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CPC
C25D3/30

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

Current Industry

C25D3/30of tin

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hot-dip coated steel substrate
- Patent number 12,227,822
- Issue date Feb 18, 2025
- Arcelormittal
- Michel Bordignon
- C21 - METALLURGY OF IRON
Information Patent Grant
Method for pre-treating stainless steel substrates before soldering...
- Patent number 12,220,758
- Issue date Feb 11, 2025
- Vacuumschmelze GmbH & Co. KG
- Lothar Zapf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated steel sheet, metal container, and method for manufa...
- Patent number 12,163,243
- Issue date Dec 10, 2024
- Toyo Kohan Co., Ltd.
- Naomi Taguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film-forming metal solution and method of forming metal coating
- Patent number 12,110,605
- Issue date Oct 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Hirofumi Iisaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for dissolving tin (II) oxide
- Patent number 12,043,914
- Issue date Jul 23, 2024
- JX Metals Corporation
- Koichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated steel sheet, metal container, and method for produc...
- Patent number 11,939,693
- Issue date Mar 26, 2024
- Toyo Kohan Co., Ltd.
- Kunihiro Yoshimura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connector
- Patent number 11,905,614
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plated product and method for producing same
- Patent number 11,898,263
- Issue date Feb 13, 2024
- Dowa Metaltech Co., Ltd.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,851,781
- Issue date Dec 26, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,840,771
- Issue date Dec 12, 2023
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reaction products of amine monomers and polymers containing saturat...
- Patent number 11,732,374
- Issue date Aug 22, 2023
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-concentration tin sulfonate aqueous solution and method for pr...
- Patent number 11,692,277
- Issue date Jul 4, 2023
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-indium alloy electroplating solution
- Patent number 11,686,007
- Issue date Jun 27, 2023
- NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION
- Bhaskar S. Majumdar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hot-dip coated steel substrate
- Patent number 11,674,209
- Issue date Jun 13, 2023
- Arcelormittal
- Michel Bordignon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sn-based plated steel sheet
- Patent number 11,674,233
- Issue date Jun 13, 2023
- Nippon Steel Corporation
- Shintaro Yamanaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anti-corrosion terminal material, anti-corrosion terminal and elect...
- Patent number 11,661,667
- Issue date May 30, 2023
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sn-plated steel sheet and method for manufacturing Sn-plated steel...
- Patent number 11,598,009
- Issue date Mar 7, 2023
- Nippon Steel Corporation
- Shintaro Yamanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of tin-plating copper alloy for electric or electronic parts...
- Patent number 11,542,606
- Issue date Jan 3, 2023
- POONGSAN CORPORATION
- Cheol Min Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Terminal material with silver coating film and terminal with silver...
- Patent number 11,530,490
- Issue date Dec 20, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-concentration tin sulfonate aqueous solution and method for pr...
- Patent number 11,525,187
- Issue date Dec 13, 2022
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for mitigating tin whisker growth on tin an...
- Patent number 11,505,874
- Issue date Nov 22, 2022
- The Boeing Company
- Thomas A. Woodrow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for pre-treating stainless steel substrates before soldering...
- Patent number 11,383,315
- Issue date Jul 12, 2022
- Vacuumschmelze GmbH & Co. KG
- Lothar Zapf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method thereof
- Patent number 11,198,945
- Issue date Dec 14, 2021
- Murata Manufacturing Co., Ltd.
- Tomoyuki Shiode
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,180,864
- Issue date Nov 23, 2021
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High purity tin and method for producing same
- Patent number 11,118,276
- Issue date Sep 14, 2021
- JX Nippon Mining & Metals Corporation
- Toru Imori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Steel sheet and method of manufacturing same
- Patent number 11,098,386
- Issue date Aug 24, 2021
- Nippon Steel Corporation
- Akira Mikasa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plated polymeric article including tin/copper tie/seed layer
- Patent number 11,066,753
- Issue date Jul 20, 2021
- 3M Innovative Properties Company
- Larry S. Hebert
- B32 - LAYERED PRODUCTS
Information Patent Grant
System for treating solution for use in electroplating application...
- Patent number 11,053,604
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structure containing Sn layer or Sn alloy layer
- Patent number 11,052,637
- Issue date Jul 6, 2021
- Ishihara Chemical Co., LTD
- Shoya Iuchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact material, method of producing an electrical cont...
- Patent number 10,998,108
- Issue date May 4, 2021
- Furukawa Electric Co., Ltd.
- Yoshikazu Okuno
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
TIN PLATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250101540
- Publication date Mar 27, 2025
- INSTITUTE OF RESEARCH OF IRON AND STEEL, JIANGSU PROVINCE/SHA-STEEL, CO. LTD...
- Yifeng SONG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPERSION ELECTROLYTE FOR GRAPHITE-CONTAINING LAYERS
- Publication number 20250066944
- Publication date Feb 27, 2025
- Dr.-Ing. Max Schlötter GmbH & Co. KG
- Thomas Pliet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COLD-ROLLED STEEL SHEET HAVING EXCELLENT STRENGTH AND ELONGATION AN...
- Publication number 20250034683
- Publication date Jan 30, 2025
- POSCO CO., LTD
- Minho JO
- C21 - METALLURGY OF IRON
Information Patent Application
TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL M...
- Publication number 20240396242
- Publication date Nov 28, 2024
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHROMIUM-FREE PASSIVATED FILM-COVERED TINNED PLATE AND PREPARATION...
- Publication number 20240336035
- Publication date Oct 10, 2024
- Baoshan Iron & Steel Co., Ltd
- Zhangwei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE METAL FOIL AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240167185
- Publication date May 23, 2024
- Industrial Technology Research Institute
- Chiu-Yen Chiu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-INDIUM ALLOY ELECTROPLATING SOLUTION
- Publication number 20230383430
- Publication date Nov 30, 2023
- NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION
- Bhaskar S. MAJUMDAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Hot-dip coated steel substrate
- Publication number 20230272516
- Publication date Aug 31, 2023
- ARCELORMITTAL
- Michel BORDIGNON
- C21 - METALLURGY OF IRON
Information Patent Application
SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR MANUFA...
- Publication number 20230257898
- Publication date Aug 17, 2023
- TOYO KOHAN CO., LTD
- Naomi TAGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20230247774
- Publication date Aug 3, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...
- Publication number 20230143481
- Publication date May 11, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kazuaki Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PCB TERMINAL, CONNECTOR, WIRING HARNESS WITH CONNECTOR AND BOARD UNIT
- Publication number 20230130798
- Publication date Apr 27, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Michitake KAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sn-BASED PLATED STEEL SHEET
- Publication number 20230102675
- Publication date Mar 30, 2023
- NIPPON STEEL CORPORATION
- Shintaro YAMANAKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20220380924
- Publication date Dec 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...
- Publication number 20220333264
- Publication date Oct 20, 2022
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRE-TREATING STAINLESS STEEL SUBSTRATES BEFORE SOLDERING...
- Publication number 20220314353
- Publication date Oct 6, 2022
- Vacuumschmelze GMBH & Co. KG
- Lothar ZAPF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL MATERIAL AND CONNECTION TERMINAL
- Publication number 20220200182
- Publication date Jun 23, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Mitsuhiro KUMONDAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Continuously Applying Nanolaminate Metal C...
- Publication number 20220154357
- Publication date May 19, 2022
- Modumetal, Inc.
- Christina A. LOMASNEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED PRODUCT AND METHOD FOR PRODUCING SAME
- Publication number 20220136122
- Publication date May 5, 2022
- DOWA METALTECH CO., LTD.
- Yutaro Hirai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING THERMISTOR, AND THERMISTOR
- Publication number 20220139599
- Publication date May 5, 2022
- MITSUBISHI MATERIALS CORPORATION
- Takehiro Yonezawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...
- Publication number 20220042196
- Publication date Feb 10, 2022
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF PURE PHASE SnSb FROM EUTECTIC ETHALINE SOLUTIO...
- Publication number 20210348292
- Publication date Nov 11, 2021
- Colorado State University Research Foundation
- Jeffrey Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR PRODUC...
- Publication number 20210310146
- Publication date Oct 7, 2021
- TOYO KOHAN CO., LTD
- Kunihiro YOSHIMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...
- Publication number 20210184380
- Publication date Jun 17, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR REPRODUCING PLATING SOLUTION
- Publication number 20210172084
- Publication date Jun 10, 2021
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PLATING A METALLIC MATERIAL ONTO A TITANIUM SUBSTRATE
- Publication number 20210156043
- Publication date May 27, 2021
- The Boeing Company
- Edgardo A. Reyes Brondo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...
- Publication number 20210158990
- Publication date May 27, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CRYSTAL GRAIN SIZE REDUCTION METHOD FOR PLATING FILM
- Publication number 20210156044
- Publication date May 27, 2021
- TOYOHASHI PLATING CO., LTD
- MIKIHARU TAKAGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SN-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING SN-PLATED STEEL...
- Publication number 20200399765
- Publication date Dec 24, 2020
- NIPPON STEEL CORPORATION
- Shintaro YAMANAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hot-dip coated steel substrate

Method for pre-treating stainless steel substrates before soldering...

Surface-treated steel sheet, metal container, and method for manufa...

Film-forming metal solution and method of forming metal coating

Method for dissolving tin (II) oxide

Surface-treated steel sheet, metal container, and method for produc...

Terminal material for connector

Plated product and method for producing same

Method and apparatus for continuously applying nanolaminate metal c...

Composition for tin or tin alloy electroplating comprising suppress...

Reaction products of amine monomers and polymers containing saturat...

High-concentration tin sulfonate aqueous solution and method for pr...

Tin-indium alloy electroplating solution

Hot-dip coated steel substrate

Sn-based plated steel sheet

Anti-corrosion terminal material, anti-corrosion terminal and elect...

Sn-plated steel sheet and method for manufacturing Sn-plated steel...

Method of tin-plating copper alloy for electric or electronic parts...

Terminal material with silver coating film and terminal with silver...

High-concentration tin sulfonate aqueous solution and method for pr...

Methods and apparatuses for mitigating tin whisker growth on tin an...

Method for pre-treating stainless steel substrates before soldering...

Electronic component and method thereof

Method and apparatus for continuously applying nanolaminate metal c...

High purity tin and method for producing same

Steel sheet and method of manufacturing same

Plated polymeric article including tin/copper tie/seed layer

System for treating solution for use in electroplating application...

Structure containing Sn layer or Sn alloy layer

Electrical contact material, method of producing an electrical cont...

Patents Applicationslast 30 patents

TIN PLATE AND MANUFACTURING METHOD THEREFOR

DISPERSION ELECTROLYTE FOR GRAPHITE-CONTAINING LAYERS

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

COLD-ROLLED STEEL SHEET HAVING EXCELLENT STRENGTH AND ELONGATION AN...

TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL M...

CHROMIUM-FREE PASSIVATED FILM-COVERED TINNED PLATE AND PREPARATION...

COMPOSITE METAL FOIL AND METHOD OF MANUFACTURING THE SAME

TIN-INDIUM ALLOY ELECTROPLATING SOLUTION

Hot-dip coated steel substrate

SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR MANUFA...

Semi-Additive Process for Printed Circuit Boards

Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...

PCB TERMINAL, CONNECTOR, WIRING HARNESS WITH CONNECTOR AND BOARD UNIT

Sn-BASED PLATED STEEL SHEET

TERMINAL MATERIAL FOR CONNECTOR

HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...

METHOD FOR PRE-TREATING STAINLESS STEEL SUBSTRATES BEFORE SOLDERING...

METAL MATERIAL AND CONNECTION TERMINAL

Method and Apparatus for Continuously Applying Nanolaminate Metal C...

PLATED PRODUCT AND METHOD FOR PRODUCING SAME

METHOD FOR MANUFACTURING THERMISTOR, AND THERMISTOR

HIGH-CONCENTRATION TIN SULFONATE AQUEOUS SOLUTION AND METHOD FOR PR...

ELECTRODEPOSITION OF PURE PHASE SnSb FROM EUTECTIC ETHALINE SOLUTIO...

SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR PRODUC...

ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...

METHOD FOR REPRODUCING PLATING SOLUTION

METHOD FOR PLATING A METALLIC MATERIAL ONTO A TITANIUM SUBSTRATE

TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...

CRYSTAL GRAIN SIZE REDUCTION METHOD FOR PLATING FILM

SN-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING SN-PLATED STEEL...