of preperforated insulating layer

Industry

CPC
H05K2203/063

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/063of preperforated insulating layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe substrate having modulator and crack inhibiting structure...
- Patent number 11,291,146
- Issue date Mar 29, 2022
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic card with printed circuit comprising an antenna with int...
- Patent number 11,177,139
- Issue date Nov 16, 2021
- INSTITUT VEDECOM
- Friedbald Kiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with two component carrier portions and a compone...
- Patent number 11,058,007
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive board
- Patent number 11,044,817
- Issue date Jun 22, 2021
- Polytronics Technology Corp.
- Kuo-Hsun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 11,022,854
- Issue date Jun 1, 2021
- E Ink Corporation
- Matthew Joseph Kayal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for laser welding layers of circuitry pattern in the reel-t...
- Patent number 10,993,334
- Issue date Apr 27, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an LED device
- Patent number 10,985,303
- Issue date Apr 20, 2021
- Lumileds LLC
- Robert Derix
- G02 - OPTICS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 10,798,823
- Issue date Oct 6, 2020
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with heat sink
- Patent number 10,785,864
- Issue date Sep 22, 2020
- Amazon Technologies, Inc.
- William Mische
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic module
- Patent number 10,765,006
- Issue date Sep 1, 2020
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional modeling apparatus, three-dimensional modeling me...
- Patent number 10,744,710
- Issue date Aug 18, 2020
- Seiko Epson Corporation
- Masaya Ishida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical component, component arrangement, and a method for produ...
- Patent number 10,667,400
- Issue date May 26, 2020
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Patent number 10,602,606
- Issue date Mar 24, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optic display with measurement aperture
- Patent number 10,466,564
- Issue date Nov 5, 2019
- E Ink Corporation
- Matthew Joseph Kayal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board, method for manufacturing wiring board, and method for...
- Patent number 10,448,505
- Issue date Oct 15, 2019
- NGK Spark Plug Co., Ltd.
- Kazushige Akita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having electrical isolator and moisture inhibiting cap...
- Patent number 10,420,204
- Issue date Sep 17, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having isolator and bridging element and method of mak...
- Patent number 10,361,151
- Issue date Jul 23, 2019
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a liquid crystal polymer solder mask and r...
- Patent number 10,342,126
- Issue date Jul 2, 2019
- Harris Corporation
- Louis Joseph Rendek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Image pickup element mounting substrate and image pickup device
- Patent number 10,319,759
- Issue date Jun 11, 2019
- Kyocera Corporation
- Takuji Okamura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...
- Publication number 20210289678
- Publication date Sep 16, 2021
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20210059056
- Publication date Feb 25, 2021
- POLYTRONICS TECHNOLOGY CORP.
- Kuo-Hsun CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...
- Publication number 20200258805
- Publication date Aug 13, 2020
- Denso Corporation
- Tomohiro YOKOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER
- Publication number 20200146192
- Publication date May 7, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming a Top Plane Connection in an Electro-Optic Device
- Publication number 20200064705
- Publication date Feb 27, 2020
- E INK CORPORATION
- Matthew Joseph KAYAL
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC CARD WITH PRINTED CIRCUIT COMPRISING AN ANTENNA WITH INT...
- Publication number 20190371622
- Publication date Dec 5, 2019
- INSTITUT VEDECOM
- Friedbald KIEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...
- Publication number 20190182997
- Publication date Jun 13, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module
- Publication number 20180376597
- Publication date Dec 27, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR IN...
- Publication number 20180263146
- Publication date Sep 13, 2018
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor-Structure Element Having an Internal Layer Substrate Lami...
- Publication number 20180242456
- Publication date Aug 23, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Publication number 20180220526
- Publication date Aug 2, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING APPARATUS
- Publication number 20180162111
- Publication date Jun 14, 2018
- Nikko Materials Co., Ltd.
- Kazutoshi IWATA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20180070435
- Publication date Mar 8, 2018
- Murata Manufacturing Co., Ltd.
- Hirofumi SHINAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20170339785
- Publication date Nov 23, 2017
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE
- Publication number 20160044798
- Publication date Feb 11, 2016
- MURATA MANUFACTURING CO., LTD.
- Masaki KAWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Printed Circuit Board with MultiLayer Sub-Ar...
- Publication number 20160007450
- Publication date Jan 7, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Alexander Kasper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Embedded Substrate and Manufacturing Method of Device Embedd...
- Publication number 20150327369
- Publication date Nov 12, 2015
- Meiko Electronics Co., Ltd.
- Yasuaki Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, MULTILAYER INSULATIO...
- Publication number 20150257277
- Publication date Sep 10, 2015
- Sekisui Chemical Co., Ltd
- Kazutaka Shirahase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...
- Publication number 20150245467
- Publication date Aug 27, 2015
- MOTOROLA SOLUTIONS, INC.
- KHAI LOKE LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME
- Publication number 20140376224
- Publication date Dec 25, 2014
- 3M Innovative Properties Company
- Ellen O. Aeling
- F21 - LIGHTING
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140361470
- Publication date Dec 11, 2014
- Yuichi IIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20140353018
- Publication date Dec 4, 2014
- Hitachi, Ltd
- Akira SOEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ELECTRORHEOLOGICAL FLUID VALVE
- Publication number 20140319390
- Publication date Oct 30, 2014
- BOSTON DYNAMICS, INC.
- Marc Strauss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20140321089
- Publication date Oct 30, 2014
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140311773
- Publication date Oct 23, 2014
- FUJIKURA LTD.
- Nobuki Ueta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME
- Publication number 20140293602
- Publication date Oct 2, 2014
- 3M Innovative Properties Company
- Ellen O. Aeling
- F21 - LIGHTING

of preperforated insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a top plane connection in an electro-optic device

Circuit board structure and method for manufacturing a circuit boar...

Method for manufacturing an electronic module and electronic module

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Leadframe substrate having modulator and crack inhibiting structure...

Electronic card with printed circuit comprising an antenna with int...

Circuit board structure and method for manufacturing a circuit boar...

Electronic module

Component carrier with two component carrier portions and a compone...

Thermally conductive board

Method of forming a top plane connection in an electro-optic device

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Methods for laser welding layers of circuitry pattern in the reel-t...

Method of making an LED device

Method for manufacturing an electronic module and electronic module

Printed circuit board with heat sink

Electronic module

Three-dimensional modeling apparatus, three-dimensional modeling me...

Electrical component, component arrangement, and a method for produ...

Electronics package having a self-aligning interconnect assembly an...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

Conductor-structure element having an internal layer substrate lami...

Electro-optic display with measurement aperture

Wiring board, method for manufacturing wiring board, and method for...

Wiring board having electrical isolator and moisture inhibiting cap...

Wiring board having isolator and bridging element and method of mak...

Electronic device having a liquid crystal polymer solder mask and r...

Image pickup element mounting substrate and image pickup device

Patents Applicationslast 30 patents

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

WIRING SUBSTRATE

INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication

THERMALLY CONDUCTIVE BOARD

ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...

SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER

Method of Forming a Top Plane Connection in an Electro-Optic Device

ELECTRONIC CARD WITH PRINTED CIRCUIT COMPRISING AN ANTENNA WITH INT...

LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...

Electronic module

METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR IN...

Conductor-Structure Element Having an Internal Layer Substrate Lami...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

LAMINATING APPARATUS

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE

Method for Producing a Printed Circuit Board with MultiLayer Sub-Ar...

Device Embedded Substrate and Manufacturing Method of Device Embedd...

METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, MULTILAYER INSULATIO...

APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...

ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME

MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME

INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...

PRINTED CIRCUIT BOARD ELECTRORHEOLOGICAL FLUID VALVE

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME