of trenches having a shape other than rectangular or V-shape

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76232of trenches having a shape other than rectangular or V-shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of buried wordline structure
- Patent number 12,224,323
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
False collectors and guard rings for semiconductor devices
- Patent number 12,218,190
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,210
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 12,144,173
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a vertical fin field effect transistor with reduced...
- Patent number 12,136,573
- Issue date Nov 5, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having body contact regions proximate transis...
- Patent number 12,137,551
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,125,900
- Issue date Oct 22, 2024
- United Microelectronics Corp.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,100,750
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming fin field-effect transistors
- Patent number 12,068,199
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,068,394
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,057,342
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of isolation trench
- Patent number 12,040,219
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,220
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating sub-micron contacts to buried well devices
- Patent number 12,040,366
- Issue date Jul 16, 2024
- The Boeing Company
- Kangmu Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a FinFET device
- Patent number 12,033,898
- Issue date Jul 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,984,448
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Bok Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having a fin feature
- Patent number 11,978,785
- Issue date May 7, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 11,961,838
- Issue date Apr 16, 2024
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,955,372
- Issue date Apr 9, 2024
- Kioxia Corporation
- Takehiro Nakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET circuit devices with well isolation
- Patent number 11,948,829
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER AND METHOD FOR FORM...
- Publication number 20250062158
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Li CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH
- Publication number 20250040203
- Publication date Jan 30, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xufeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING PROCESSES
- Publication number 20250022715
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Body Contact Regions Proximate Transis...
- Publication number 20250024658
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015165
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413225
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240395599
- Publication date Nov 28, 2024
- DB HiTek Co., Ltd.
- Jong Won Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240395600
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Structures
- Publication number 20240363422
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363730
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING FINS
- Publication number 20240347376
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- CHEN-TSUNG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A FINFET DEVICE
- Publication number 20240347390
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF ISOLATION TRENCH
- Publication number 20240332062
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Chung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240284662
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Heejae CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AN ELECTRICALLY INSU...
- Publication number 20240266392
- Publication date Aug 8, 2024
- Infineon Technologies Austria AG
- Christof Altstätter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258313
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Bok Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240249981
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...
- Publication number 20240249980
- Publication date Jul 25, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET CIRCUIT DEVICES WITH WELL ISOLATION
- Publication number 20240222188
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240213083
- Publication date Jun 27, 2024
- HON HAI PRECISION INDUSTRY CO., LTD.
- Yun-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING SHALLOW TRENCH ISOLATION AND METHODS FOR FORM...
- Publication number 20240213084
- Publication date Jun 27, 2024
- Micron Technology, Inc.
- Maxtheodore Tateno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240204104
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240186403
- Publication date Jun 6, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING TRENCH MANUFACTURING
- Publication number 20240178055
- Publication date May 30, 2024
- STMicroelectronics (Crolles 2) SAS
- Thierno Moussa BAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20240162332
- Publication date May 16, 2024
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

of trenches having a shape other than rectangular or V-shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabrication method of buried wordline structure

Deep trench intersections

False collectors and guard rings for semiconductor devices

Semiconductor device

Gate line plug structures for advanced integrated circuit structure...

Plugs for interconnect lines for advanced integrated circuit struct...

Through wafer trench isolation between transistors in an integrated...

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Contact over active gate structures for advanced integrated circuit...

Fabrication of a vertical fin field effect transistor with reduced...

Integrated assemblies having body contact regions proximate transis...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Methods for forming fin field-effect transistors

Semiconductor device and manufacturing method thereof

Gate cut and fin trim isolation for advanced integrated circuit str...

Semiconductor device and method

Etch profile control of isolation trench

Semiconductor device

Fabricating sub-micron contacts to buried well devices

Method of fabricating a FinFET device

Methods of forming material within openings extending into a semico...

Semiconductor device

Method of manufacturing semiconductor structure having a fin feature

Fin end plug structures for advanced integrated circuit structure f...

Dual metal gate structure having portions of metal gate layers in c...

Heterogeneous metal line compositions for advanced integrated circu...

Semiconductor storage device

FinFET circuit devices with well isolation

Trench contact structures for advanced integrated circuit structure...

Patents Applicationslast 30 patents

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER AND METHOD FOR FORM...

METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH

PLASMA ETCHING PROCESSES

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

Integrated Assemblies Having Body Contact Regions Proximate Transis...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Device and Method

Semiconductor Fin Structures

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING FINS

METHOD OF FABRICATING A FINFET DEVICE

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

ETCH PROFILE CONTROL OF ISOLATION TRENCH

Methods of Forming Material Within Openings Extending into a Semico...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AN ELECTRICALLY INSU...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT STRUCTURE

FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...

FINFET CIRCUIT DEVICES WITH WELL ISOLATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUSES INCLUDING SHALLOW TRENCH ISOLATION AND METHODS FOR FORM...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

INSULATING TRENCH MANUFACTURING

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...