Organic insulating material

Industry

CPC
H05K1/0313

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0313Organic insulating material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer plastic front plate and method for manufacturing the same
- Patent number 12,109,587
- Issue date Oct 8, 2024
- ENFLEX CORPORATION
- Hsin Yuan Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 12,096,556
- Issue date Sep 17, 2024
- Shinko Electric Industries Co., Ltd.
- Yuta Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate
- Patent number 12,041,716
- Issue date Jul 16, 2024
- LG Innotek Co., Ltd
- Nam Heon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for manufacturing thin substrate
- Patent number 12,035,466
- Issue date Jul 9, 2024
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmoulded printed electronic parts and methods for the manufactur...
- Patent number 12,017,392
- Issue date Jun 25, 2024
- National Research Council of Canada
- Paul Arthur Trudeau
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit film and stretchable display device includ...
- Patent number 11,930,593
- Issue date Mar 12, 2024
- LG Display Co., Ltd.
- Hohyun Keum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic liquid crystal polymer film and circuit board using same
- Patent number 11,877,395
- Issue date Jan 16, 2024
- Kuraray Co., Ltd.
- Minoru Onodera
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conducting structure
- Patent number 11,868,576
- Issue date Jan 9, 2024
- Japan Display Inc.
- Shuichi Osawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,810,849
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite panel comprising an integrated electrical circuit and man...
- Patent number 11,800,641
- Issue date Oct 24, 2023
- HUTCHINSON AERONAUTIQUE & INDUSTRIE LTÉE.
- Martin Levesque
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wiring board
- Patent number 11,792,925
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Kyohei Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Component carrier with embedded component connected in cavity by an...
- Patent number 11,683,884
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Imane Souli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive microstructures within a heat shrinkable subst...
- Patent number 11,638,348
- Issue date Apr 25, 2023
- Raytheon Company
- Kyle L. Grosse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 11,617,264
- Issue date Mar 28, 2023
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device having color resists pattern
- Patent number 11,609,492
- Issue date Mar 21, 2023
- Ming-An Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and electrical element
- Patent number 11,605,869
- Issue date Mar 14, 2023
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prelaminate for an electronic card, and methods for producing such...
- Patent number 11,599,764
- Issue date Mar 7, 2023
- IDEMIA France
- Philippe Gac
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 11,582,860
- Issue date Feb 14, 2023
- JSR Corporation
- Isao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate
- Patent number 11,576,261
- Issue date Feb 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joo Hwan Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor, and electronic device...
- Patent number 11,570,899
- Issue date Jan 31, 2023
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information carrying card comprising a cross-linked polymer composi...
- Patent number 11,560,474
- Issue date Jan 24, 2023
- X-Card Holdings, LLC
- Mark A. Cox
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODE FOR HIGH-ENERGY BATTERIES
- Publication number 20240258513
- Publication date Aug 1, 2024
- HYDRO-QUEBEC
- Karim ZAGHIB
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Antennas Having Substrate Layers With Compound Curvature
- Publication number 20240186686
- Publication date Jun 6, 2024
- Apple Inc.
- Yi Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT MOUNT BOARD
- Publication number 20240172366
- Publication date May 23, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM AND DISPLAY PANEL
- Publication number 20240147607
- Publication date May 2, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Xin LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20240107659
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer Plastic Front Plate And Method For Manufacturing The Same
- Publication number 20240050984
- Publication date Feb 15, 2024
- Enflex Corporation
- Hsin Yuan Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240049389
- Publication date Feb 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230389171
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Jae Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN CIRCUIT SUBSTRATE
- Publication number 20230319975
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRAY INDUCTANCE BUSBAR STRUCTURE FOR POWER MODULE
- Publication number 20230308027
- Publication date Sep 28, 2023
- ZHENGHAI GROUP CO., LTD.
- Xianye MAO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230269880
- Publication date Aug 24, 2023
- TOYO KOHAN CO., LTD
- Youhei YOSHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic Apparatus and Optoelectronic Integration Method
- Publication number 20230223389
- Publication date Jul 13, 2023
- Huawei Technologies Co., Ltd
- Shengli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20230217597
- Publication date Jul 6, 2023
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSI...
- Publication number 20230159740
- Publication date May 25, 2023
- X-CARD HOLDINGS, LLC
- Mark A. Cox
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED MULTILAY...
- Publication number 20230119903
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takumi MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTING STRUCTURE
- Publication number 20230116970
- Publication date Apr 20, 2023
- Japan Display Inc.
- Shuichi OSAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSI...
- Publication number 20230116583
- Publication date Apr 13, 2023
- Idemia America Corp.
- Mark A. Cox
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ACTIVE ESTER RESIN, METHOD FOR PRODUCING THEREOF, EPOXY RESIN COMPO...
- Publication number 20230097650
- Publication date Mar 30, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20230056971
- Publication date Feb 23, 2023
- Material Concept, Inc.
- Junichi KOIKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL PO...
- Publication number 20220403244
- Publication date Dec 22, 2022
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua LIANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD
- Publication number 20220386474
- Publication date Dec 1, 2022
- Canatu Oy
- Ilkka VARJOS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220377884
- Publication date Nov 24, 2022
- IBIDEN CO., LTD.
- Shigeto IYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220369468
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE
- Publication number 20220361318
- Publication date Nov 10, 2022
- LG Innotek Co., Ltd.
- Nam Heon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC SUBSTRAT...
- Publication number 20220330423
- Publication date Oct 13, 2022
- SKC CO., LTD.
- Young Min HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220201855
- Publication date Jun 23, 2022
- IBIDEN CO., LTD.
- Kyohei YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Organic insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reel mechanism and winding device for flexible copper clad laminate

Polymer plastic front plate and method for manufacturing the same

Interconnect substrate and method of making the same

Layered device for pressure treatment and method

Metal-coated liquid-crystal polymer film

Substrate

Systems and methods for manufacturing thin substrate

Overmoulded printed electronic parts and methods for the manufactur...

High density organic bridge device and method

Method of fabricating a substrate with metal reflection layer

Method for manufacturing a substrate structure with high reflectance

Flexible printed circuit film and stretchable display device includ...

Thermoplastic liquid crystal polymer film and circuit board using same

Conducting structure

Circuit board and method of manufacturing circuit board

Method for forming through-hole, and substrate for flexible printed...

Connection structure and method of forming the same

Composite panel comprising an integrated electrical circuit and man...

Printed wiring board

Dual conductor laminated substrate

Component carrier with embedded component connected in cavity by an...

Patterned conductive microstructures within a heat shrinkable subst...

Interconnect substrate and method of making the same

Device having color resists pattern

Electronic apparatus and electrical element

Prelaminate for an electronic card, and methods for producing such...

Circuit board

Connection structure embedded substrate

Circuit board and production method therefor, and electronic device...

Information carrying card comprising a cross-linked polymer composi...

Patents Applicationslast 30 patents

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

ANODE FOR HIGH-ENERGY BATTERIES

Antennas Having Substrate Layers With Compound Curvature

COMPONENT MOUNT BOARD

CONDUCTIVE FILM AND DISPLAY PANEL

PRINTED WIRING BOARD

CIRCUIT BOARD AND ELECTRONIC COMPONENT

Polymer Plastic Front Plate And Method For Manufacturing The Same

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

INSULATING RESIN CIRCUIT SUBSTRATE

LOW STRAY INDUCTANCE BUSBAR STRUCTURE FOR POWER MODULE

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME

Optoelectronic Apparatus and Optoelectronic Integration Method

REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE

INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSI...

MULTILAYER CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED MULTILAY...

CONDUCTING STRUCTURE

INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSI...

ACTIVE ESTER RESIN, METHOD FOR PRODUCING THEREOF, EPOXY RESIN COMPO...

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR PREPARING LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL PO...

LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD

PRINTED WIRING BOARD

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

SUBSTRATE

FILM AND LAMINATE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC SUBSTRAT...

PRINTED WIRING BOARD