Patterning on via walls Plural lands around one hole

Industry

CPC
H05K2201/09645

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09645Patterning on via walls Plural lands around one hole

Industries

Patents Grantslast 30 patents

Information Patent Grant
Through-hole via and circuit board
- Patent number 11,778,742
- Issue date Oct 3, 2023
- NEC Corporation
- Takuya Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,765,827
- Issue date Sep 19, 2023
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 11,716,811
- Issue date Aug 1, 2023
- Ibiden Co., Ltd.
- Kenji Murase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,457,525
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,357,105
- Issue date Jun 7, 2022
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,184,977
- Issue date Nov 23, 2021
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,887,989
- Issue date Jan 5, 2021
- Sumitomo Electric Printed Circuits, Inc.
- Tadahiro Kaibuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coupled via structure, circuit board having the coupled via structu...
- Patent number 10,887,980
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Dong-Yoon Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated opening with vent path
- Patent number 10,834,817
- Issue date Nov 10, 2020
- NXP USA, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,820,427
- Issue date Oct 27, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,813,214
- Issue date Oct 20, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of manufacturing the same
- Patent number 10,785,865
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic device, and design support method of substrate
- Patent number 10,777,497
- Issue date Sep 15, 2020
- Fujitsu Limited
- Takahito Takemoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board
- Patent number 10,779,408
- Issue date Sep 15, 2020
- KYOCERA Corporation
- Takashi Ishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,712,664
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,667,390
- Issue date May 26, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure between flat cable and electronic circuit board
- Patent number 10,608,359
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd
- Sung-soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection system with flexible pins
- Patent number 10,408,860
- Issue date Sep 10, 2019
- Intel Corporation
- Jorge A. Alvarez Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board
- Patent number 10,368,446
- Issue date Jul 30, 2019
- NextGin Technology BV
- J.A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,362,687
- Issue date Jul 23, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact via structures and method of making same
- Patent number 10,249,924
- Issue date Apr 2, 2019
- Intel Corporation
- Kai Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminate provided with protective layer and multilayere...
- Patent number 10,244,640
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,201,098
- Issue date Feb 5, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,123,432
- Issue date Nov 6, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing impedance discontinuities on a printed circuit board (‘PCB’)
- Patent number 10,045,434
- Issue date Aug 7, 2018
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Candice L. Coletrane
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,034,391
- Issue date Jul 24, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,015,881
- Issue date Jul 3, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 9,986,642
- Issue date May 29, 2018
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20220386451
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220346231
- Publication date Oct 27, 2022
- IBIDEN CO., LTD.
- Kenji MURASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232695
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20210007215
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200383204
- Publication date Dec 3, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20200245461
- Publication date Jul 30, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Tadahiro KAIBUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...
- Publication number 20200178386
- Publication date Jun 4, 2020
- Samsung Electronics Co., Ltd.
- Dong-Yoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20200120799
- Publication date Apr 16, 2020
- Kyocera Corporation
- Takashi ISHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200015364
- Publication date Jan 9, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20190075662
- Publication date Mar 7, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180317327
- Publication date Nov 1, 2018
- Sanmina Corporation
- Shinichi IKETANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS
- Publication number 20180310418
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig KALLMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cavities Containing Multi-wiring Structures And Devices
- Publication number 20180295718
- Publication date Oct 11, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20180098426
- Publication date Apr 5, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180027648
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED DEVICE
- Publication number 20170343204
- Publication date Nov 30, 2017
- Molex, LLC
- Yi-Tse HO
- F21 - LIGHTING
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170231083
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, SENSOR, AND PRINTED CIRCUIT BOARD FOR SENSING POSITION OR M...
- Publication number 20170089734
- Publication date Mar 30, 2017
- ABB Schweiz AG
- Kimmo Tolsa
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170094773
- Publication date Mar 30, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Il-Jong SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20150173196
- Publication date Jun 18, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES
- Publication number 20150101858
- Publication date Apr 16, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150034377
- Publication date Feb 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- B32 - LAYERED PRODUCTS
Information Patent Application
Z-Directed Capacitor Components for Printed Circuit Boards
- Publication number 20140368966
- Publication date Dec 18, 2014
- Keith Bryan Hardin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20140262455
- Publication date Sep 18, 2014
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20140251663
- Publication date Sep 11, 2014
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extrusion Process for Manufacturing a Z-Directed Component for a Pr...
- Publication number 20140237816
- Publication date Aug 28, 2014
- Lexmark International, Inc.
- Paul Kevin Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT, LIGHT SOURCE DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20140198469
- Publication date Jul 17, 2014
- Hiroyuki BASHO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
- Publication number 20140190733
- Publication date Jul 10, 2014
- PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
- George Dudnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20140151104
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yul Kyo CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patterning on via walls Plural lands around one hole

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-hole via and circuit board

Simultaneous and selective wide gap partitioning of via structures...

Interconnect structure having conductor extending along dielectric...

Printed wiring board

Interconnect structure having conductor extending along dielectric...

Method for producing a printed circuit board

Simultaneous and selective wide gap partitioning of via structures...

Method for producing a printed circuit board

Printed wiring board

Coupled via structure, circuit board having the coupled via structu...

Plated opening with vent path

Simultaneous and selective wide gap partitioning of via structures...

Cavities containing multi-wiring structures and devices

Interconnect structure and method of manufacturing the same

Substrate, electronic device, and design support method of substrate

Printed wiring board

Forming conductive vias using a light guide

Simultaneous and selective wide gap partitioning of via structures...

Connection structure between flat cable and electronic circuit board

Interconnection system with flexible pins

Method for producing a printed circuit board

Simultaneous and selective wide gap partitioning of via structures...

Compact via structures and method of making same

Copper clad laminate provided with protective layer and multilayere...

Selective partitioning of via structures in printed circuit boards

Simultaneous and selective wide gap partitioning of via structures...

Reducing impedance discontinuities on a printed circuit board (‘PCB’)

Selective partitioning of via structures in printed circuit boards

Cavities containing multi-wiring structures and devices

Method for manufacturing printed wiring board and printed wiring board

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

PRINTED WIRING BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

INTERCONNECT STRUCTURE

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

PRINTED WIRING BOARD

COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...

PRINTED WIRING BOARD

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS

SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS

Cavities Containing Multi-wiring Structures And Devices

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LED DEVICE

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD, SENSOR, AND PRINTED CIRCUIT BOARD FOR SENSING POSITION OR M...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES

GLASS CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Z-Directed Capacitor Components for Printed Circuit Boards

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

Extrusion Process for Manufacturing a Z-Directed Component for a Pr...

ELECTRONIC CIRCUIT, LIGHT SOURCE DEVICE, AND METHOD OF MANUFACTURIN...

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...