Organic non-polymeric coating

Industry

CPC
H05K2203/0591

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0591Organic non-polymeric coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder circuit
- Patent number 6,476,487
- Issue date Nov 5, 2002
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,319,620
- Issue date Nov 20, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,270,889
- Issue date Aug 7, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Organic rust-proof treated copper foil
- Patent number 6,071,629
- Issue date Jun 6, 2000
- Mitsui Mining and Smelting Co., Ltd.
- Toshiko Yokota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organic-metallic composite coating for copper surface protection
- Patent number 5,960,251
- Issue date Sep 28, 1999
- International Business Machines Corporation
- Vista A. Brusic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder film
- Patent number 5,928,440
- Issue date Jul 27, 1999
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder film
- Patent number 5,750,271
- Issue date May 12, 1998
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solution for selectively imparting tackiness to a metallic surface
- Patent number 5,713,997
- Issue date Feb 3, 1998
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detecting a coating material on a substrate
- Patent number 5,583,285
- Issue date Dec 10, 1996
- Lucent Technologies Inc.
- Mark H. Hahn
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming solder film
- Patent number 5,556,023
- Issue date Sep 17, 1996
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for treating copper and copper alloy surfaces and metho...
- Patent number 5,496,590
- Issue date Mar 5, 1996
- MEC Co., Ltd.
- Yoshiro Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for use of preflux, printed wiring board, and method for pro...
- Patent number 5,478,607
- Issue date Dec 26, 1995
- Hitachi Telecon Technologies Ltd.
- Hiroshi Gunji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for use of preflux, printed wiring board, and method for pro...
- Patent number 5,441,814
- Issue date Aug 15, 1995
- Hitachi Telecon Technologies Ltd.
- Hiroshi Gunji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating process
- Patent number 5,425,873
- Issue date Jun 20, 1995
- Shipley Company LLC
- John J. Bladon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Preflux coating method
- Patent number 5,374,331
- Issue date Dec 20, 1994
- Argus International
- Bernard J. Costello
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treating agent for copper or copper alloys
- Patent number 5,348,590
- Issue date Sep 20, 1994
- Hitachi, Ltd.
- Seizi Shigemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing printed-circuit board
- Patent number 5,294,519
- Issue date Mar 15, 1994
- Kansai Paint Co., Ltd.
- Kiici Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for production of copper through-hole printed wiring boards
- Patent number 5,275,694
- Issue date Jan 4, 1994
- Sanwa Laboratory Ltd.
- Hideaki Yamaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pre-plate cleaning process
- Patent number 5,077,176
- Issue date Dec 31, 1991
- AT&T Bell Laboratories
- Thomas J. Baggio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for producing printed circuit board
- Patent number 5,028,513
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder powders coated with fluorine compounds, and solder pastes
- Patent number 4,994,326
- Issue date Feb 19, 1991
- Tamura Kaken Co., Ltd.
- Takashi Shimmura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable controlled thickness conformal coating
- Patent number 4,830,922
- Issue date May 16, 1989
- Bryan L. Sparrowhawk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of copper from corrosion
- Patent number 4,731,128
- Issue date Mar 15, 1988
- International Business Machines Corporation
- Frank J. Casullo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a multilayer printed-circuit board
- Patent number 4,683,653
- Issue date Aug 4, 1987
- Asahi Chemical Research Laboratory Co., Ltd.
- Yamahiro Iwasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder resist paste and method of soldering
- Patent number 4,634,039
- Issue date Jan 6, 1987
- Northern Telecom Limited
- Hari N. Banerjee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing copper through-hole printed circuit board
- Patent number 4,622,097
- Issue date Nov 11, 1986
- Shikoku Chemicals Corporation
- Minoru Tsukagoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preserving the solderability of copper
- Patent number 4,373,656
- Issue date Feb 15, 1983
- Western Electric Company, Inc.
- John L. Parker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3899339
- Patent number 3,899,339
- Issue date Aug 12, 1975
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...
- Publication number 20230337372
- Publication date Oct 19, 2023
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR OBTAINING INFORMATION ABOUT A LAYER OF AN ORGANIC SOLDER...
- Publication number 20220132673
- Publication date Apr 28, 2022
- Atotech Deutschland GmbH
- Hubertus MERTENS
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140326486
- Publication date Nov 6, 2014
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- CHAO-RONG LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20140102767
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Making and using an ultra-thin copper foil
- Publication number 20020070120
- Publication date Jun 13, 2002
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solder circuit
- Publication number 20010020744
- Publication date Sep 13, 2001
- Takeo Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Organic non-polymeric coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder circuit

Making and using an ultra-thin copper foil

Making and using an ultra-thin copper foil

Organic rust-proof treated copper foil

Organic-metallic composite coating for copper surface protection

Method of forming solder film

Method of forming solder film

Solution for selectively imparting tackiness to a metallic surface

Method for detecting a coating material on a substrate

Method of forming solder film

Composition for treating copper and copper alloy surfaces and metho...

Method for use of preflux, printed wiring board, and method for pro...

Method for use of preflux, printed wiring board, and method for pro...

Electroplating process

Preflux coating method

Surface treating agent for copper or copper alloys

Process for preparing printed-circuit board

Process for production of copper through-hole printed wiring boards

Pre-plate cleaning process

Process for producing printed circuit board

Solder powders coated with fluorine compounds, and solder pastes

Removable controlled thickness conformal coating

Protection of copper from corrosion

Method for producing a multilayer printed-circuit board

Solder resist paste and method of soldering

Process for producing copper through-hole printed circuit board

Method of preserving the solderability of copper

3899339

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...

METHOD FOR OBTAINING INFORMATION ABOUT A LAYER OF AN ORGANIC SOLDER...

PRINTED CIRCUIT BOARD

MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

Making and using an ultra-thin copper foil

Solder circuit