of memory regions comprising at least one cell select transistor

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H01L27/11529

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/11529of memory regions comprising at least one cell select transistor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 11,676,917
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense line structures in capacitive sense NAND memory
- Patent number 11,670,379
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies
- Patent number 11,658,132
- Issue date May 23, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with multiple tiers, and methods
- Patent number 11,653,497
- Issue date May 16, 2023
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical memory devices with bending prevention layers
- Patent number 11,652,068
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Sunil Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell pillar including source junction plug
- Patent number 11,653,494
- Issue date May 16, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device, measuring method, and semiconductor storage device
- Patent number 11,646,211
- Issue date May 9, 2023
- Kioxia Corporation
- Hiroyuki Tanizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,646,265
- Issue date May 9, 2023
- SK hynix Inc.
- Dong Hyuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having composite dielectric film struct...
- Patent number 11,637,046
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing auxiliary support pillar...
- Patent number 11,637,119
- Issue date Apr 25, 2023
- SanDisk Technologies LLC
- Kohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor devices
- Patent number 11,637,120
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Manjoong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including trench-isolated memory pl...
- Patent number 11,631,690
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,626,380
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Hyunjun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices having a source stru...
- Patent number 11,616,078
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Jongseon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including stack structure with flat region
- Patent number 11,616,021
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Seungjun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for writing in a non-volatile memory according to the ageing...
- Patent number 11,615,857
- Issue date Mar 28, 2023
- STMicroelectronics S.r.l.
- Francesco La Rosa
- G11 - INFORMATION STORAGE
Information Patent Grant
3D NAND memory device and method of forming the same
- Patent number 11,616,077
- Issue date Mar 28, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jin Yong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,610,907
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 11,610,842
- Issue date Mar 21, 2023
- Macronix International Co., Ltd.
- Ching Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having interposer structure with adhesive pol...
- Patent number 11,605,593
- Issue date Mar 14, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to produce 3D semiconductor devices and structures with memory
- Patent number 11,600,667
- Issue date Mar 7, 2023
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device and electronic system...
- Patent number 11,600,609
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Jungtae Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having composite dielectric film struct...
- Patent number 11,600,543
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bump stack structures an...
- Patent number 11,600,635
- Issue date Mar 7, 2023
- SanDisk Technologies LLC
- Yosuke Takahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,587,868
- Issue date Feb 21, 2023
- Kioxia Corporation
- Koji Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,581,331
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hyo Joon Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105622
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105623
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NAND WITH BACKSIDE STACKING
- Publication number 20240099011
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE TRANSISTOR DEVICE AND METHOD
- Publication number 20240064987
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Toshihiko Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240055353
- Publication date Feb 15, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL ETCH STOPS FOR ACCESS LINE FORMATION IN A MEMORY DIE
- Publication number 20240040787
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES, SYSTEMS, AND METHODS FOR FORMING...
- Publication number 20240040789
- Publication date Feb 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wenshan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DIE HAVING A UNIQUE STORAGE CAPACITY
- Publication number 20240029789
- Publication date Jan 25, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20240021521
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20240021219
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...
- Publication number 20230411306
- Publication date Dec 21, 2023
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...
- Publication number 20230395509
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELE...
- Publication number 20230387023
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURE FOR PREVENTING ETCHING TO CONTROL CIRCUITRY
- Publication number 20230380172
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- John Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...
- Publication number 20230345722
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20230343696
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN MEMORY DEVICES
- Publication number 20230337421
- Publication date Oct 19, 2023
- Macronix International Co., Ltd.
- Jung-Chuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE RESISTOR ARRAY OF SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230328977
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Ansoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20230317607
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jungtae SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20230309307
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230307359
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Tadayoshi WATANABE
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING SUPPORT STRUCTURES AND CONTACT STRUCTURES H...
- Publication number 20230290739
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20230292503
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Takahiro SUGIMOTO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH MEMORY CELLS, HIGH VO...
- Publication number 20230262975
- Publication date Aug 17, 2023
- Silicon Storage Technology, Inc.
- Zhuoqiang Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230253465
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM IN...
- Publication number 20230247834
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Soyeong AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM IN...
- Publication number 20230247835
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- JAERYONG SIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230238322
- Publication date Jul 27, 2023
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20230230937
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Hyunuk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20230223345
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sangsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS

of memory regions comprising at least one cell select transistor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Three-dimensional semiconductor memory device

Active protection circuits for semiconductor devices

Sense line structures in capacitive sense NAND memory

Integrated assemblies

Semiconductor apparatus with multiple tiers, and methods

Vertical memory devices with bending prevention layers

Memory cell pillar including source junction plug

Measuring device, measuring method, and semiconductor storage device

Semiconductor device

Semiconductor memory device having composite dielectric film struct...

Three-dimensional memory device containing auxiliary support pillar...

Vertical semiconductor devices

Three-dimensional memory device including trench-isolated memory pl...

Semiconductor package

Three-dimensional semiconductor memory devices having a source stru...

Semiconductor device including stack structure with flat region

3D semiconductor memory device and structure

Method for writing in a non-volatile memory according to the ageing...

3D NAND memory device and method of forming the same

Method for producing a 3D semiconductor device and structure with s...

Memory device and manufacturing method thereof

Memory device and method of manufacturing the same

Semiconductor devices having interposer structure with adhesive pol...

Method to produce 3D semiconductor devices and structures with memory

Three-dimensional semiconductor memory device and electronic system...

Semiconductor memory device having composite dielectric film struct...

Three-dimensional memory device containing bump stack structures an...

Semiconductor memory device

Semiconductor memory device and method of fabricating the same

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

VERTICAL NAND WITH BACKSIDE STACKING

SILICIDE TRANSISTOR DEVICE AND METHOD

CONTACT STRUCTURE AND METHOD OF FORMING THE SAME

LATERAL ETCH STOPS FOR ACCESS LINE FORMATION IN A MEMORY DIE

THREE-DIMENSIONAL MEMORY DEVICES, SYSTEMS, AND METHODS FOR FORMING...

MEMORY DIE HAVING A UNIQUE STORAGE CAPACITY

STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DEFORMATION RESISTANT TR...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...

MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELE...

BARRIER STRUCTURE FOR PREVENTING ETCHING TO CONTROL CIRCUITRY

MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

CAPACITORS IN MEMORY DEVICES

ACTIVE RESISTOR ARRAY OF SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

SEMICONDUCTOR MEMORY DEVICE

MEMORY DEVICE INCLUDING SUPPORT STRUCTURES AND CONTACT STRUCTURES H...

SEMICONDUCTOR INTEGRATED CIRCUIT

METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH MEMORY CELLS, HIGH VO...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM IN...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM IN...

THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME