of inorganic insulating material

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H05K3/0029

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0029of inorganic insulating material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a multi-layer for a probe card
- Patent number 12,019,111
- Issue date Jun 25, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable electrical connecting device
- Patent number 11,785,716
- Issue date Oct 10, 2023
- Albert-Ludwigs-Universitat Freiburg
- Patrick Kiele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for producing holes in an interposer
- Patent number 11,744,015
- Issue date Aug 29, 2023
- Schott AG
- Oliver Jackl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for introducing at least one cutout or aperture into a sheet...
- Patent number 11,610,784
- Issue date Mar 21, 2023
- LPKF LASER & ELECTRONICS SE
- Norbert Ambrosius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Inter-layer slot for increasing printed circuit board power perform...
- Patent number 11,439,002
- Issue date Sep 6, 2022
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-metal substrate with low amorphous phase
- Patent number 11,430,741
- Issue date Aug 30, 2022
- Heraeus Deutschland GmbH & Co. KG
- Alexander Rogg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having through via and method of fabricating the same
- Patent number 11,406,022
- Issue date Aug 2, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser cutting of metal-ceramic substrates
- Patent number 11,383,321
- Issue date Jul 12, 2022
- Heraeus Deutschland GmbH & Co. KG
- Alexander Rogg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,322,417
- Issue date May 3, 2022
- Kyocera Corporation
- Tsuyoshi Sunada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,234,324
- Issue date Jan 25, 2022
- Unimicron Technology Corp.
- Ping-Che Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing composite circuit board and composite circu...
- Patent number 11,191,168
- Issue date Nov 30, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 10,945,338
- Issue date Mar 9, 2021
- Kyocera Corporation
- Yoshitomo Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,903,577
- Issue date Jan 26, 2021
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for metallizing a component
- Patent number 10,808,330
- Issue date Oct 20, 2020
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Markus Glatthaar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing ceramic-metal layer assembly, method for m...
- Patent number 10,806,028
- Issue date Oct 13, 2020
- Mitsubishi Materials Corporation
- Koya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...
- Publication number 20250240871
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Deborah COGONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR AND METHOD OF MANUFACTURING A WORKPIECE LAYER AND A COVE...
- Publication number 20250168992
- Publication date May 22, 2025
- Manaflex, LLC
- Robert C. Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20240040704
- Publication date Feb 1, 2024
- VIA MECHANICS, LTD.
- Yasushi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20230292435
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
- Publication number 20230209727
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chang Ho SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising at Least Two Components
- Publication number 20220287181
- Publication date Sep 8, 2022
- AT&S (Chongqing) Company Limited
- Dominik WILDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A RECESS OR OPENING INTO A PLANAR WORKPIECE USING...
- Publication number 20220223434
- Publication date Jul 14, 2022
- LPKF Laser & Electronics AG
- Norbert Ambrosius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING THROUGH VIA AND METHOD OF FABRICATING THE SAME
- Publication number 20220141961
- Publication date May 5, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rogowski Coil Integrated in Glass Substrate
- Publication number 20220132677
- Publication date Apr 28, 2022
- Alexander Breymesser
- G01 - MEASURING TESTING
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD
- Publication number 20220030723
- Publication date Jan 27, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20210298172
- Publication date Sep 23, 2021
- Toppan Printing Co.,Ltd.
- Jun ONOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD AND COMPOSITE CIRCU...
- Publication number 20210282273
- Publication date Sep 9, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Implantable Electrical Connecting Device
- Publication number 20210274654
- Publication date Sep 2, 2021
- Albert-Ludwigs-Universitat Freiburg
- Patrick Kiele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20210243896
- Publication date Aug 5, 2021
- TRANSLARITY, INC.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORM...
- Publication number 20210127479
- Publication date Apr 29, 2021
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200154574
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hye-Jin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANU...
- Publication number 20200107448
- Publication date Apr 2, 2020
- Kyocera Corporation
- Yoshitomo ONITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-METAL SUBSTRATE WITH LOW AMORPHOUS PHASE
- Publication number 20200098696
- Publication date Mar 26, 2020
- Heraeus Deutschland GmbH & Co. KG
- Alexander ROGG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD
- Publication number 20200072873
- Publication date Mar 5, 2020
- Technoprobe S.p.A.
- Roberto CRIPPA
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20200077526
- Publication date Mar 5, 2020
- Nichia Corporation.
- Rie MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

of inorganic insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board, semiconductor device, and method of manufacturing wir...

Circuit board

Hermetic metallized via with improved reliability

Component carrier comprising at least two components

Manufacturing method of a multi-layer for a probe card

Redistribution plate

Rogowski coil integrated in glass substrate

Implantable electrical connecting device

Interposer and method for producing holes in an interposer

Method of manufacturing composite circuit board

Adapter board and method for making adapter board

Method of fabricating a glass substrate with a plurality of vias

Method for introducing at least one cutout or aperture into a sheet...

Redistribution plate

Inter-layer slot for increasing printed circuit board power perform...

Ceramic-metal substrate with low amorphous phase

Substrate having through via and method of fabricating the same

Laser cutting of metal-ceramic substrates

Wiring board

Filling materials and methods of filling through holes of a substrate

Circuit board structure and manufacturing method thereof

Method of manufacturing the printed board

Hermetic metallized via with improved reliability

Method of manufacturing composite circuit board and composite circu...

Hermetic metallized via with improved reliability

Wiring board manufacturing method and wiring board

Wiring substrate

Printed wiring board

Process for metallizing a component

Method for manufacturing ceramic-metal layer assembly, method for m...

Patents Applicationslast 30 patents

DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

SYSTEM FOR AND METHOD OF MANUFACTURING A WORKPIECE LAYER AND A COVE...

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

METHOD OF FORMING A PACKAGE SUBSTRATE

METHOD OF PROCESSING SUBSTRATE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

REDISTRIBUTION PLATE

Component Carrier With Different Stack Heights and Vertical Opening...

Component Carrier Comprising at Least Two Components

METHOD FOR MAKING A RECESS OR OPENING INTO A PLANAR WORKPIECE USING...

SUBSTRATE HAVING THROUGH VIA AND METHOD OF FABRICATING THE SAME

Rogowski Coil Integrated in Glass Substrate

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD

CIRCUIT BOARD

METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD AND COMPOSITE CIRCU...

Implantable Electrical Connecting Device

REDISTRIBUTION PLATE

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORM...

PRINTED CIRCUIT BOARD

MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANU...

CERAMIC-METAL SUBSTRATE WITH LOW AMORPHOUS PHASE

MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD