Pads along the edge of rigid circuit boards

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CPC
H05K1/117

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/117Pads along the edge of rigid circuit boards

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device interconnect
- Patent number 12,235,691
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,232,258
- Issue date Feb 18, 2025
- Innolux Corporation
- Shang-Ru Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device and electronic device including the same
- Patent number 12,219,721
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yusuf Cinar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,219,705
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Eon Jong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards for high-power applications
- Patent number 12,218,450
- Issue date Feb 4, 2025
- FCI USA LLC
- Charles Copper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,171,063
- Issue date Dec 17, 2024
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 12,137,521
- Issue date Nov 5, 2024
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Industrial control system cable
- Patent number 12,120,819
- Issue date Oct 15, 2024
- Analog Devices, Inc.
- Albert Rooyakkers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display system and a pad configuration adaptable thereto
- Patent number 12,096,557
- Issue date Sep 17, 2024
- Himax Technologies Limited
- Hui-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,045,414
- Issue date Jul 23, 2024
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Xuerui Gong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory system
- Patent number 12,041,719
- Issue date Jul 16, 2024
- Kioxia Corporation
- Gen Watari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnectable circuit boards adapted for three-dimensional const...
- Patent number 12,016,121
- Issue date Jun 18, 2024
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing card system with accessible internal layers and edge inte...
- Patent number 12,016,120
- Issue date Jun 18, 2024
- Dell Products L.P.
- Charles William Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid card-edge connectors and power terminals for high-power appl...
- Patent number 12,009,613
- Issue date Jun 11, 2024
- FCI USA LLC
- Rongzhe Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 11,956,899
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection device
- Patent number 11,955,869
- Issue date Apr 9, 2024
- Mikuni Corporation
- Ichiro Tsuji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hard disk drive suspension pad pre-solder sidewalls
- Patent number 11,908,497
- Issue date Feb 20, 2024
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, electronic device package, and electronic device
- Patent number 11,882,654
- Issue date Jan 23, 2024
- Kyocera Corporation
- Makoto Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device and electronic device including the same
- Patent number 11,877,410
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Yusuf Cinar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EFFICIENTLY CONNECTING MANY HIGH DENSITY SMT PCB/BACKPLA...
- Publication number 20250071903
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Casey Glenn Thielen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20250063662
- Publication date Feb 20, 2025
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR PLUG-IN TYPE BREAKERS
- Publication number 20250063663
- Publication date Feb 20, 2025
- VERTIV CORPORATION
- Yahya SAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL SPEED INCREASE IN A CONNECTOR WIPE
- Publication number 20250040031
- Publication date Jan 30, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...
- Publication number 20250040049
- Publication date Jan 30, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...
- Publication number 20250024603
- Publication date Jan 16, 2025
- Plume Design, Inc.
- Ming-Tsung SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID CARD-EDGE CONNECTORS AND POWER TERMINALS FOR HIGH-POWER APPL...
- Publication number 20250015528
- Publication date Jan 9, 2025
- FCI USA LLC
- Rongzhe Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Wearable Battery and System
- Publication number 20250016924
- Publication date Jan 9, 2025
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS
- Publication number 20250008654
- Publication date Jan 2, 2025
- Corning Incorporated
- Sean Matthew Garner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...
- Publication number 20250008653
- Publication date Jan 2, 2025
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME
- Publication number 20240364291
- Publication date Oct 31, 2024
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240349428
- Publication date Oct 17, 2024
- U-BLOX AG
- Anthony Gergis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ON FLEX
- Publication number 20240338093
- Publication date Oct 10, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xuerui GONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional Wired Circuit Board Structure
- Publication number 20240292538
- Publication date Aug 29, 2024
- Guangzhou Kanglong Electronics Co., Ltd.
- Tielong KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB
- Publication number 20240291181
- Publication date Aug 29, 2024
- GUANGZHOU KANGLONG ELECTRONICS CO., LTD.
- Tielong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION CABLE STRUCTURE
- Publication number 20240276644
- Publication date Aug 15, 2024
- ELKA INTERNATIONAL LTD.
- YI-CHIEH CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240268025
- Publication date Aug 8, 2024
- Yunnan Invensight Optoelectronics Technology Co., Ltd.
- Xiao BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DUAL IN-LINE MEMORY MODULE
- Publication number 20240260195
- Publication date Aug 1, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECHARGEABLE BATTERY PACK
- Publication number 20240243499
- Publication date Jul 18, 2024
- Samsung SDI Co., Ltd.
- Jaepil AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL IN-LINE MEMORY MODULE (DIMM) SOLUTION THAT INCLUDES FLEXIBLE T...
- Publication number 20240237193
- Publication date Jul 11, 2024
- Intel Corporation
- Yi HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD STACK STRUCTURE, AND ELECTRON...
- Publication number 20240224425
- Publication date Jul 4, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- XieYuan LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery
- Publication number 20240224424
- Publication date Jul 4, 2024
- Inventus Power, Inc.
- Paul John Kudrna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240206065
- Publication date Jun 20, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPLANAR CARD-EDGE CONNECTOR
- Publication number 20240204434
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Phillip V. Mann
- H01 - BASIC ELECTRIC ELEMENTS

Pads along the edge of rigid circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device interconnect

Electronic device

Memory device and electronic device including the same

Apparatus and power module

Flexible printed circuit board, COF module, and electronic device c...

Circuit boards for high-power applications

Method and apparatus for flexible circuit cable attachment

Backplane footprint for high speed, high density electrical connectors

Multilayer circuit board

Industrial control system cable

Conformal wearable battery and system

Reciprocal PCB manufacturing process

Display system and a pad configuration adaptable thereto

Multi-level printed circuit boards and memory modules including the...

Display device

Memory system

Semiconductor chip module

Interconnectable circuit boards adapted for three-dimensional const...

Computing card system with accessible internal layers and edge inte...

Hybrid card-edge connectors and power terminals for high-power appl...

Electronic component

Display panel and display device including the same

Detection device

Power module

Hard disk drive suspension pad pre-solder sidewalls

Electronic device housings with patterned electrolytic plating layers

Edge connector, circuit board, and connector component

Power system

Wiring board, electronic device package, and electronic device

Memory device and electronic device including the same

Patents Applicationslast 30 patents

METHOD FOR EFFICIENTLY CONNECTING MANY HIGH DENSITY SMT PCB/BACKPLA...

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

PRINTED CIRCUIT BOARD FOR PLUG-IN TYPE BREAKERS

SIGNAL SPEED INCREASE IN A CONNECTOR WIPE

WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...

POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...

HYBRID CARD-EDGE CONNECTORS AND POWER TERMINALS FOR HIGH-POWER APPL...

Conformal Wearable Battery and System

METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS

INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

CHIP ON FLEX

SEMICONDUCTOR STORAGE DEVICE

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

Three-Dimensional Wired Circuit Board Structure

BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB

TRANSMISSION CABLE STRUCTURE

DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

EMBEDDED DUAL IN-LINE MEMORY MODULE

RECHARGEABLE BATTERY PACK

DUAL IN-LINE MEMORY MODULE (DIMM) SOLUTION THAT INCLUDES FLEXIBLE T...

CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD STACK STRUCTURE, AND ELECTRON...

Conformal Wearable Battery

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

COPLANAR CARD-EDGE CONNECTOR