on semiconductor substrate

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CPC
H01F2017/0086

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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Current Industry

H01F2017/0086on semiconductor substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with inductor windings around a core above an...
- Patent number 12,057,468
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked spiral inductor
- Patent number 12,009,129
- Issue date Jun 11, 2024
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Congying Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hexagonal semiconductor package structure
- Patent number 11,996,227
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with through-substrate via cores
- Patent number 11,942,428
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanic isolation of integrated closed magnetic path transformer w...
- Patent number 11,756,718
- Issue date Sep 12, 2023
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial magnetic inductors with pre-fabricated ferrite cores
- Patent number 11,735,535
- Issue date Aug 22, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil-incorporated multilayer substrate and method for manufacturing...
- Patent number 11,581,117
- Issue date Feb 14, 2023
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 11,562,926
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with an embedded inductor or transformer
- Patent number 11,538,771
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hexagonal semiconductor package structure
- Patent number 11,532,425
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric spiral inductor
- Patent number 11,387,034
- Issue date Jul 12, 2022
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 11,302,470
- Issue date Apr 12, 2022
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded magnetic material using photo...
- Patent number 11,289,263
- Issue date Mar 29, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 11,250,985
- Issue date Feb 15, 2022
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,250,981
- Issue date Feb 15, 2022
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated switched inductor power converter having first and secon...
- Patent number 11,197,374
- Issue date Dec 7, 2021
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,563
- Issue date Nov 30, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer, transformer manufacturing method and semiconductor device
- Patent number 11,114,377
- Issue date Sep 7, 2021
- Mitsubishi Electric Corporation
- Kan Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,094,443
- Issue date Aug 17, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-Q integrated inductor and method thereof
- Patent number 11,004,589
- Issue date May 11, 2021
- Realtek Semiconductor Corp.
- Chia-Liang (Leon) Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor
- Patent number 10,978,547
- Issue date Apr 13, 2021
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-terminal inductors for voltage regulators
- Patent number 10,972,001
- Issue date Apr 6, 2021
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure
- Patent number 10,825,599
- Issue date Nov 3, 2020
- Unimicron Technology Corp.
- Chang-Fu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor structure for integrated circuit
- Patent number 10,804,155
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked laminate inductors for high module volume utilization and p...
- Patent number 10,796,835
- Issue date Oct 6, 2020
- Qorvo US, Inc.
- Michael F. Zybura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure for integrated circuit
- Patent number 10,790,194
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 10,784,033
- Issue date Sep 22, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20240347578
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240331932
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUT...
- Publication number 20240321497
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20240312692
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
- Publication number 20240234324
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD OF FORMING THE SAME
- Publication number 20240112842
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Sheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105761
- Publication date Mar 28, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER
- Publication number 20240038429
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
- Publication number 20230402416
- Publication date Dec 14, 2023
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SPIRAL INDUCTOR
- Publication number 20230268111
- Publication date Aug 24, 2023
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Congying DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
- Publication number 20230207612
- Publication date Jun 29, 2023
- VIA Labs, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH INDUCTOR WIRE FORMED IN AN INTEGRATED CIRC...
- Publication number 20230129684
- Publication date Apr 27, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR EL...
- Publication number 20230128990
- Publication date Apr 27, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hexagonal Semiconductor Package Structure
- Publication number 20230116861
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230066895
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric spiral inductor
- Publication number 20220293331
- Publication date Sep 15, 2022
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL MAGNETIC INDUCTORS WITH PRE-FABRICATED FERRITE CORES
- Publication number 20210104475
- Publication date Apr 8, 2021
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
- Publication number 20210082818
- Publication date Mar 18, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER
- Publication number 20200365532
- Publication date Nov 19, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hexagonal Semiconductor Package Structure
- Publication number 20200144861
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT
- Publication number 20200027789
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT
- Publication number 20200027790
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC INDUCTOR
- Publication number 20200006464
- Publication date Jan 2, 2020
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SPIRAL INDUCTOR
- Publication number 20200005980
- Publication date Jan 2, 2020
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Congying DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Q Integrated Inductor and Method Thereof
- Publication number 20190333672
- Publication date Oct 31, 2019
- Realtek Semiconductor Corp.
- Chia-Liang (Leon) Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER, TRANSFORMER MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20190189557
- Publication date Jun 20, 2019
- Mitsubishi Electric Corporation
- Kan TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
- Publication number 20190164934
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR
- Publication number 20190148479
- Publication date May 16, 2019
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Inductor Structure
- Publication number 20190108935
- Publication date Apr 11, 2019
- REALTEK SEMICONDUCTOR CORPORATION
- HSIAO-TSUNG YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR AND FABRICATION METHOD THEREOF
- Publication number 20180254141
- Publication date Sep 6, 2018
- Realtek Semiconductor Corp.
- Poh-Boon Leong
- H01 - BASIC ELECTRIC ELEMENTS

on semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with inductor windings around a core above an...

Stacked spiral inductor

Hexagonal semiconductor package structure

Vertical inductor for WLCSP

Inductors with through-substrate via cores

Galvanic isolation of integrated closed magnetic path transformer w...

Coaxial magnetic inductors with pre-fabricated ferrite cores

Coil-incorporated multilayer substrate and method for manufacturing...

Package structure and method of forming thereof

Coupling inductors in an IC device using interconnecting elements w...

Integrated circuit with an embedded inductor or transformer

Hexagonal semiconductor package structure

Conductor design for integrated magnetic devices

Asymmetric spiral inductor

Semiconductor element

Electronic substrates having embedded magnetic material using photo...

Semiconductor element

Vertical inductor for WLCSP

Integrated switched inductor power converter having first and secon...

Semiconductor structure and manufacturing method thereof

Transformer, transformer manufacturing method and semiconductor device

Electronic component

High-Q integrated inductor and method thereof

Integrated inductor

Multi-terminal inductors for voltage regulators

Carrier structure

Inductor structure for integrated circuit

Stacked laminate inductors for high module volume utilization and p...

Inductor structure for integrated circuit

Vertical inductor for WLCSP

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUT...

COIL STRUCTURE AND METHOD OF MAKING SAME

INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

INDUCTOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER

SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...

STACKED SPIRAL INDUCTOR

MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE

INTEGRATED INDUCTOR WITH INDUCTOR WIRE FORMED IN AN INTEGRATED CIRC...

INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR EL...

Hexagonal Semiconductor Package Structure

INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Asymmetric spiral inductor

COAXIAL MAGNETIC INDUCTORS WITH PRE-FABRICATED FERRITE CORES

INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER

Hexagonal Semiconductor Package Structure

INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT

INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT

EMBEDDED MAGNETIC INDUCTOR

STACKED SPIRAL INDUCTOR

High-Q Integrated Inductor and Method Thereof

TRANSFORMER, TRANSFORMER MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

INTEGRATED INDUCTOR

Integrated Inductor Structure

INTEGRATED INDUCTOR AND FABRICATION METHOD THEREOF