Pad close to a hole, not surrounding the hole

Industry

CPC
H05K2201/0949

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0949Pad close to a hole, not surrounding the hole

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package to printed circuit board transition
- Patent number 11,147,161
- Issue date Oct 12, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package to printed circuit board transition
- Patent number 10,917,968
- Issue date Feb 9, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multichannel RF feedthroughs
- Patent number 10,845,553
- Issue date Nov 24, 2020
- II-VI Delaware Inc.
- Yan yang Zhao
- G02 - OPTICS
Information Patent Grant
Resin substrate, component-mounting resin substrate, and method of...
- Patent number 10,741,462
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal and connector assembly
- Patent number 10,707,598
- Issue date Jul 7, 2020
- Tyco Electronics (Shanghai) Co. Ltd.
- Xiaozhi Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,219,383
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board via design
- Patent number 10,201,084
- Issue date Feb 5, 2019
- Dell Products, L.P.
- V. Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of part-mounting package
- Patent number 10,034,383
- Issue date Jul 24, 2018
- NGK Spark Plug Co., Ltd.
- Kazushige Akita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating touch screen panel
- Patent number 9,904,385
- Issue date Feb 27, 2018
- Samsung Display Co., Ltd.
- Akira Hirai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High voltage polymer dielectric capacitor isolation device
- Patent number 9,893,008
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RJ-45 communication plug with plug blades received in apertures in...
- Patent number 9,819,131
- Issue date Nov 14, 2017
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,763,319
- Issue date Sep 12, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External storage device and method of manufacturing external storag...
- Patent number 9,666,659
- Issue date May 30, 2017
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic modules having grounded electromagnetic shields
- Patent number 9,661,739
- Issue date May 23, 2017
- Qorvo US, Inc.
- Donald Joseph Leahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting power leads to circuit board
- Patent number 9,661,757
- Issue date May 23, 2017
- NEC Energy Solutions, Inc.
- Peter Andrew John Finn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch cord having a plug with contacts having a curved segment exte...
- Patent number 9,570,855
- Issue date Feb 14, 2017
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichannel RF feedthroughs
- Patent number 9,538,637
- Issue date Jan 3, 2017
- Finisar Corporation
- Yan yang Zhao
- G02 - OPTICS
Information Patent Grant
Connection board, optoelectronic component arrangement and illumina...
- Patent number 9,521,747
- Issue date Dec 13, 2016
- Osram Opto Semiconductors GmbH
- Michael Rasp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication patch cord having a plug with contact blades connecte...
- Patent number 9,509,107
- Issue date Nov 29, 2016
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly and female connector used for the same
- Patent number 9,478,879
- Issue date Oct 25, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshi Iwano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attenuation reduction grounding pattern structure for connection pa...
- Patent number 9,462,679
- Issue date Oct 4, 2016
- Advanced Flexible Circuits Co., Ltd.
- Ching-Cheng Tien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High voltage polymer dielectric capacitor isolation device
- Patent number 9,408,302
- Issue date Aug 2, 2016
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patch cord having a plug contact with a signal injection point in i...
- Patent number 9,337,584
- Issue date May 10, 2016
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 9,313,889
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Kyoungsuk Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for the measurement of cardiac output
- Patent number 9,289,141
- Issue date Mar 22, 2016
- Micropen Technologies Corporation
- Guy Russell Lowery
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,155,195
- Issue date Oct 6, 2015
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device including a light emitting element mounted on...
- Patent number 9,119,304
- Issue date Aug 25, 2015
- Samsung Electronics Co., Ltd.
- Yu-Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication plug having a printed circuit board with surface moun...
- Patent number 9,054,460
- Issue date Jun 9, 2015
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE TO PRINTED CIRCUIT BOARD TRANSITION
- Publication number 20210195740
- Publication date Jun 24, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM FOR A PACKAGE SUBSTRATE
- Publication number 20200303270
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- So Young LIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
- Publication number 20200185350
- Publication date Jun 11, 2020
- AZUREWAVE TECHNOLOGIES, INC.
- Chuan Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Conductive Terminal And Connector Assembly
- Publication number 20190229445
- Publication date Jul 25, 2019
- Tyco Electronics (Shanghai) Co. Ltd.
- Xiaozhi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...
- Publication number 20190122943
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- So Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20150327363
- Publication date Nov 12, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINA...
- Publication number 20140345918
- Publication date Nov 27, 2014
- Michael Rasp
- F21 - LIGHTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20140328031
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- KYOUNGSUK YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...
- Publication number 20140318833
- Publication date Oct 30, 2014
- ADVANCED FLEXBLE CIRCUITS CO., LTD.
- CHING-CHENG TIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTERNAL STORAGE DEVICE AND METHOD OF MANUFACTURING EXTERNAL STORAG...
- Publication number 20140191363
- Publication date Jul 10, 2014
- RENESAS ELECTRONICS CORPORATION
- Yasutaka Nakashiba
- G11 - INFORMATION STORAGE
Information Patent Application
COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR SOCKET
- Publication number 20140043782
- Publication date Feb 13, 2014
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- G01 - MEASURING TESTING
Information Patent Application
CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME
- Publication number 20140017938
- Publication date Jan 16, 2014
- Hiroshi IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE-CONDUCTING FLEXIBLE-CIRCUIT FLAT CABLE WITH CLUSTER SEC...
- Publication number 20130277095
- Publication date Oct 24, 2013
- GWUN-JIN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Form-Factor Modular Plugs with Low-Profile Surface Mounted Pr...
- Publication number 20130210288
- Publication date Aug 15, 2013
- CommScope, Inc. of North Carolina
- Richard A. Schumacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Communications Plugs Having Plug Blades with Staggered Current-Carr...
- Publication number 20130210289
- Publication date Aug 15, 2013
- Richard A. Schumacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CAPABLE OF SELECTIVELY USING DIFFERENT TYPES OF CONNECTORS
- Publication number 20130188306
- Publication date Jul 25, 2013
- Samsung Electronics Co., Ltd.
- Kwang-soo Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130153272
- Publication date Jun 20, 2013
- HON HAI Precision Industry CO., LTD.
- HSING-HUI CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-TERMINAL CONNECTING DEVICE
- Publication number 20130137281
- Publication date May 30, 2013
- DAI-ICHI SEIKO CO., LTD.
- Takeshi HIRAKAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY
- Publication number 20130109244
- Publication date May 2, 2013
- CHIH-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS
- Publication number 20130107468
- Publication date May 2, 2013
- STEC, Inc.
- Mark MOSHAYEDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, CONNECTOR AND ELECTRONIC APPARATUS
- Publication number 20130083505
- Publication date Apr 4, 2013
- SONY CORPORATION
- Noriyuki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF...
- Publication number 20130001606
- Publication date Jan 3, 2013
- Yu-Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHANNEL RF FEEDTHROUGHS
- Publication number 20130001410
- Publication date Jan 3, 2013
- Finisar Corporation
- Yan yang Zhao
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20120320540
- Publication date Dec 20, 2012
- FUJITSU COMPONENT LIMITED
- Osamu Daikuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AN...
- Publication number 20120318852
- Publication date Dec 20, 2012
- Wen-Bing ZHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120247821
- Publication date Oct 4, 2012
- NGK SPARK PLUG CO., LTD.
- Toshihisa NOMURA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS
- Publication number 20120217048
- Publication date Aug 30, 2012
- RF Micro Devices, Inc.
- Donald Joseph Leahy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pad close to a hole, not surrounding the hole

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package to printed circuit board transition

Package to printed circuit board transition

Film for a package substrate

Multichannel RF feedthroughs

Resin substrate, component-mounting resin substrate, and method of...

Conductive terminal and connector assembly

Film for package substrate, semiconductor package, display device,...

Printed wiring board and method for manufacturing the same

Printed circuit board via design

Manufacturing method of part-mounting package

Method of fabricating touch screen panel

High voltage polymer dielectric capacitor isolation device

RJ-45 communication plug with plug blades received in apertures in...

Package substrate and method for manufacturing package substrate

External storage device and method of manufacturing external storag...

Electronic modules having grounded electromagnetic shields

Connecting power leads to circuit board

Patch cord having a plug with contacts having a curved segment exte...

Multichannel RF feedthroughs

Connection board, optoelectronic component arrangement and illumina...

Communication patch cord having a plug with contact blades connecte...

Connector assembly and female connector used for the same

Attenuation reduction grounding pattern structure for connection pa...

High voltage polymer dielectric capacitor isolation device

Patch cord having a plug contact with a signal injection point in i...

Display apparatus

Apparatus and methods for the measurement of cardiac output

Wiring board and semiconductor device

Light emitting device including a light emitting element mounted on...

Communication plug having a printed circuit board with surface moun...

Patents Applicationslast 30 patents

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

PACKAGE TO PRINTED CIRCUIT BOARD TRANSITION

FILM FOR A PACKAGE SUBSTRATE

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

Conductive Terminal And Connector Assembly

FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINA...

DISPLAY APPARATUS

ATTENUATION REDUCTION GROUNDING PATTERN STRUCTURE FOR CONNECTION PA...

EXTERNAL STORAGE DEVICE AND METHOD OF MANUFACTURING EXTERNAL STORAG...

COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR SOCKET

CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME

DOUBLE-SIDE-CONDUCTING FLEXIBLE-CIRCUIT FLAT CABLE WITH CLUSTER SEC...

WIRING BOARD AND SEMICONDUCTOR DEVICE

Small Form-Factor Modular Plugs with Low-Profile Surface Mounted Pr...

Communications Plugs Having Plug Blades with Staggered Current-Carr...

APPARATUS CAPABLE OF SELECTIVELY USING DIFFERENT TYPES OF CONNECTORS

PRINTED CIRCUIT BOARD

CIRCUIT-TERMINAL CONNECTING DEVICE

ELECTRICAL CONNECTOR ASSEMBLY

APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS

WIRING BOARD, CONNECTOR AND ELECTRONIC APPARATUS

SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF...

MULTICHANNEL RF FEEDTHROUGHS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AN...

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS