Patterning and lithography Masks Details of resist

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CPC
H05K2203/05

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/05Patterning and lithography Masks Details of resist

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having a sacrificial pad to mitigate galvanic...
- Patent number 12,193,166
- Issue date Jan 7, 2025
- SanDisk Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 12,171,067
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing cured film, method for manufacturing elect...
- Patent number 12,077,677
- Issue date Sep 3, 2024
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,052,831
- Issue date Jul 30, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer printing high-precision devices
- Patent number 12,016,131
- Issue date Jun 18, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of cutting conductive patterns
- Patent number 12,013,643
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High resolution laser induced forward transfer
- Patent number 11,840,097
- Issue date Dec 12, 2023
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Patterning paste
- Patent number 11,753,561
- Issue date Sep 12, 2023
- PPG Industries Ohio, Inc.
- Paul F. Cheetham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of producing wiring board that includes dual-layered insulat...
- Patent number 11,751,340
- Issue date Sep 5, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,737,209
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil and method for manufacturing the same
- Patent number 11,688,553
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ceramic electronic component
- Patent number 11,659,659
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Naoya Murakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposure system, circuit board, and method for making circuit board
- Patent number 11,647,592
- Issue date May 9, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ching-Lung Chuang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-SOLDER BUMP PREVENTIVE OVERCOATING
- Publication number 20240428821
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237198
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...
- Publication number 20240237232
- Publication date Jul 11, 2024
- HANNSTAR DISPLAY CORPORATION
- Pei-Hao Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...
- Publication number 20240134277
- Publication date Apr 25, 2024
- Resonac Corporation
- Yuta DAIJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240015888
- Publication date Jan 11, 2024
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20230420343
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Huifang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...
- Publication number 20230413453
- Publication date Dec 21, 2023
- STEMCO CO., LTD.
- Sung Jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...
- Publication number 20230337372
- Publication date Oct 19, 2023
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD
- Publication number 20230269885
- Publication date Aug 24, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20230217598
- Publication date Jul 6, 2023
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230209710
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Su Min SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...
- Publication number 20230199968
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patterning and lithography Masks Details of resist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board having a sacrificial pad to mitigate galvanic...

Circuit board and manufacturing method thereof and electronic device

Method of manufacturing printed wiring board

Printed circuit board and method for manufacturing the same

Flexible circuit board with thermally conductive connection to a he...

Method for manufacturing cured film, method for manufacturing elect...

Through-hole electrode substrate

Circuit board and method for manufacturing the same

Wiring board

On-demand method of making PCB pallets using additive manufacturing

Printed circuit board and method for manufacturing the same

Transfer printing high-precision devices

Method of cutting conductive patterns

Protection tape for printed circuit board and display device includ...

Single-layer circuit board, multi-layer circuit board, and manufact...

Electronic device housings with patterned electrolytic plating layers

Printed circuit board and method of manufacturing the same

Catalyzed metal foil and uses thereof

High resolution laser induced forward transfer

Resist layer forming method, method for manufacturing wiring board,...

Methods for producing an etch resist pattern on a metallic surface

Patterning paste

Method of producing wiring board that includes dual-layered insulat...

Method for manufacturing a circuit having a lamination layer using...

Circuit board and manufacturing method thereof and electronic device

Electroless metal-defined thin pad first level interconnects for li...

Multilayer printed wiring board and method of manufacturing the same

Multilayer coil and method for manufacturing the same

Ceramic electronic component

Exposure system, circuit board, and method for making circuit board

Patents Applicationslast 30 patents

METHOD AND ELECTRICAL CONTACT ELEMENT

PRE-SOLDER BUMP PREVENTIVE OVERCOATING

THROUGH-HOLE ELECTRODE SUBSTRATE

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

CIRCUIT STRUCTURE

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Printed Circuit Board And Method For Soldering A Chip Housing In A...

TRANSFER PRINTING HIGH-PRECISION DEVICES

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...

Carrier Substrate

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

WIRING BOARD

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD

TRANSFER PRINTING HIGH-PRECISION DEVICES

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...