Ohmic electrodes

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H01L21/0485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0485Ohmic electrodes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with sic semiconductor layer and raised portio...
- Patent number 12,142,648
- Issue date Nov 12, 2024
- Rohm Co., Ltd.
- Seiya Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating silicon carbide semiconductor device and pow...
- Patent number 12,131,906
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Shiro Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor device
- Patent number 12,125,882
- Issue date Oct 22, 2024
- Rohm Co., Ltd.
- Toshio Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide transistor device
- Patent number 12,062,698
- Issue date Aug 13, 2024
- HITACHI ENERGY LTD
- Marco Bellini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier trapping region including cry...
- Patent number 12,027,579
- Issue date Jul 2, 2024
- Rohm Co., Ltd.
- Seigo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,967,564
- Issue date Apr 23, 2024
- Denso Corporation
- Aiko Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparating SiC ohmic contact with low specific contact...
- Patent number 11,948,983
- Issue date Apr 2, 2024
- Xidian University
- Yanfei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Real-time wireless synchronization of live event audio stream with...
- Patent number 11,901,429
- Issue date Feb 13, 2024
- Bygge Technologies Inc.
- Neil C. Marck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
And manufacture of self-aligned power devices
- Patent number 11,901,432
- Issue date Feb 13, 2024
- GeneSiC Semiconductor Inc.
- Siddarth Sundaresan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silicon carbide semiconductor component
- Patent number 11,855,147
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing Schottky barrier height and semiconductor devic...
- Patent number 11,817,481
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,545
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a sic electronic device with reduced handl...
- Patent number 11,784,049
- Issue date Oct 10, 2023
- STMicroelectronics S.r.l.
- Simone Rascuna'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal semiconductor contacts
- Patent number 11,688,785
- Issue date Jun 27, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yudi Setiawan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,677,009
- Issue date Jun 13, 2023
- Kabushiki Kaisha Toshiba
- Tatsuo Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method thereof
- Patent number 11,615,959
- Issue date Mar 28, 2023
- HESTIA POWER SHANGHAI TECHNOLOGY INC.
- Lurng-Shehng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact to silicon carbide semiconductor device
- Patent number 11,557,481
- Issue date Jan 17, 2023
- Fuji Electric Co., Ltd.
- Masahide Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide epitaxial substrate and method for manufacturing si...
- Patent number 11,530,491
- Issue date Dec 20, 2022
- Sumitomo Electric Industries, Ltd.
- Keiji Wada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing Schottky barrier height and semiconductor devic...
- Patent number 11,502,174
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with SiC semiconductor layer and raised portio...
- Patent number 11,489,051
- Issue date Nov 1, 2022
- Rohm Co., Ltd.
- Seiya Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,482,607
- Issue date Oct 25, 2022
- Mitsubishi Electric Corporation
- Atsufumi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing si...
- Patent number 11,469,303
- Issue date Oct 11, 2022
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Realtime wireless synchronization of live event audio stream with a...
- Patent number 11,456,369
- Issue date Sep 27, 2022
- Bygge Technologies Inc.
- Neil C. Marck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a silicon carbide electronic device
- Patent number 11,456,175
- Issue date Sep 27, 2022
- Hitachi Energy Switzerland AG
- Giovanni Alfieri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing silicon carbide semiconductor device
- Patent number 11,411,093
- Issue date Aug 9, 2022
- Fuji Electric Co., Ltd.
- Takahito Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,393,911
- Issue date Jul 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Teppei Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,355,612
- Issue date Jun 7, 2022
- Kabushiki Kaisha Toshiba
- Tatsuo Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor device with metallization st...
- Patent number 11,348,789
- Issue date May 31, 2022
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240413207
- Publication date Dec 12, 2024
- Hitachi Energy Ltd
- Giovanni ALFIERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ohmic Contact for Semiconductor Structures
- Publication number 20240379360
- Publication date Nov 14, 2024
- Shiva RAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
- Publication number 20240290842
- Publication date Aug 29, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...
- Publication number 20240266172
- Publication date Aug 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric Allibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OHMIC CONTACT ON A WIDE-BANDGAP SEMICONDUCTOR...
- Publication number 20240222462
- Publication date Jul 4, 2024
- Hitachi Energy Ltd
- Vinoth SUNDARAMOORTHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A VERTICAL POWER SEMICONDUCTOR COMPONENT, AND...
- Publication number 20240222492
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Jens Baringhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REALTIME WIRELESS SYNCHRONIZATION OF LIVE EVENT AUDIO STREAM WITH A...
- Publication number 20240213345
- Publication date Jun 27, 2024
- BYGGE TECHNOLOGIES INC.
- Neil C. Marck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DESIGN AND MANUFACTURE OF SELF-ALIGNED POWER MOSFETs
- Publication number 20240128348
- Publication date Apr 18, 2024
- GeneSiC Semiconductor Inc.
- Siddarth Sundaresan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240105858
- Publication date Mar 28, 2024
- Fuji Electric Co., Ltd.
- Yuichi HASHIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OHMIC CONTACTS OF AN ELECTRONIC DEVICE, WIT...
- Publication number 20240079237
- Publication date Mar 7, 2024
- STMicroelectronics S.r.l.
- Mario Giuseppe SAGGIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH REDUCED OHMIC TO OHMIC DIMENSIONS
- Publication number 20240072125
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SUBSTRATE,...
- Publication number 20240055257
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Saurabh Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...
- Publication number 20240055256
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Ravi Keshav JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...
- Publication number 20240030032
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Saurabh ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014317
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SIC ELECTRONIC DEVICE WITH REDUCED HANDL...
- Publication number 20230411158
- Publication date Dec 21, 2023
- STMicroelectronics S.r.l.
- Simone RASCUNA'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SILICON CARBIDE SEMICONDUCTOR COMPONENT
- Publication number 20230395663
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20230299152
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Tatsuo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, IN...
- Publication number 20230299192
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Shinichi KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE DEVICE WITH METALLIC INTERFACE LAYERS AND METHOD OF...
- Publication number 20230253454
- Publication date Aug 10, 2023
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A METAL SILICIDE LAYER ABOVE A SILICON CARB...
- Publication number 20230215729
- Publication date Jul 6, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230197519
- Publication date Jun 22, 2023
- DENSO CORPORATION
- YUJI NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SI...
- Publication number 20230163220
- Publication date May 25, 2023
- Fuji Electric Co., Ltd.
- Takeyoshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MPS DIODE DEVICE AND PREPARATION METHOD THEREFOR
- Publication number 20230105596
- Publication date Apr 6, 2023
- GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
- Yiren LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTEXTUAL FORMATION OF A JUNCTION BARRIER DIODE AND A SCHOTTKY DIO...
- Publication number 20230087112
- Publication date Mar 23, 2023
- STMicroelectronics S.r.l.
- Filippo GIANNAZZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230086599
- Publication date Mar 23, 2023
- TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Shunsuke ASABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230064733
- Publication date Mar 2, 2023
- Hestia Power Shanghai Technology Inc.
- Lurng-Shehng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN OHMIC CONTACT ON A CRYSTALLOGRAPHIC C-SIDE...
- Publication number 20230050165
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Humberto Rodriguez Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SILICON CARBIDE SEMICONDUCTOR DEVICE AND POW...
- Publication number 20230036221
- Publication date Feb 2, 2023
- Mitsubishi Electric Corporation
- Shiro HINO
- H01 - BASIC ELECTRIC ELEMENTS

Ohmic electrodes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with sic semiconductor layer and raised portio...

Method for fabricating silicon carbide semiconductor device and pow...

SiC semiconductor device

Silicon carbide transistor device

Semiconductor device having a carrier trapping region including cry...

Method for manufacturing semiconductor device

Method for preparating SiC ohmic contact with low specific contact...

Real-time wireless synchronization of live event audio stream with...

And manufacture of self-aligned power devices

Method for producing a silicon carbide semiconductor component

Method for reducing Schottky barrier height and semiconductor devic...

Semiconductor device

Process for producing an electrical contact on a silicon carbide su...

Method for manufacturing a sic electronic device with reduced handl...

Metal semiconductor contacts

Semiconductor device, method for manufacturing semiconductor device...

Silicon carbide semiconductor device and manufacturing method thereof

Contact to silicon carbide semiconductor device

Silicon carbide epitaxial substrate and method for manufacturing si...

Method for reducing Schottky barrier height and semiconductor devic...

Semiconductor device with SiC semiconductor layer and raised portio...

Semiconductor device and method for manufacturing semiconductor device

Silicon carbide semiconductor device and method of manufacturing si...

Realtime wireless synchronization of live event audio stream with a...

Method of making a silicon carbide electronic device

Method of manufacturing silicon carbide semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device, method for manufacturing semiconductor device...

Method for manufacturing semiconductor device with metallization st...

Semiconductor devices comprising getter layers and methods of makin...

Patents Applicationslast 30 patents

SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

Ohmic Contact for Semiconductor Structures

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...

METHOD FOR FORMING AN OHMIC CONTACT ON A WIDE-BANDGAP SEMICONDUCTOR...

METHOD FOR PRODUCING A VERTICAL POWER SEMICONDUCTOR COMPONENT, AND...

REALTIME WIRELESS SYNCHRONIZATION OF LIVE EVENT AUDIO STREAM WITH A...

DESIGN AND MANUFACTURE OF SELF-ALIGNED POWER MOSFETs

SILICON CARBIDE SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING OHMIC CONTACTS OF AN ELECTRONIC DEVICE, WIT...

ELECTRONIC DEVICES WITH REDUCED OHMIC TO OHMIC DIMENSIONS

METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SUBSTRATE,...

METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...

METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...

SEMICONDUCTOR DEVICE

Chip with a Silicon Carbide Substrate

METHOD FOR MANUFACTURING A SIC ELECTRONIC DEVICE WITH REDUCED HANDL...

METHOD FOR PRODUCING A SILICON CARBIDE SEMICONDUCTOR COMPONENT

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, IN...

SILICON CARBIDE DEVICE WITH METALLIC INTERFACE LAYERS AND METHOD OF...

METHOD OF MANUFACTURING A METAL SILICIDE LAYER ABOVE A SILICON CARB...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SI...

MPS DIODE DEVICE AND PREPARATION METHOD THEREFOR

CONTEXTUAL FORMATION OF A JUNCTION BARRIER DIODE AND A SCHOTTKY DIO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING AN OHMIC CONTACT ON A CRYSTALLOGRAPHIC C-SIDE...

METHOD FOR FABRICATING SILICON CARBIDE SEMICONDUCTOR DEVICE AND POW...