onto a polymeric substrate

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CPC
H05K3/0064

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0064onto a polymeric substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of continuous sheet for circuit board producti...
- Patent number 12,225,669
- Issue date Feb 11, 2025
- LG Chem, Ltd.
- Hyung Suk Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stretchable 3D-printed circuit boards
- Patent number 11,856,708
- Issue date Dec 26, 2023
- Carnegie Mellon University
- Gary K. Fedder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple in-mold electronics structure and method of manufacturing...
- Patent number 11,765,819
- Issue date Sep 19, 2023
- INTOPS.CO., LTD.
- Sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,744,011
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing printed wire boards
- Patent number 11,337,309
- Issue date May 17, 2022
- Rohm and Haas Electronic Materials LLC
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate for flexible printed wiring boar...
- Patent number 11,310,917
- Issue date Apr 19, 2022
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing patterned coverlay on substrate
- Patent number 11,198,792
- Issue date Dec 14, 2021
- Eternal Materials Co., Ltd.
- Chung-Kai Cheng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Implantable thin film devices
- Patent number 11,191,952
- Issue date Dec 7, 2021
- Pacesetter, Inc.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically functional structure integration in ultrathin foldable...
- Patent number 11,005,158
- Issue date May 11, 2021
- Dell Products L.P.
- Deeder M. Aurongzeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-curable resin composition, and pre-preg, metal-clad laminat...
- Patent number 10,920,008
- Issue date Feb 16, 2021
- Taiwan Union Technology Corporation
- Ju-Ming Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically functional structure integration in ultrathin foldable...
- Patent number 10,727,566
- Issue date Jul 28, 2020
- Dell Products L.P.
- Deeder M. Aurongzeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and printed w...
- Patent number 10,701,811
- Issue date Jun 30, 2020
- Furukawa Electric Co., Ltd.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adhesive film, multilayer printed wiring board using adhesive film,...
- Patent number 10,645,804
- Issue date May 5, 2020
- Hitachi Chemical Company, Ltd.
- Masaharu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board and image forming apparatus
- Patent number 10,502,369
- Issue date Dec 10, 2019
- Canon Kabushiki Kaisha
- Jun Hirabayashi
- F21 - LIGHTING
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method for manufacturing the same
- Patent number 10,412,841
- Issue date Sep 10, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Tzu-Chien Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming a substrate structure for an electrical compone...
- Patent number 10,384,431
- Issue date Aug 20, 2019
- Intel Corporation
- Ji Yong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning of graphene circuits on flexible substrates
- Patent number 10,362,680
- Issue date Jul 23, 2019
- Compass Technology Company, Limited
- Kelvin Po Leung Pun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dry film solder mask composite laminate materials
- Patent number 10,327,336
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Sarah K. Czaplewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 10,219,369
- Issue date Feb 26, 2019
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assembly, electrical junction box, and manufacturing method...
- Patent number 10,194,523
- Issue date Jan 29, 2019
- AutoNetworks Technologies, Ltd.
- Tatsuya Sumida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered structure with conductive polymer for recognition of manipu...
- Patent number 9,996,787
- Issue date Jun 12, 2018
- Heraeus Deutschland GmbH & Co. KG
- Frank Puttkammer
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Rapid PCB prototyping by selective adhesion
- Patent number 9,955,571
- Issue date Apr 24, 2018
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer frame with polymer matrix and methods of fabrication
- Patent number 9,949,373
- Issue date Apr 17, 2018
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, layered product, multilayer printed wiring board...
- Patent number 9,896,546
- Issue date Feb 20, 2018
- Asahi Kasei E-Materials Corporation
- Koichiro Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stretchable 3D Printed Circuits
- Publication number 20240114626
- Publication date Apr 4, 2024
- Carnegie Mellon University
- Gary K. Fedder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...
- Publication number 20230300988
- Publication date Sep 21, 2023
- Dätwyler Schweiz AG
- Ronny VRIJENS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATHETER-DEPLOYABLE SOFT ROBOTIC SENSOR ARRAYS AND PROCESSING OF FL...
- Publication number 20230146045
- Publication date May 11, 2023
- Cornell University
- Simon Dunham
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20230020151
- Publication date Jan 19, 2023
- INTOPS CO., LTD.
- sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE
- Publication number 20220418103
- Publication date Dec 29, 2022
- Murata Manufacturing Co., Ltd.
- Atsushi KASUYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE 3D-PRINTED CIRCUIT BOARDS
- Publication number 20220304160
- Publication date Sep 22, 2022
- Carnegie Mellon University
- Gary K. Fedder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE THIN FILM DEVICES
- Publication number 20220088375
- Publication date Mar 24, 2022
- PACESETTER, INC.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220015227
- Publication date Jan 13, 2022
- DAI NIPPON PRINTING CO., LTD.
- Kenichi OGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE
- Publication number 20210348276
- Publication date Nov 11, 2021
- ARISAWA MFG. CO., LTD.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FPCB with PCT film and Method for making the FPCB
- Publication number 20210092838
- Publication date Mar 25, 2021
- JIN YOUNG GLOBAL CO., LTD.
- Kyong Do KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOAR...
- Publication number 20210084768
- Publication date Mar 18, 2021
- NIPPON MEKTRON, LTD.
- Toshihiro HIGASHIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC/INORGANIC LAMINATES FOR HIGH FREQUENCY PRINTED CIRCUIT BOAR...
- Publication number 20210068249
- Publication date Mar 4, 2021
- Corning Incorporated
- William Peter Addiego
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CONTINUOUS SHEET FOR CIRCUIT BOARD PRODUCTI...
- Publication number 20210037656
- Publication date Feb 4, 2021
- LG CHEM, LTD.
- Hyung Suk Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods of Manufacturing Circuit Boards
- Publication number 20200389980
- Publication date Dec 10, 2020
- OSI Electronics, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...
- Publication number 20200296837
- Publication date Sep 17, 2020
- Rohm and Haas Electronic Materials L.L.C.
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY FUNCTIONAL STRUCTURE INTEGRATION IN ULTRATHIN FOLDABLE...
- Publication number 20200259242
- Publication date Aug 13, 2020
- Dell Products L.P.
- Deeder M. Aurongzeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINAT...
- Publication number 20200123307
- Publication date Apr 23, 2020
- Taiwan Union Technology Corporation
- JU-MING HUANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...
- Publication number 20200029444
- Publication date Jan 23, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Takeo UNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20190350091
- Publication date Nov 14, 2019
- Avary Holding (Shenzhen) Co., Limited.
- TZU-CHIEN YEH
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190116677
- Publication date Apr 18, 2019
- Avary Holding (Shenzhen) Co., Limited.
- TZU-CHIEN YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for forming a substrate structure for an electrical compone...
- Publication number 20180281374
- Publication date Oct 4, 2018
- Intel Corporation
- Ji Yong Park
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of Making Highly Flexible and Conductive Printed Graphene-Ba...
- Publication number 20170156215
- Publication date Jun 1, 2017
- Chung-Ping LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION
- Publication number 20170127527
- Publication date May 4, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS
- Publication number 20160338205
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Sarah K. Czaplewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM MATERIAL, ELECTRONIC COMPONENT USING FILM MATERIAL, AND METHOD...
- Publication number 20160280965
- Publication date Sep 29, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Koji MOTOMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYAMIDE FILMS AND PROCESS FOR PREPARATION
- Publication number 20160183368
- Publication date Jun 23, 2016
- DSM IP Assets B. V.
- Alexander Antonius Marie STROEKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

onto a polymeric substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of continuous sheet for circuit board producti...

Resin multilayer substrate

Laminate

Stretchable 3D-printed circuit boards

Multiple in-mold electronics structure and method of manufacturing...

Wiring board and method for manufacturing wiring board

Laminated body and method for manufacturing the same

Laminated body and method for manufacturing the same

Substrate structures and methods of manufacture

Methods of manufacturing printed wire boards

Method for manufacturing substrate for flexible printed wiring boar...

Method for preparing patterned coverlay on substrate

Implantable thin film devices

Electrically functional structure integration in ultrathin foldable...

Thermal-curable resin composition, and pre-preg, metal-clad laminat...

Electrically functional structure integration in ultrathin foldable...

Surface-treated copper foil, and copper-clad laminate and printed w...

Adhesive film, multilayer printed wiring board using adhesive film,...

Circuit board and image forming apparatus

Method for producing a circuit board element

Flexible printed circuit board and method for manufacturing the same

Methods for forming a substrate structure for an electrical compone...

Patterning of graphene circuits on flexible substrates

Dry film solder mask composite laminate materials

Circuit board

Circuit assembly, electrical junction box, and manufacturing method...

Layered structure with conductive polymer for recognition of manipu...

Rapid PCB prototyping by selective adhesion

Interposer frame with polymer matrix and methods of fabrication

Resin composition, layered product, multilayer printed wiring board...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

Ultra-Thin Sandwich Component

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

Stretchable 3D Printed Circuits

METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...

CATHETER-DEPLOYABLE SOFT ROBOTIC SENSOR ARRAYS AND PROCESSING OF FL...

MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...

RESIN MULTILAYER SUBSTRATE

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

STRETCHABLE 3D-PRINTED CIRCUIT BOARDS

IMPLANTABLE THIN FILM DEVICES

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

LAMINATE

FPCB with PCT film and Method for making the FPCB

METHOD FOR MANUFACTURING SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOAR...

ORGANIC/INORGANIC LAMINATES FOR HIGH FREQUENCY PRINTED CIRCUIT BOAR...

MANUFACTURING METHOD OF CONTINUOUS SHEET FOR CIRCUIT BOARD PRODUCTI...

Systems and Methods of Manufacturing Circuit Boards

PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...

ELECTRICALLY FUNCTIONAL STRUCTURE INTEGRATION IN ULTRATHIN FOLDABLE...

THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINAT...

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...

FLEXIBLE PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Methods for forming a substrate structure for an electrical compone...

Method of Making Highly Flexible and Conductive Printed Graphene-Ba...

INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION

DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS

FILM MATERIAL, ELECTRONIC COMPONENT USING FILM MATERIAL, AND METHOD...

POLYAMIDE FILMS AND PROCESS FOR PREPARATION