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Plating for thermal management
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Patent number 12,068,221
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Issue date Aug 20, 2024
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Texas Instruments Incorporated
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Nazila Dadvand
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Reactor for electrochemical deposition
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Patent number 12,049,704
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Issue date Jul 30, 2024
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FABRIC8LABS, INC.
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David Forrest Pain
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Terminal material for connectors
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Patent number 11,901,659
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Issue date Feb 13, 2024
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Mitsubishi Materials Corporation
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Yoshie Tarutani
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C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
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Terminal material for connector
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Patent number 11,761,109
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Issue date Sep 19, 2023
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Mitsubishi Materials Corporation
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Yoshie Tarutani
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Terminal material for connectors
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Patent number 11,721,923
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Issue date Aug 8, 2023
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Mitsubishi Materials Corporation
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Yoshie Tarutani
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Silver article
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Patent number 11,655,522
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Issue date May 23, 2023
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MISTY COLLECTION Co., LTD.
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Masami Munakata
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Fabrication of dendritic structures and tags
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Patent number 11,598,015
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Issue date Mar 7, 2023
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Arizona Board of Regents on behalf of Arizona State University
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Michael N. Kozicki
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Electrochemical layer deposition
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Patent number 11,591,705
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Issue date Feb 28, 2023
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FABRIC8LABS, INC.
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David Forrest Pain
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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