Oxidant in aqueous solution

Industry

CPC
H05K2203/0796

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0796Oxidant in aqueous solution

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing transfer film including seed layer, method...
- Patent number 11,453,823
- Issue date Sep 27, 2022
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming circuits using seed layer and etchant compositio...
- Patent number 11,317,514
- Issue date Apr 26, 2022
- Inktec Co., Ltd.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrates for stretchable electronics and method of manufacture
- Patent number 10,736,212
- Issue date Aug 4, 2020
- ARES MATERIALS INC.
- Radu Reit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution for copper and copper alloy surfaces
- Patent number 10,619,251
- Issue date Apr 14, 2020
- Atotech Deutschland GmbH
- Fabian Michalik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical device with teeth joining layers and method for making t...
- Patent number 9,942,982
- Issue date Apr 10, 2018
- Continental Circuits, LLC
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,929,097
- Issue date Mar 27, 2018
- Intel Corporation
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Desmear module of a horizontal process line and a method for separa...
- Patent number 9,930,786
- Issue date Mar 27, 2018
- Atotech Deutschland GmbH
- Andreas Skupin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacture of fine line circuitry
- Patent number 9,713,266
- Issue date Jul 18, 2017
- Atotech Deutschland GmbH
- Richard Nichols
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical device with teeth joining layers and method for making t...
- Patent number 9,374,912
- Issue date Jun 21, 2016
- Continental Circuits LLC
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of multilayer printed wiring board and multilayer...
- Patent number 9,060,456
- Issue date Jun 16, 2015
- Ajinomoto Co., Inc.
- Seiichiro Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,040,842
- Issue date May 26, 2015
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 9,040,117
- Issue date May 26, 2015
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method of circuit substrate, production method of plated ci...
- Patent number 9,017,563
- Issue date Apr 28, 2015
- Tokuyama Corporation
- Emi Ushioda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,839
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Yogo Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making self-patterning substrates and the product thereof
- Patent number 8,747,599
- Issue date Jun 10, 2014
- Chidella Krishna Sastry
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded structure
- Patent number 8,729,397
- Issue date May 20, 2014
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board and a printed circ...
- Patent number 8,663,484
- Issue date Mar 4, 2014
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical device with teeth joining layers and method for making t...
- Patent number 8,581,105
- Issue date Nov 12, 2013
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of multilayer printed wiring board and multilayer...
- Patent number 8,533,942
- Issue date Sep 17, 2013
- Ajinomoto Co., Inc.
- Seiichiro Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acid-resistance promoting composition
- Patent number 8,518,281
- Issue date Aug 27, 2013
- Kesheng Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for improving adhesion of polymeric materials to metal surf...
- Patent number 8,512,504
- Issue date Aug 20, 2013
- Steven A. Castaldi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing a printed circuit board and a printed circ...
- Patent number 8,465,656
- Issue date Jun 18, 2013
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 8,425,785
- Issue date Apr 23, 2013
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device with teeth joining layers and method for making t...
- Patent number 8,278,560
- Issue date Oct 2, 2012
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching processing method
- Patent number 8,257,604
- Issue date Sep 4, 2012
- Shinko Electric Industries Co., Ltd.
- Norikazu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming UV-patternable conductive polymer film
- Patent number 8,252,386
- Issue date Aug 28, 2012
- Samsung Electronics Co., Ltd.
- Jong Baek Seon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board using imprinting
- Patent number 8,216,503
- Issue date Jul 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and method for improved adhesion of polymeric materials...
- Patent number 8,192,636
- Issue date Jun 5, 2012
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 8,142,840
- Issue date Mar 27, 2012
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...
- Publication number 20200221578
- Publication date Jul 9, 2020
- Ink Tec Co., Ltd.
- Kwang-Choon CHUNG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICROCIRCUIT FORMING METHOD AND ETCHING FLUID COMPOSITION
- Publication number 20200163219
- Publication date May 21, 2020
- Ink Tec Co., Ltd.
- Su Han KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD...
- Publication number 20200053881
- Publication date Feb 13, 2020
- INKTEC CO., LTD.
- Kwang-Choon CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURI...
- Publication number 20190292408
- Publication date Sep 26, 2019
- JSR Corporation
- Eiichirou KUNITANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES
- Publication number 20190003061
- Publication date Jan 3, 2019
- Atotech Deutschland GmbH
- Fabian MICHALIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Recycling Waste Electrical And Electronic Equipment
- Publication number 20170362682
- Publication date Dec 21, 2017
- BRGM
- Nour-Eddine Menad
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DESMEAR MODULE OF A HORIZONTAL PROCESS LINE AND A METHOD FOR SEPARA...
- Publication number 20170231097
- Publication date Aug 10, 2017
- Atotech Deutschland GmbH
- Andreas SKUPIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESMEAR SOLUTION AND DESMEAR METHOD
- Publication number 20140339463
- Publication date Nov 20, 2014
- C. UYEMURA & CO., LTD
- Yoshikazu Saijo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING...
- Publication number 20140091053
- Publication date Apr 3, 2014
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER...
- Publication number 20130319749
- Publication date Dec 5, 2013
- Shinko Electric Industries Co., Ltd.
- Seiichiro OHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20130299226
- Publication date Nov 14, 2013
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT PANEL AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130105206
- Publication date May 2, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae Il KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20130078367
- Publication date Mar 28, 2013
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD OF CIRCUIT SUBSTRATE, PRODUCTION METHOD OF PLATED CI...
- Publication number 20130048598
- Publication date Feb 28, 2013
- Emi USHIODA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING T...
- Publication number 20130032568
- Publication date Feb 7, 2013
- Brian J. McDermott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD
- Publication number 20120167916
- Publication date Jul 5, 2012
- C. UYEMURA & CO., LTD
- Yoshikazu Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE
- Publication number 20120085569
- Publication date Apr 12, 2012
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20120067633
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Yogo Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...
- Publication number 20110051387
- Publication date Mar 3, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenya TACHIBANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for Improving Adhesion of Polymeric Materials to Metal Surf...
- Publication number 20100282393
- Publication date Nov 11, 2010
- STEVEN A. CASTALDI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...
- Publication number 20100139959
- Publication date Jun 10, 2010
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...
- Publication number 20100126762
- Publication date May 27, 2010
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD
- Publication number 20100051066
- Publication date Mar 4, 2010
- Eiko Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20100038124
- Publication date Feb 18, 2010
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composition and Method for Improved Adhesion of Polymeric Materials...
- Publication number 20100035435
- Publication date Feb 11, 2010
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20100006328
- Publication date Jan 14, 2010
- IBIDEN CO., LTD.
- Yogo Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES
- Publication number 20090321123
- Publication date Dec 31, 2009
- BASF SE Patents, Trademarks and Lincenses
- Rene Lochtman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD
- Publication number 20090304911
- Publication date Dec 10, 2009
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- CHENG-HSIEN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for making self-patterning substrates and the product thereof
- Publication number 20090297802
- Publication date Dec 3, 2009
- Chidella Krishna Sastry
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Oxidant in aqueous solution

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing transfer film including seed layer, method...

Method for forming circuits using seed layer and etchant compositio...

Microcircuit forming method and etching fluid composition

Substrates for stretchable electronics and method of manufacture

Etching solution for copper and copper alloy surfaces

Electrical device with teeth joining layers and method for making t...

Mechanical adhesion of copper metallization to dielectric with part...

Desmear module of a horizontal process line and a method for separa...

Method for manufacture of fine line circuitry

Electrical device with teeth joining layers and method for making t...

Production method of multilayer printed wiring board and multilayer...

Mechanical adhesion of copper metallization to dielectric with part...

Adhesion promotion in printed circuit boards

Plating method of circuit substrate, production method of plated ci...

Multi-layer printed circuit board and method of manufacturing multi...

Process for making self-patterning substrates and the product thereof

Embedded structure

Method for manufacturing a printed circuit board and a printed circ...

Electrical device with teeth joining layers and method for making t...

Production method of multilayer printed wiring board and multilayer...

Acid-resistance promoting composition

Process for improving adhesion of polymeric materials to metal surf...

Method for manufacturing a printed circuit board and a printed circ...

Mechanical adhesion of copper metallization to dielectric with part...

Electrical device with teeth joining layers and method for making t...

Etching processing method

Method for forming UV-patternable conductive polymer film

Method for manufacturing printed circuit board using imprinting

Composition and method for improved adhesion of polymeric materials...

Adhesion promotion in printed circuit boards

Patents Applicationslast 30 patents

COMPOSITE COPPER COMPONENTS

METHOD FOR FORMING CIRCUITS USING SEED LAYER AND ETCHANT COMPOSITIO...

MICROCIRCUIT FORMING METHOD AND ETCHING FLUID COMPOSITION

METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD...

CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURI...

ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES

Method For Recycling Waste Electrical And Electronic Equipment

DESMEAR MODULE OF A HORIZONTAL PROCESS LINE AND A METHOD FOR SEPARA...

DESMEAR SOLUTION AND DESMEAR METHOD

ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING...

PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER...

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...

TRANSPARENT PANEL AND METHOD OF MANUFACTURING THE SAME

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

PLATING METHOD OF CIRCUIT SUBSTRATE, PRODUCTION METHOD OF PLATED CI...

ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING T...

NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD

EMBEDDED STRUCTURE

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...

Process for Improving Adhesion of Polymeric Materials to Metal Surf...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...

COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD

EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME

Composition and Method for Improved Adhesion of Polymeric Materials...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

METHOD FOR PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES

METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD

Process for making self-patterning substrates and the product thereof