Packaged discrete devices

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CPC
H01L2023/4031

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4031Packaged discrete devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 12,199,021
- Issue date Jan 14, 2025
- Semikron Elektronik GmbH & Co. KG
- Manuel Noderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for protecting a stack of electronic components and metho...
- Patent number 11,942,395
- Issue date Mar 26, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,830,863
- Issue date Nov 28, 2023
- Intel Corporation
- Suresh V. Pothukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,824,017
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric working machine with semiconductor element that completes...
- Patent number 11,777,377
- Issue date Oct 3, 2023
- Makita Corporation
- Akihiro Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a spring plate
- Patent number 11,621,213
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,610,832
- Issue date Mar 21, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting devices for semiconductor packages with a fixation mechanism
- Patent number 11,605,575
- Issue date Mar 14, 2023
- Mahle International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,268
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding and ignition prevention device for semiconductor element, a...
- Patent number 11,502,018
- Issue date Nov 15, 2022
- Mitsubishi Electric Corporation
- Atsutoshi Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,502,019
- Issue date Nov 15, 2022
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic assembly, package structure having hollow cylinders and...
- Patent number 11,342,295
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,217,573
- Issue date Jan 4, 2022
- Intel Corporation
- Suresh V. Pothukuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fixing device for double sided heat sink and associated heat dissip...
- Patent number 11,215,409
- Issue date Jan 4, 2022
- EMC IP Holding Company LLC
- Haifang Zhai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and vehicle
- Patent number 11,158,563
- Issue date Oct 26, 2021
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat transfer for power modules
- Patent number 11,145,571
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastening seat and securing device with gasket for use wi...
- Patent number 11,133,238
- Issue date Sep 28, 2021
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Heng-Kang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control unit and electric power steering device using th...
- Patent number 11,084,521
- Issue date Aug 10, 2021
- Denso Corporation
- Tsuyoshi Tashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, heat dissipation apparatus, heat dissipation system, and...
- Patent number 11,043,442
- Issue date Jun 22, 2021
- Huawei Technologies Co., Ltd.
- Shoubiao Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,998,295
- Issue date May 4, 2021
- Denso Corporation
- Hiromasa Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,978,371
- Issue date Apr 13, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for cooling electrical components
- Patent number 10,930,577
- Issue date Feb 23, 2021
- Robert Bosch GmbH
- Peter Taufer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module, power module assembly and assembling method thereof
- Patent number 10,917,999
- Issue date Feb 9, 2021
- DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
- Zhenrong Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378098
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Disconnect Unit
- Publication number 20230309278
- Publication date Sep 28, 2023
- LG ENERGY SOLUTION, LTD.
- Yong-Hwan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230260859
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20230230895
- Publication date Jul 20, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187311
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE GAP COMPENSATION MOUNTING SOLUTION FOR THERMAL MANAGEMENT...
- Publication number 20230163046
- Publication date May 25, 2023
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066410
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285289
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS AND METHOD OF FABRICATING...
- Publication number 20220246570
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20220085001
- Publication date Mar 17, 2022
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210343623
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...
- Publication number 20210343621
- Publication date Nov 4, 2021
- Huawei Technologies Co., Ltd
- Shoubiao XU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STRUCTURAL ELEMENTS FOR APPLICATION SPECIFIC ELECTRONIC DEVICE PACK...
- Publication number 20210296225
- Publication date Sep 23, 2021
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20210280566
- Publication date Sep 9, 2021
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200388557
- Publication date Dec 10, 2020
- Semiconductor Components Industries, LLC
- Inpil YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200335414
- Publication date Oct 22, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module Comprising a Semiconductor Package with Integrate...
- Publication number 20200294885
- Publication date Sep 17, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200286810
- Publication date Sep 10, 2020
- MAHLE International GmbH
- Francisco Gonzalez Espin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200286811
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for Cooling Electrical Components
- Publication number 20200243415
- Publication date Jul 30, 2020
- ROBERT BOSCH GmbH
- Peter TAUFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY, PACKAGE STRUCTURE AND METHOD OF FABRICATING TH...
- Publication number 20200203301
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC WORKING MACHINE WITH SEMICONDUCTOR ELEMENT THAT COMPLETES...
- Publication number 20200169148
- Publication date May 28, 2020
- MAKITA CORPORATION
- Akihiro NAKAMOTO
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIP...
- Publication number 20200141669
- Publication date May 7, 2020
- EMC IP Holding Company LLC
- Haifang Zhai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONDUCTIVE LID AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200118905
- Publication date Apr 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER SEMICONDUCTOR MODULE AND VEHICLE
- Publication number 20200051892
- Publication date Feb 13, 2020
- Fuji Electric Co., Ltd.
- Hiromichi GOHARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20190341327
- Publication date Nov 7, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS

Packaged discrete devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor module and method for producing a power semicon...

Package structure having hollow cylinders and method of fabricating...

Semiconductor package and manufacturing method thereof

Structural elements for application specific electronic device pack...

Apparatus for protecting a stack of electronic components and metho...

Dual-sided co-packaged optics for high bandwidth networking applica...

Semiconductor package and manufacturing method thereof

Electric working machine with semiconductor element that completes...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device including a spring plate

Heat transfer for power modules

Mounting devices for semiconductor packages with a fixation mechanism

Semiconductor package and manufacturing method thereof

Holding and ignition prevention device for semiconductor element, a...

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Electronic assembly, package structure having hollow cylinders and...

Server microprocessor carrier with guiding alignment anti-tilt and...

Dual-sided co-packaged optics for high bandwidth networking applica...

Fixing device for double sided heat sink and associated heat dissip...

Solid-state storage device

Power semiconductor module and vehicle

Heat transfer for power modules

Heat sink fastening seat and securing device with gasket for use wi...

Electronic control unit and electric power steering device using th...

Heat sink, heat dissipation apparatus, heat dissipation system, and...

Method of manufacturing semiconductor module and semiconductor module

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Device for cooling electrical components

Power module, power module assembly and assembling method thereof

Patents Applicationslast 30 patents

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Battery Disconnect Unit

SEMICONDUCTOR DEVICE

HEAT TRANSFER FOR POWER MODULES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

VARIABLE GAP COMPENSATION MOUNTING SOLUTION FOR THERMAL MANAGEMENT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS AND METHOD OF FABRICATING...

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And...

STRUCTURAL ELEMENTS FOR APPLICATION SPECIFIC ELECTRONIC DEVICE PACK...

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

HEAT TRANSFER FOR POWER MODULES

HEAT TRANSFER FOR POWER MODULES

Electronic Module Comprising a Semiconductor Package with Integrate...

MOUNTING DEVICES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Device for Cooling Electrical Components

ELECTRONIC ASSEMBLY, PACKAGE STRUCTURE AND METHOD OF FABRICATING TH...

ELECTRIC WORKING MACHINE WITH SEMICONDUCTOR ELEMENT THAT COMPLETES...

FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIP...

CONDUCTIVE LID AND SEMICONDUCTOR DEVICE PACKAGE

POWER SEMICONDUCTOR MODULE AND VEHICLE

HEAT TRANSFER FOR POWER MODULES