of an individual layer connector

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CPC
H01L24/32

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/32of an individual layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and manufacturing method thereof
- Patent number 12,148,688
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 12,136,605
- Issue date Nov 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Biometric sensor module for a smart card and method for manufacturi...
- Patent number 12,131,987
- Issue date Oct 29, 2024
- Linxens Holding
- Christophe Mathieu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,980
- Issue date Oct 29, 2024
- Fuji Electric Co., Ltd.
- Toru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING DAM
- Publication number 20240387195
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240387347
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Tai-Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387389
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240387462
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBST...
- Publication number 20240384132
- Publication date Nov 21, 2024
- MITSUI CHEMICALS, INC.
- Yasuhisa KAYABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...
- Publication number 20240387501
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...
- Publication number 20240387785
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240387469
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE FOR DISPLAY AND LIGHT EMITTING PACKAGE HAVING...
- Publication number 20240387482
- Publication date Nov 21, 2024
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOTH-SURFACE COOLING SEMICONDUCTOR DEVICE
- Publication number 20240387313
- Publication date Nov 21, 2024
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS

of an individual layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Semiconductor device and method of manufacturing the same

Semiconductor substrate and manufacturing method thereof

Semiconductor package structure having interposer substrate, and st...

Light-emitting device and displayer

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Semiconductor device, power conversion apparatus, and manufacturing...

Memory device comprising programmable command-and-address and/or da...

Semiconductor device and method of manufacturing the same

Semiconductor package

Contact over active gate structures for advanced integrated circuit...

Integrated fan-out package and the methods of manufacturing

Electronic package with interposer between integrated circuit dies

Semiconductor device

Multi-chip package

Microelectronic assemblies

Method of fabricating a semiconductor device

Embedding methods for fine-pitch components and corresponding compo...

Bonding apparatus and bonding method

Layer structures for making direct metal-to-metal bonds at low temp...

System and method for integration of biological chips

Biometric sensor module for a smart card and method for manufacturi...

Power semiconductor apparatus

Heat sink, semiconductor package and semiconductor module

Bonding structures of integrated circuit devices and method forming...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor structure with heat dissipation structure and method...

Semiconductor package

Semiconductor module

Semiconductor device and method for manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

CHIP PACKAGE STRUCTURE WITH RING DAM

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

CIRCUIT BOARD

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF PACKAGE STRUCTURE

DIE ON DIE BONDING STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBST...

HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

DISPLAY DEVICE

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES

LIGHT EMITTING DEVICE FOR DISPLAY AND LIGHT EMITTING PACKAGE HAVING...

Fingerprint Sensor Device and Method

BOTH-SURFACE COOLING SEMICONDUCTOR DEVICE

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

SEMICONDUCTOR DEVICE

Semiconductor Package and Method of Manufacturing the Same

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME