on both sides of the substrate or combined with lead-in-hole components

Industry

CPC
H05K3/3415

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3415on both sides of the substrate or combined with lead-in-hole components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Optical light emitting device, manufacturing method thereof, and op...
- Patent number 12,038,140
- Issue date Jul 16, 2024
- Japan Display Inc.
- Tomoyuki Ishihara
- F21 - LIGHTING
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 11,891,730
- Issue date Feb 6, 2024
- SIREN CARE, INC.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Grant
Resistor component for surface mounting on a printed circuit board...
- Patent number 11,547,000
- Issue date Jan 3, 2023
- HERAEUS NEXENSOS GMBH
- Stephan Urfels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 11,447,896
- Issue date Sep 20, 2022
- SIREN CARE, INC.
- Jie Fu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 11,393,650
- Issue date Jul 19, 2022
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board mounting piezoelectric transformer
- Patent number 11,307,525
- Issue date Apr 19, 2022
- Canon Kabushiki Kaisha
- Taro Minobe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Array antenna apparatus and method for fabricating same
- Patent number 11,211,710
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Yoichi Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,153,973
- Issue date Oct 19, 2021
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 10,784,067
- Issue date Sep 22, 2020
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a plurality of printed circuit boards from a singl...
- Patent number 10,714,885
- Issue date Jul 14, 2020
- Canon Kabushiki Kaisha
- Norikazu Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board mounting piezoelectric transformer
- Patent number 10,671,009
- Issue date Jun 2, 2020
- Canon Kabushiki Kaisha
- Taro Minobe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package module
- Patent number 10,638,614
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Hyuk-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount connector, surface-mount circuit board, and method of...
- Patent number 10,615,526
- Issue date Apr 7, 2020
- Fujitsu Limited
- Yasushi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 10,557,220
- Issue date Feb 11, 2020
- SIREN CARE, INC.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 10,480,104
- Issue date Nov 19, 2019
- SIREN CARE, INC.
- Jie Fu
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Electrical power supply device for at least one LED and at least on...
- Patent number 10,427,585
- Issue date Oct 1, 2019
- Valeo Iluminacion
- Jose-David Roldan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,398,036
- Issue date Aug 27, 2019
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless charger with connector
- Patent number 10,340,721
- Issue date Jul 2, 2019
- LG Innotek Co., Ltd
- Young Kil Song
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical feed-through and connector configuration
- Patent number 10,164,358
- Issue date Dec 25, 2018
- Western Digital Technologies, Inc.
- Kyosuke Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic device attachment on a reverse microelectronic package
- Patent number 10,136,516
- Issue date Nov 20, 2018
- Intel Corporation
- Howe Yin Loo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decoupling capacitive arrangement to manage power integrity
- Patent number 9,844,135
- Issue date Dec 12, 2017
- Cisco Technology, Inc.
- Feng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die and package jigsaw submount
- Patent number 9,831,144
- Issue date Nov 28, 2017
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a tab pin with no tie bar
- Patent number 9,793,034
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Jong-hyun Seok
- G11 - INFORMATION STORAGE
Information Patent Grant
Mounting structure of leaded electronic component which reduces occ...
- Patent number 9,730,334
- Issue date Aug 8, 2017
- FANUC Corporation
- Makoto Bekke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic device attachment on a reverse microelectronic package
- Patent number 9,699,904
- Issue date Jul 4, 2017
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting two objects electrically
- Patent number 9,545,015
- Issue date Jan 10, 2017
- Brother Kogyo Kabushiki Kaisha
- Hiroto Sugahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximizing surface area of surface mount contact pads of circuit bo...
- Patent number 9,510,448
- Issue date Nov 29, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Eric R. Ao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin low profile strip dual in-line memory module
- Patent number 9,480,161
- Issue date Oct 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING CAPACITOR BOOSTER MODULE
- Publication number 20240260193
- Publication date Aug 1, 2024
- Intel Corporation
- Herh Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...
- Publication number 20240172375
- Publication date May 23, 2024
- Delta Electronics, Inc.
- Quansong Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...
- Publication number 20240044458
- Publication date Feb 8, 2024
- Japan Display Inc.
- Tomoyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20230217593
- Publication date Jul 6, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switched Capacitor Converter Package Structure and Method
- Publication number 20230126760
- Publication date Apr 27, 2023
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELEC...
- Publication number 20220418088
- Publication date Dec 29, 2022
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTOR COMPONENT FOR MOUNTING ON THE SURFACE OF A PRINTED CIRCUIT...
- Publication number 20210307178
- Publication date Sep 30, 2021
- Heraeus Nexensos GmbH
- Stephan URFELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE
- Publication number 20210136909
- Publication date May 6, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module
- Publication number 20210105898
- Publication date Apr 8, 2021
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...
- Publication number 20200381205
- Publication date Dec 3, 2020
- BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, WUERZBURG
- MATTHIAS MARKERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MOUNTING PIEZOELECTRIC TRANSFORMER
- Publication number 20200257234
- Publication date Aug 13, 2020
- Canon Kabushiki Kaisha
- Taro Minobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Antenna Apparatus and Method For Fabricating Same
- Publication number 20200235478
- Publication date Jul 23, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yoichi KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...
- Publication number 20200052450
- Publication date Feb 13, 2020
- Canon Kabushiki Kaisha
- Norikazu Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS CHARGER WITH CONNECTOR
- Publication number 20190288544
- Publication date Sep 19, 2019
- LG Innotek Co., Ltd.
- Young Kil SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190246505
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Hyuk-jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-MOUNT CONNECTOR, SURFACE-MOUNT CIRCUIT BOARD, AND METHOD OF...
- Publication number 20190199022
- Publication date Jun 27, 2019
- Fujitsu Limited
- Yasushi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ATTACHING PRINTED CIRCUIT BOARD TO PALLET
- Publication number 20190160570
- Publication date May 30, 2019
- Western Digital Technologies, Inc.
- Landdell Gregory
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...
- Publication number 20190148099
- Publication date May 16, 2019
- BROSE FAHRZEUGTEILE GMBH & CO, KOMMANDITGESELLSCHAFT, WUERZBURG
- MATTHIAS MARKERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180279484
- Publication date Sep 27, 2018
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...
- Publication number 20180087193
- Publication date Mar 29, 2018
- Siren Care, Inc.
- Jie Fu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTI-FLEX PRINTED CIRCUIT BOARD FOR WEARABLE SYSTEM
- Publication number 20170332479
- Publication date Nov 16, 2017
- Fu LUO-LARSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE
- Publication number 20170265306
- Publication date Sep 14, 2017
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SET TOP BOX HAVING PASTE-IN-HOLE TUNER SHIELD
- Publication number 20170127580
- Publication date May 4, 2017
- THOMSON LICENSING
- William John TESTIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE
- Publication number 20140293563
- Publication date Oct 2, 2014
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MOUNTED ON A CIRCUIT BOARD
- Publication number 20140159990
- Publication date Jun 12, 2014
- OPTICON SENSORS EUROPE B.V.
- Alexander Azhari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING SUBSTRATE ON WHICH MONOLITHIC CERA...
- Publication number 20140110161
- Publication date Apr 24, 2014
- Murata Manufacturing Co., Ltd.
- Kazuo HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION IN A VERY SMALL FORM FACTOR CONSUMER ELECTRONIC PRODUCT
- Publication number 20140104807
- Publication date Apr 17, 2014
- Apple Inc.
- Teodor Dabov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TERMINAL MANUFACTURING METHOD AND BOARD CONNECTOR
- Publication number 20130288533
- Publication date Oct 31, 2013
- SUMITOMO WIRING SYSTEMS, LTD.
- Kazumasa Kobayashi
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

on both sides of the substrate or combined with lead-in-hole components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical light emitting device, manufacturing method thereof, and op...

Method for soldering an electronic component to a circuit board by...

Switched capacitor converter package structure and method

Smart yarn and method for manufacturing a yarn containing an electr...

Resistor component for surface mounting on a printed circuit board...

Smart yarn and method for manufacturing a yarn containing an electr...

Electronic assembly with thermal fuse, an electric motor and a driv...

Printed circuit board mounting piezoelectric transformer

Array antenna apparatus and method for fabricating same

Electronic module

Electronic assembly with thermal fuse, an electric motor and a driv...

Method of making a plurality of printed circuit boards from a singl...

Printed circuit board mounting piezoelectric transformer

Semiconductor package module

Surface-mount connector, surface-mount circuit board, and method of...

Smart yarn and method for manufacturing a yarn containing an electr...

Smart yarn and method for manufacturing a yarn containing an electr...

Electrical power supply device for at least one LED and at least on...

Semiconductor device

Wireless charger with connector

Electrical feed-through and connector configuration

Microelectronic device attachment on a reverse microelectronic package

Decoupling capacitive arrangement to manage power integrity

Semiconductor die and package jigsaw submount

Semiconductor module having a tab pin with no tie bar

Mounting structure of leaded electronic component which reduces occ...

Microelectronic device attachment on a reverse microelectronic package

Method for connecting two objects electrically

Maximizing surface area of surface mount contact pads of circuit bo...

Thin low profile strip dual in-line memory module

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

DECOUPLING CAPACITOR BOOSTER MODULE

METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...

OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...

PACKAGE SUBSTRATE

Switched Capacitor Converter Package Structure and Method

POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELEC...

Method for Soldering an Electronic Component to a Circuit Board by...

RESISTOR COMPONENT FOR MOUNTING ON THE SURFACE OF A PRINTED CIRCUIT...

INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE

Electronic Module

ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...

PRINTED CIRCUIT BOARD MOUNTING PIEZOELECTRIC TRANSFORMER

Array Antenna Apparatus and Method For Fabricating Same

METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...

WIRELESS CHARGER WITH CONNECTOR

SEMICONDUCTOR PACKAGE MODULE

SURFACE-MOUNT CONNECTOR, SURFACE-MOUNT CIRCUIT BOARD, AND METHOD OF...

SYSTEMS AND METHODS FOR ATTACHING PRINTED CIRCUIT BOARD TO PALLET

ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...

SEMICONDUCTOR DEVICE

SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...

MULTI-FLEX PRINTED CIRCUIT BOARD FOR WEARABLE SYSTEM

MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE

SET TOP BOX HAVING PASTE-IN-HOLE TUNER SHIELD

MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE

ANTENNA MOUNTED ON A CIRCUIT BOARD

METHOD OF MANUFACTURING MOUNTING SUBSTRATE ON WHICH MONOLITHIC CERA...

ESD PROTECTION IN A VERY SMALL FORM FACTOR CONSUMER ELECTRONIC PRODUCT

TERMINAL MANUFACTURING METHOD AND BOARD CONNECTOR