of thin-film circuits or parts thereof

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H01L21/707

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/707of thin-film circuits or parts thereof

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including capacitor and resistor
- Patent number 12,183,670
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of display with color conversion layer and isolation walls
- Patent number 12,033,887
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a capacitive structure of the metal-in...
- Patent number 12,021,074
- Issue date Jun 25, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, electronic device, and method of manufactu...
- Patent number 11,942,467
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film based passive devices and methods of forming the same
- Patent number 11,942,415
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Handoko Linewih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with color conversion layer and isolation walls
- Patent number 11,888,093
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming integrated inductor-capacitor oscillators an...
- Patent number 11,804,803
- Issue date Oct 31, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 11,776,947
- Issue date Oct 3, 2023
- TDK Corporation
- Yusuke Oba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short-wave infrared focal plane arrays, and methods for utilization...
- Patent number 11,757,060
- Issue date Sep 12, 2023
- TriEye Ltd.
- Uriel Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a resistor layer partially overlapping en...
- Patent number 11,742,262
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Tai Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dose implantation for ultrathin semiconductor-on-insulator sub...
- Patent number 11,699,757
- Issue date Jul 11, 2023
- STMicroelectronics, Inc.
- Jocelyne Gimbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor and resistor
- Patent number 11,587,865
- Issue date Feb 21, 2023
- SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On integrated circuit (IC) device simultaneously formed capacitor a...
- Patent number 11,244,850
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods of forming integrated circuits
- Patent number 11,164,858
- Issue date Nov 2, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,164,809
- Issue date Nov 2, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ curing of color conversion layer
- Patent number 11,094,530
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,018,075
- Issue date May 25, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a thin film resistor with ends overlapped...
- Patent number 10,985,090
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Tai Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for forming a thin film resistor integrated in...
- Patent number 10,763,324
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Paul Fest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable charge storage arrays and associated manufacturing dev...
- Patent number 10,689,754
- Issue date Jun 23, 2020
- Peter C. Salmon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
IC with ion milled thin-film resistors
- Patent number 10,680,056
- Issue date Jun 9, 2020
- Texas Instruments Incorporated
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer integrated circuit package
- Patent number 10,553,475
- Issue date Feb 4, 2020
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display apparatus having the sam...
- Patent number 10,475,822
- Issue date Nov 12, 2019
- BOE Technology Group Co., Ltd.
- Zhuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors in integrated circuits and methods of fabrication thereof
- Patent number 10,446,534
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Michael Roehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) inductive signal coupler and method therefor
- Patent number 10,438,906
- Issue date Oct 8, 2019
- NXP USA, INC.
- Joseph Staudinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor comprising light shielding layers, array subst...
- Patent number 10,396,209
- Issue date Aug 27, 2019
- BOE Technology Group Co., Ltd.
- Hongda Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing thin film transistor, dehydrogenating appar...
- Patent number 10,325,928
- Issue date Jun 18, 2019
- LG Display Co., Ltd.
- Sung soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable charge storage arrays and associated manufacturing dev...
- Patent number 10,312,319
- Issue date Jun 4, 2019
- Peter C. Salmon
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing ceramic package substrate with copper-plated dam
- Patent number 10,297,498
- Issue date May 21, 2019
- DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD.
- Zhaohui Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY OF DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS
- Publication number 20240363392
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPARATUS MANUFACTURING METH...
- Publication number 20240355668
- Publication date Oct 24, 2024
- Canon Medical Systems Corporation
- Tatsuya SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...
- Publication number 20240312977
- Publication date Sep 19, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20240194663
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- I-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS
- Publication number 20230352632
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DOSE IMPLANTATION FOR ULTRATHIN SEMICONDUCTOR-ON-INSULATOR SUB...
- Publication number 20230299202
- Publication date Sep 21, 2023
- STMicroelectronics, Inc.
- JOCELYNE GIMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT
- Publication number 20230223274
- Publication date Jul 13, 2023
- CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
- Marc L. Tarabbia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT-WAVE INFRARED FOCAL PLANE ARRAYS, AND METHODS FOR UTILIZATION...
- Publication number 20230187570
- Publication date Jun 15, 2023
- TriEye Ltd.
- Uriel Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING
- Publication number 20230125974
- Publication date Apr 27, 2023
- Murata Manufacturing Co., Ltd.
- Julien EL SABAHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURI...
- Publication number 20230070790
- Publication date Mar 9, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiyuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES
- Publication number 20220415703
- Publication date Dec 29, 2022
- STMicroelectronics S.r.l.
- Mikel AZPEITIA URQUIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20220406768
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- I-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20220392837
- Publication date Dec 8, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Handoko LINEWIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...
- Publication number 20220375856
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR
- Publication number 20220359384
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...
- Publication number 20220139899
- Publication date May 5, 2022
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR
- Publication number 20210391253
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS
- Publication number 20210358742
- Publication date Nov 18, 2021
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS
- Publication number 20210351105
- Publication date Nov 11, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RC ARCHITECTURE, AND METHODS OF FABRICATION THEREOF
- Publication number 20210327867
- Publication date Oct 21, 2021
- Murata Manufacturing Co., Ltd.
- Stéphane Bouvier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20210305231
- Publication date Sep 30, 2021
- TDK Corporation
- Yusuke OBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS
- Publication number 20210288042
- Publication date Sep 16, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Manufacturing and Method Thereof
- Publication number 20210242109
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Tai TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING INTEGRATED INDUCTOR-CAPACITOR OSCILLATORS AN...
- Publication number 20210218365
- Publication date Jul 15, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...
- Publication number 20210151345
- Publication date May 20, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20210098363
- Publication date Apr 1, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Handoko LINEWIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC WITH ION MILLED THIN-FILM RESISTORS
- Publication number 20200212167
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- BHASKAR SRINIVASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE CHARGE STORAGE ARRAYS AND ASSOCIATED MANUFACTURING DEV...
- Publication number 20190252017
- Publication date Aug 15, 2019
- Peter C. Salmon
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuit and Manufacturing and Method Thereof
- Publication number 20190122962
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Tai TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE CHARGE STORAGE ARRAYS AND ASSOCIATED MANUFACTURING DEV...
- Publication number 20190074047
- Publication date Mar 7, 2019
- Peter C. Salmon, LLC
- Peter C. Salmon
- G11 - INFORMATION STORAGE

of thin-film circuits or parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including capacitor and resistor

Assembly of display with color conversion layer and isolation walls

Integrated circuit including a capacitive structure of the metal-in...

Semiconductor structure, electronic device, and method of manufactu...

Thin film based passive devices and methods of forming the same

Display with color conversion layer and isolation walls

Integrated circuits and methods for forming integrated circuits

Techniques for forming integrated inductor-capacitor oscillators an...

Electronic component and manufacturing method therefor

Short-wave infrared focal plane arrays, and methods for utilization...

Integrated circuit having a resistor layer partially overlapping en...

High dose implantation for ultrathin semiconductor-on-insulator sub...

Semiconductor device including capacitor and resistor

On integrated circuit (IC) device simultaneously formed capacitor a...

Integrated circuits and methods of forming integrated circuits

Integrated circuits and methods for forming integrated circuits

In-situ curing of color conversion layer

Integrated circuits and methods for forming integrated circuits

Methods of manufacturing a thin film resistor with ends overlapped...

Systems and methods for forming a thin film resistor integrated in...

Programmable charge storage arrays and associated manufacturing dev...

IC with ion milled thin-film resistors

Single layer integrated circuit package

Array substrate, display panel and display apparatus having the sam...

Capacitors in integrated circuits and methods of fabrication thereof

Radio frequency (RF) inductive signal coupler and method therefor

Thin film transistor comprising light shielding layers, array subst...

Method of manufacturing thin film transistor, dehydrogenating appar...

Programmable charge storage arrays and associated manufacturing dev...

Method for preparing ceramic package substrate with copper-plated dam

Patents Applicationslast 30 patents

ASSEMBLY OF DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS

SEMICONDUCTOR APPARATUS, SEMICONDUCTOR APPARATUS MANUFACTURING METH...

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...

ASSEMBLY OF DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS

HIGH DOSE IMPLANTATION FOR ULTRATHIN SEMICONDUCTOR-ON-INSULATOR SUB...

INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT

SHORT-WAVE INFRARED FOCAL PLANE ARRAYS, AND METHODS FOR UTILIZATION...

SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING

SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURI...

ULTRA-THIN SEMICONDUCTOR DIE WITH IRREGULAR TEXTURED SURFACES

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...

THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME

INTEGRATION SCHEME TO BUILD RESISTOR, CAPACITOR, EFUSE USING SILICO...

SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...

SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR

DISPLAY WITH COLOR CONVERSION LAYER AND ISOLATION WALLS

INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS

INTEGRATED RC ARCHITECTURE, AND METHODS OF FABRICATION THEREOF

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS

Integrated Circuit and Manufacturing and Method Thereof

TECHNIQUES FOR FORMING INTEGRATED INDUCTOR-CAPACITOR OSCILLATORS AN...

ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...

THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME

IC WITH ION MILLED THIN-FILM RESISTORS

PROGRAMMABLE CHARGE STORAGE ARRAYS AND ASSOCIATED MANUFACTURING DEV...

Integrated Circuit and Manufacturing and Method Thereof

PROGRAMMABLE CHARGE STORAGE ARRAYS AND ASSOCIATED MANUFACTURING DEV...