Oxide removing step

Industry

CPC
H01L2021/60052

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60052Oxide removing step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 11,862,480
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 11,171,017
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Zhang Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment apparatus and method utilizing activated forming gas
- Patent number 10,399,170
- Issue date Sep 3, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective deposition with surface treatment
- Patent number 10,378,105
- Issue date Aug 13, 2019
- Tokyo Electron Limited
- Kai-Hung Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Shutter Disk
- Publication number 20240087913
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FLUX LED WITH LOW OPERATING VOLTAGE UTILIZING TWO P-N JUNCTION...
- Publication number 20230420599
- Publication date Dec 28, 2023
- Lumileds LLC
- Robert Armitage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
- Publication number 20230290649
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Sophie GABORIEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shutter Disk
- Publication number 20220028702
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Zhang Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shutter Disk
- Publication number 20210074552
- Publication date Mar 11, 2021
- Applied Materials, Inc.
- Zhang Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION WITH SURFACE TREATMENT
- Publication number 20170342553
- Publication date Nov 30, 2017
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS

Oxide removing step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shutter disk

Shutter disk

Shutter disk

Methods of forming joint structures for surface mount packages

Die attachment apparatus and method utilizing activated forming gas

Selective deposition with surface treatment

Package structure and method for manufacturing the same

Patents Applicationslast 30 patents

Shutter Disk

HIGH FLUX LED WITH LOW OPERATING VOLTAGE UTILIZING TWO P-N JUNCTION...

METHOD OF MANUFACTURING AN INTERPOSER PRODUCT

Shutter Disk

Shutter Disk

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

SELECTIVE DEPOSITION WITH SURFACE TREATMENT

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME