Paste or slurry or powder

Industry

CPC
H05K3/3484

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3484Paste or slurry or powder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and its manufacturing method
- Patent number 10,834,819
- Issue date Nov 10, 2020
- Canon Kabushiki Kaisha
- Dai Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 10,834,824
- Issue date Nov 10, 2020
- Landa Labs (2012) Ltd.
- Benzion Landa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and device for jetting droplets
- Patent number 10,786,858
- Issue date Sep 29, 2020
- Mycronic AB
- Andreas Bergström
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for the manufacturing of printed wiring boards...
- Patent number 10,779,451
- Issue date Sep 15, 2020
- BotFactory, Inc.
- Michael Knox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, chip solder, solder paste, and solder joint
- Patent number 10,773,345
- Issue date Sep 15, 2020
- Senju Metal Industry Co., Ltd.
- Ken Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder inspection apparatus and method of generating feedback infor...
- Patent number 10,747,198
- Issue date Aug 18, 2020
- Koh Young Technology Inc.
- Jeong Yeob Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Viscous fluid supply device
- Patent number 10,722,964
- Issue date Jul 28, 2020
- FUJI CORPORATION
- Shoji Fukakusa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lift tool assembly for stencil printer
- Patent number 10,723,117
- Issue date Jul 28, 2020
- Illinois Tool Works Inc.
- Daniel Mariano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable temperature controlled soldering iron
- Patent number 10,716,220
- Issue date Jul 14, 2020
- OK INTERNATIONAL, INC.
- Hoa Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste
- Patent number 10,702,954
- Issue date Jul 7, 2020
- Namics Corporation
- Yoshiaki Yoshii
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Edge lock assembly for a stencil printer
- Patent number 10,703,089
- Issue date Jul 7, 2020
- Illinois Tool Works Inc.
- Daniel Mariano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of applying thermal interface materials to board level shields
- Patent number 10,687,447
- Issue date Jun 16, 2020
- Laird Technologies, Inc.
- Sri Talpallikar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board inspecting apparatus, method for detecting an...
- Patent number 10,684,321
- Issue date Jun 16, 2020
- Koh Young Technology Inc.
- Jeong Kyu Noh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board inspecting apparatus, method for determining...
- Patent number 10,674,651
- Issue date Jun 2, 2020
- Koh Young Technology Inc.
- Jae Hyung Kim
- G01 - MEASURING TESTING
Information Patent Grant
Stencil frames
- Patent number 10,660,215
- Issue date May 19, 2020
- Alpha Assembly Solutions Inc.
- Péter Kászli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a stacked inductor-electronic package
- Patent number 10,643,959
- Issue date May 5, 2020
- Intersil Americas LLC
- Zaki Moussaoui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable temperature controlled soldering iron
- Patent number 10,645,817
- Issue date May 5, 2020
- OK INTERNATIONAL, INC.
- Hoa Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 10,645,815
- Issue date May 5, 2020
- Landa Labs (2012) Ltd.
- Benzion Landa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Self-heating solder flux material
- Patent number 10,610,980
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for jetting droplets
- Patent number 10,610,942
- Issue date Apr 7, 2020
- Mycronic AB
- Andreas Bergström
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste for reduction gas, and method for producing soldered p...
- Patent number 10,610,981
- Issue date Apr 7, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,576,566
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film, manufacturing method thereof, and conn...
- Patent number 10,575,410
- Issue date Feb 25, 2020
- Dexerials Corporation
- Kenichi Haga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
2D metrology technique for solder paste inspection
- Patent number 10,572,992
- Issue date Feb 25, 2020
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 10,492,297
- Issue date Nov 26, 2019
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solder paste
- Patent number 10,456,871
- Issue date Oct 29, 2019
- Heraeus Deutschland GmbH & Co. KG
- Sebastian Fritzsche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a soldered connection
- Patent number 10,456,870
- Issue date Oct 29, 2019
- Heraeus Deutschland GmbH & Co. KG
- Sebastian Fritzsche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport
- Publication number 20210143080
- Publication date May 13, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20200404795
- Publication date Dec 24, 2020
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Stacking Printed Circuit Board Assemblies...
- Publication number 20200367367
- Publication date Nov 19, 2020
- Jabil Inc.
- Zambri Bin Samsudin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Manufacturing Electronic Devices
- Publication number 20200352034
- Publication date Nov 5, 2020
- Thomas Bemmerl
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MAKING A STACKED INDUCTOR-ELECTRONIC PACKAGE
- Publication number 20200266159
- Publication date Aug 20, 2020
- INTERSIL AMERICAS LLC
- ZAKI MOUSSAOUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
- Publication number 20200230750
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREEN EXTENDING FRAME
- Publication number 20200236790
- Publication date Jul 23, 2020
- Furetsu Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20200229308
- Publication date Jul 16, 2020
- LANDA LABS (2012) LTD.
- Benzion LANDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SYSTEMS AND METHODS FOR PRECISION PLACEMENT OF COMPONENTS
- Publication number 20200221615
- Publication date Jul 9, 2020
- Engent, Inc.
- Giorgos Hatzilias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And A Method For Producing Such A Printed Cir...
- Publication number 20200187353
- Publication date Jun 11, 2020
- CONTINENTAL AUTOMOTIVE GMBH
- Erich MATTMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD
- Publication number 20200187363
- Publication date Jun 11, 2020
- KOKI COMPANY LIMITED
- Mitsuyasu FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC BOARD COMPRISING SMDS SOLDERED ON BURIED SOLDER PADS
- Publication number 20200170121
- Publication date May 28, 2020
- SAFRAN ELECTRONICS & DEFENSE
- Denis LECORDIER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE TEMPERATURE CONTROLLED SOLDERING IRON
- Publication number 20200163226
- Publication date May 21, 2020
- OK International, Inc.
- Hoa Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
- Publication number 20200128668
- Publication date Apr 23, 2020
- Canon Kabushiki Kaisha
- Dai Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20200113056
- Publication date Apr 9, 2020
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES
- Publication number 20200068711
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas Wolter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190376161
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PERFORMING COMPENSATION ASSOCIATED WITH SCREEN PRINTE...
- Publication number 20190364666
- Publication date Nov 28, 2019
- KOH YOUNG TECHNOLOGY INC.
- Duk Young LEE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
VARIABLE TEMPERATURE CONTROLLED SOLDERING IRON
- Publication number 20190364668
- Publication date Nov 28, 2019
- OK International, Inc.
- Hoa Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING DEVICE AND PRINTING METHOD FOR APPLYING A VISCOUS OR PASTY...
- Publication number 20190320536
- Publication date Oct 17, 2019
- ROBERT BOSCH GmbH
- Guenter Gera
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF GENERATING CONTROL PARAMETER OF SCREEN PRINTER
- Publication number 20190269017
- Publication date Aug 29, 2019
- KOH YOUNG TECHNOLOGY INC.
- Duk Young LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING METHOD, COMPONENT MOUNTING SYSTEM, AND MANUFACTU...
- Publication number 20190254174
- Publication date Aug 15, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TETSUYA TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEATING SOLDER FLUX MATERIAL
- Publication number 20190232439
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
2D METROLOGY TECHNIQUE FOR SOLDER PASTE INSPECTION
- Publication number 20190206038
- Publication date Jul 4, 2019
- Intel Corporation
- Alireza Ashari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20190174634
- Publication date Jun 6, 2019
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR APPLYING OF A CONDUCTIVE PATTERN TO A SUBSTRATE
- Publication number 20190174635
- Publication date Jun 6, 2019
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIAL TEMPERATURE SENSOR FOR STENCIL PRINTER
- Publication number 20190174633
- Publication date Jun 6, 2019
- Illinois Tool Works Inc.
- Patsy A. Mattero
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint
- Publication number 20190070696
- Publication date Mar 7, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Ken TACHIBANA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELEC...
- Publication number 20180332716
- Publication date Nov 15, 2018
- CCL LABEL, INC.
- Jamie Rieg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME
- Publication number 20180229333
- Publication date Aug 16, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Paste or slurry or powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and its manufacturing method

Apparatus for applying of a conductive pattern to a substrate

Method and device for jetting droplets

Apparatus and method for the manufacturing of printed wiring boards...

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Solder inspection apparatus and method of generating feedback infor...

Viscous fluid supply device

Lift tool assembly for stencil printer

Variable temperature controlled soldering iron

Conductive paste

Edge lock assembly for a stencil printer

Methods of applying thermal interface materials to board level shields

Printed circuit board inspecting apparatus, method for detecting an...

Printed circuit board inspecting apparatus, method for determining...

Stencil frames

Method of making a stacked inductor-electronic package

Variable temperature controlled soldering iron

Application of electrical conductors to an electrically insulating...

Self-heating solder flux material

Method and device for jetting droplets

Solder paste for reduction gas, and method for producing soldered p...

Solder paste misprint cleaning

Anisotropic conductive film, manufacturing method thereof, and conn...

2D metrology technique for solder paste inspection

Voiding control using solid solder preforms embedded in solder paste

Hybrid nanosilver/liquid metal ink composition and uses thereof

Solder paste

Method for producing a soldered connection

Resin fluxed solder paste, and mount structure

Mounting structure and method for manufacturing same

Patents Applicationslast 30 patents

Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

Method and Apparatus for Stacking Printed Circuit Board Assemblies...

Methods for Manufacturing Electronic Devices

METHOD OF MAKING A STACKED INDUCTOR-ELECTRONIC PACKAGE

LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING

SCREEN EXTENDING FRAME

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

SYSTEMS AND METHODS FOR PRECISION PLACEMENT OF COMPONENTS

Printed Circuit Board And A Method For Producing Such A Printed Cir...

FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD

ELECTRONIC BOARD COMPRISING SMDS SOLDERED ON BURIED SOLDER PADS

VARIABLE TEMPERATURE CONTROLLED SOLDERING IRON

PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

APPARATUS FOR PERFORMING COMPENSATION ASSOCIATED WITH SCREEN PRINTE...

VARIABLE TEMPERATURE CONTROLLED SOLDERING IRON

PRINTING DEVICE AND PRINTING METHOD FOR APPLYING A VISCOUS OR PASTY...

APPARATUS AND METHOD OF GENERATING CONTROL PARAMETER OF SCREEN PRINTER

COMPONENT MOUNTING METHOD, COMPONENT MOUNTING SYSTEM, AND MANUFACTU...

SELF-HEATING SOLDER FLUX MATERIAL

2D METROLOGY TECHNIQUE FOR SOLDER PASTE INSPECTION

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

APPARATUS FOR APPLYING OF A CONDUCTIVE PATTERN TO A SUBSTRATE

MATERIAL TEMPERATURE SENSOR FOR STENCIL PRINTER

Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint

HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELEC...

SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME