comprising antenna and communication m...

Semiconductor packaging method, semiconductor assembly and electron...

Power semiconductor package unit of surface mount technology includ...

Nested architectures for enhanced heterogeneous integration

Integrated fan-out package and the methods of manufacturing

Electronic package with interposer between integrated circuit dies

Semiconductor device

Bonding member, method for producing bonding member and method for...

Method of fabricating a semiconductor device

Bonding structures of integrated circuit devices and method forming...

Die on die bonding structure

Resin particles, electrically conductive particles, electrically co...

Semiconductor module with a first substrate, a second substrate and...

Semiconductor package having lead frame with semiconductor die and...

Bonded assembly containing different size opposing bonding pads and...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

CONTACT ASSEMBLY FOR POWER SEMICONDUCTOR CHIPS AND POWER ELECTRONIC...

SEMICONDUCTOR PACKAGE

LOW PRESSURE SINTERING POWDER

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SINTER BONDING SHEET

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

THICK-SILVER LAYER INTERFACE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

THROUGH-HOLE ELECTRODE SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE