of thick-film circuits or parts thereof

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/705of thick-film circuits or parts thereof

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ultralong time constant time measurement device and fabr...
- Patent number 11,721,646
- Issue date Aug 8, 2023
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folding frame and foldable display
- Patent number 11,609,605
- Issue date Mar 21, 2023
- LG Display Co., Ltd.
- Eunah Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,527,525
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,177,395
- Issue date Nov 16, 2021
- Renesas Electronics Corporation
- Eisuke Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with inductors having electrically split scribe...
- Patent number 10,957,655
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreeram Subramanyam Nasum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ultralong time constant time measurement device and fabr...
- Patent number 10,937,746
- Issue date Mar 2, 2021
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,916,449
- Issue date Feb 9, 2021
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 10,861,841
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array overlapped by on-chip inductor/transformer
- Patent number 10,643,985
- Issue date May 5, 2020
- QUALCOMM Incorporated
- Haitao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed-mode direct-write laser metallization
- Patent number 10,622,244
- Issue date Apr 14, 2020
- Orbotech Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,536
- Issue date Feb 25, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste comprising a silicone oil
- Patent number 10,453,974
- Issue date Oct 22, 2019
- BASF SE
- Markus Fiess
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,236,187
- Issue date Mar 19, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic core inductor chip and method of making the same
- Patent number 10,181,378
- Issue date Jan 15, 2019
- Wafer Mems Co., Ltd.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,115,604
- Issue date Oct 30, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,673,139
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshige Hirano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for manufacturing an integrated circuit
- Patent number 9,305,821
- Issue date Apr 5, 2016
- Koninklijke Philips N.V.
- Willem-jan A. De Wijs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming thick film pattern and material for forming thick...
- Patent number 6,113,836
- Issue date Sep 5, 2000
- Dai Nippon Insatsu Kabushiki Kaisha
- Yorihiko Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming thick film pattern and material for forming thick...
- Patent number 5,814,267
- Issue date Sep 29, 1998
- Dai Nippon Insatsu Kabushiki Kaisha
- Yorihiko Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of producing thick multi-layer substrates
- Patent number 5,593,722
- Issue date Jan 14, 1997
- Nippondenso Co., Ltd.
- Yuji Otani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thick film pattern and material for forming thick...
- Patent number 5,580,511
- Issue date Dec 3, 1996
- Dai Nippon Insatsu Kabushiki Kaisha
- Yorihiko Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Single atmosphere for firing compatible thick film material
- Patent number 5,302,412
- Issue date Apr 12, 1994
- The BOC Group, Inc.
- Satish S. Tamhankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a MMIC hybrid device and a transceiver fabr...
- Patent number 5,239,685
- Issue date Aug 24, 1993
- QUALCOMM Incorporated
- Douglas H. Moe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Intermediate product for use in the production of thick-film circuits
- Patent number 5,206,624
- Issue date Apr 27, 1993
- Ford Motor Company
- Daxesh K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic part
- Patent number 5,157,582
- Issue date Oct 20, 1992
- Murata Manufacturing Co., Ltd.
- Yoshihiro Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for laser scribing substrates
- Patent number 5,116,641
- Issue date May 26, 1992
- Ford Motor Company
- Daxesh K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier for thin film hybrid circuits
- Patent number 5,041,191
- Issue date Aug 20, 1991
- Rockwell International Corporation
- James C. Watson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing thick film circuit board device
- Patent number 4,991,284
- Issue date Feb 12, 1991
- Kabushiki Kaisha Toshiba
- Shiro Ezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacture of copper thick-film conductors using a...
- Patent number 4,965,092
- Issue date Oct 23, 1990
- Edward A. Hayduk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...
- Publication number 20230326883
- Publication date Oct 12, 2023
- STMicroelectronics (Rousset) SAS
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
- Publication number 20230110420
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220310582
- Publication date Sep 29, 2022
- Kabushiki Kaisha Toshiba
- Susumu OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...
- Publication number 20210151392
- Publication date May 20, 2021
- STMicroelectronics (Rousset) SAS
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Multiple Polarity Groups
- Publication number 20210091065
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folding Frame and Foldable Display
- Publication number 20210064083
- Publication date Mar 4, 2021
- LG Display Co., Ltd.
- Eunah SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200294985
- Publication date Sep 17, 2020
- RENESAS ELECTRONICS CORPORATION
- Eisuke KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTORS HAVING ELECTRICALLY SPLIT SCRIBE...
- Publication number 20200185336
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreeram Subramanyam Nasum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
- Publication number 20200105738
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...
- Publication number 20200075506
- Publication date Mar 5, 2020
- STMicroelectronics (Rousset) SAS
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRAY OVERLAPPED BY ON-CHIP INDUCTOR/TRANSFORMER
- Publication number 20190189608
- Publication date Jun 20, 2019
- QUALCOMM Incorporated
- Haitao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20190164780
- Publication date May 30, 2019
- MEDIA TEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterned Wafer and Method of Making the Same
- Publication number 20180033675
- Publication date Feb 1, 2018
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED-MODE DIRECT-WRITE LASER METALLIZATION
- Publication number 20170178946
- Publication date Jun 22, 2017
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterned Wafer and Method of Making the Same
- Publication number 20160379969
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160268184
- Publication date Sep 15, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- HIROSHIGE HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT
- Publication number 20140206150
- Publication date Jul 24, 2014
- Koninklijke Philips N.V.
- Willem-jan A. De Wijs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT
- Publication number 20120009782
- Publication date Jan 12, 2012
- Koninklijke Philips Electronics N.V.
- Willem-Jan A. De Wijs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

of thick-film circuits or parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with multiple polarity groups

Integrated ultralong time constant time measurement device and fabr...

Folding frame and foldable display

Semiconductor device with multiple polarity groups

Semiconductor device and method of manufacturing the same

Integrated circuit with inductors having electrically split scribe...

Integrated ultralong time constant time measurement device and fabr...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor device with multiple polarity groups

Capacitor array overlapped by on-chip inductor/transformer

Pulsed-mode direct-write laser metallization

Semiconductor package and method for fabricating base for semicondu...

Conductive paste comprising a silicone oil

Semiconductor package and method for fabricating base for semicondu...

Magnetic core inductor chip and method of making the same

Semiconductor package and method for fabricating base for semicondu...

Semiconductor device

Apparatus and method for manufacturing an integrated circuit

Method of forming thick film pattern and material for forming thick...

Method of forming thick film pattern and material for forming thick...

Method of producing thick multi-layer substrates

Method of forming thick film pattern and material for forming thick...

Single atmosphere for firing compatible thick film material

Process for fabricating a MMIC hybrid device and a transceiver fabr...

Intermediate product for use in the production of thick-film circuits

Composite electronic part

Method for laser scribing substrates

Diffusion barrier for thin film hybrid circuits

Method for manufacturing thick film circuit board device

Process for the manufacture of copper thick-film conductors using a...

Patents Applicationslast 30 patents

INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...

SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS

SEMICONDUCTOR DEVICE

INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...

Semiconductor Device with Multiple Polarity Groups

Folding Frame and Foldable Display

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT WITH INDUCTORS HAVING ELECTRICALLY SPLIT SCRIBE...

SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS

INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABR...

CAPACITOR ARRAY OVERLAPPED BY ON-CHIP INDUCTOR/TRANSFORMER

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

Patterned Wafer and Method of Making the Same

PULSED-MODE DIRECT-WRITE LASER METALLIZATION

Patterned Wafer and Method of Making the Same

SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT

APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT