PCBs

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CPC
B32B2457/08

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BPERFORMING OPERATIONS TRANSPORTING B32Layered products B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT B32B2457/00Electrical equipment

Current Industry

B32B2457/08PCBs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Delamination processes and fabrication of thin film devices thereby
- Patent number 12,322,635
- Issue date Jun 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,312,452
- Issue date May 27, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Wada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition for protective layer of electromagnetic wave-shie...
- Patent number 12,297,333
- Issue date May 13, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,295,098
- Issue date May 6, 2025
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Loss-dissipation flexible copper clad laminate, manufacturing metho...
- Patent number 12,286,511
- Issue date Apr 29, 2025
- CPC CORPORATION, TAIWAN
- Ching-Hsuan Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for compressing laminate and method for manufacturing cerami...
- Patent number 12,275,220
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong Min Hong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fiber sheet, and layered body, circuit board and electronic board u...
- Patent number 12,273,996
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminator
- Patent number 12,274,009
- Issue date Apr 8, 2025
- Doosan Corporation
- Sungmoon Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 12,267,954
- Issue date Apr 1, 2025
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonded assembly, and ceramic circuit substrate and semiconductor de...
- Patent number 12,240,218
- Issue date Mar 4, 2025
- Kabushiki Kaisha Toshiba
- Shota Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting epoxy resin composition and prepreg, laminated board...
- Patent number 12,234,318
- Issue date Feb 25, 2025
- SHENGYI TECHNOLOGY CO., LTD.
- Yong Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoplastic liquid crystal polymer molded body and method for man...
- Patent number 12,233,620
- Issue date Feb 25, 2025
- Kuraray Co., Ltd.
- Tatsuya Sunamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polymer compositions and coating solutions
- Patent number 12,234,374
- Issue date Feb 25, 2025
- DUPONT ELECTRONICS, INC.
- Kostantinos Kourtakis
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin, composition thereof and copper clad laminate made thereof
- Patent number 12,227,646
- Issue date Feb 18, 2025
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulating film, metal-clad laminate member, and rewiring layer
- Patent number 12,221,536
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Cheng Ping Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Polymer composition and film for use in 5G applications
- Patent number 12,209,164
- Issue date Jan 28, 2025
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal clad laminate and production method thereof
- Patent number 12,172,408
- Issue date Dec 24, 2024
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal clad laminated plate and method for manufacturing metal clad...
- Patent number 12,162,257
- Issue date Dec 10, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masaya Koyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Interconnected corrugated carbon-based network
- Patent number 12,153,032
- Issue date Nov 26, 2024
- The Regents of the University of California
- Veronica Strong
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,145,352
- Issue date Nov 19, 2024
- DOWA METALTECH CO, LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of producing print board
- Patent number 12,138,943
- Issue date Nov 12, 2024
- Noda Screen Co., Ltd.
- Yasumitsu Mori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier foil-attached metal foil, method of manufacturing the same,...
- Patent number 12,139,811
- Issue date Nov 12, 2024
- YMT CO., LTD.
- Hyun Woo Jeon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition and prepreg, laminate and printed c...
- Patent number 12,122,904
- Issue date Oct 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Huayong Fan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and prepreg, resin-coated film, resin-coated met...
- Patent number 12,122,129
- Issue date Oct 22, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...
- Publication number 20250178313
- Publication date Jun 5, 2025
- FUJIFILM CORPORATION
- Daisuke HAYASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...
- Publication number 20250163222
- Publication date May 22, 2025
- SHENGYI TECHNOLOGY (SUZHOU) CO., LTD
- Xiangxiu CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLUORORESIN COMPOSITION, FLUORORESIN FILM, LAMINATED FILM, AND META...
- Publication number 20250145814
- Publication date May 8, 2025
- ARISAWA MFG. CO., LTD.
- Akira Fujita
- B32 - LAYERED PRODUCTS
Information Patent Application
FLUORORESIN FILM, METAL-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT
- Publication number 20250145781
- Publication date May 8, 2025
- DAIKIN INDUSTRIES, LTD.
- Masahiko KAWAMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN...
- Publication number 20250136741
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Yuji YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
STRETCHABLE LAMINATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20250115036
- Publication date Apr 10, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Kyosuke MICHIGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...
- Publication number 20250112092
- Publication date Apr 3, 2025
- Intel Corportation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250108582
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Yuichi ISHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ALLYL-TYPE FLAME-RETARDANT PREPOLYMER, RESIN COMPOSITION, COMPOSITE...
- Publication number 20250084199
- Publication date Mar 13, 2025
- GUANGDONG HINNO-TECH CO., LTD.
- Xiaolong QI
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM, LAMINATE, WIRING BOARD, LAMINATED WIRING BOARD, AND MANUFACTU...
- Publication number 20250074041
- Publication date Mar 6, 2025
- FUJIFILM CORPORATION
- Akira YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD
- Publication number 20250065617
- Publication date Feb 27, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Takenori YANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20250042144
- Publication date Feb 6, 2025
- TCLAD TECHNOLOGY CORPORATION
- Kai-Wei LO
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods of Manufacturing Hybrid Magnetic Substrate, Via-based Ferri...
- Publication number 20240395457
- Publication date Nov 28, 2024
- Winchester Technologies, LLC.
- Xiaoling Shi
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20240357740
- Publication date Oct 24, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
- Publication number 20240343027
- Publication date Oct 17, 2024
- LG ELECTRONICS INC.
- Takashi KINO
- B32 - LAYERED PRODUCTS
Information Patent Application
Glass Bubbles and Articles Therefrom
- Publication number 20240327270
- Publication date Oct 3, 2024
- 3M Innovative Properties Company
- Yong K. Wu
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...
- Publication number 20240287360
- Publication date Aug 29, 2024
- AJINOMOTO CO., INC.
- Kenji KAWAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND...
- Publication number 20240278536
- Publication date Aug 22, 2024
- Resonac Corporation
- Kitaru SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
System and Method for Physical Activity Performance Analysis
- Publication number 20240274031
- Publication date Aug 15, 2024
- Motion Metrics Limited
- James Bruce Alexander Grant
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYESTERIMIDE RESIN COMPOSITION, POLYESTERIMIDE RESIN LAYER, FLEXI...
- Publication number 20240254286
- Publication date Aug 1, 2024
- NexFlex Co., Ltd.
- Hyuk Jun KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit Board for Use at 5G Frequencies
- Publication number 20240244743
- Publication date Jul 18, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTA...
- Publication number 20240227373
- Publication date Jul 11, 2024
- Toyobo Co., Ltd.
- Kaya TOKUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
CORE LAYER FOR INFORMATION CARRYING CARD, RESULTING INFORMATION CAR...
- Publication number 20240227379
- Publication date Jul 11, 2024
- X-CARD HOLDINGS, LLC
- Mark A. Cox
- B32 - LAYERED PRODUCTS
Information Patent Application
Fluoropolymer Compositions and Methods Suitable for Copper Substrat...
- Publication number 20240227357
- Publication date Jul 11, 2024
- 3M Innovative Properties Company
- Naiyong Jing
- B32 - LAYERED PRODUCTS
Information Patent Application
FLUORORESIN COMPOSITION, FLUORORESIN SHEET, LAMINATE AND SUBSTRATE...
- Publication number 20240215161
- Publication date Jun 27, 2024
- DAIKIN INDUSTRIES, LTD.
- Hirokazu KOMORI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240190112
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kosuke TSUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...
- Publication number 20240183052
- Publication date Jun 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Peter HAACK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Delamination processes and fabrication of thin film devices thereby

Preparation method for copper clad laminate having low dielectric c...

Resin composition, prepreg, film with resin, metal foil with resin,...

Resin composition for protective layer of electromagnetic wave-shie...

Multilayer board and manufacturing method thereof

Loss-dissipation flexible copper clad laminate, manufacturing metho...

Method for compressing laminate and method for manufacturing cerami...

Multilayer resin substrate and method for producing same

Fiber sheet, and layered body, circuit board and electronic board u...

Laminator

Fluororesin composition, fluororesin sheet, laminate and substrate...

Bonded assembly, and ceramic circuit substrate and semiconductor de...

Thermosetting epoxy resin composition and prepreg, laminated board...

Thermoplastic liquid crystal polymer molded body and method for man...

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Polymer compositions and coating solutions

Resin, composition thereof and copper clad laminate made thereof

Insulating film, metal-clad laminate member, and rewiring layer

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Method for manufacturing dielectric sheet, method for manufacturing...

Polymer composition and film for use in 5G applications

Metal clad laminate and production method thereof

Insulation structures and printed circuit board including the same

Metal clad laminated plate and method for manufacturing metal clad...

Interconnected corrugated carbon-based network

Metal/ceramic bonding substrate and method for producing same

Method of producing print board

Carrier foil-attached metal foil, method of manufacturing the same,...

Thermosetting resin composition and prepreg, laminate and printed c...

Resin composition, and prepreg, resin-coated film, resin-coated met...

Patents Applicationslast 30 patents

LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...

MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...

FLUORORESIN COMPOSITION, FLUORORESIN FILM, LAMINATED FILM, AND META...

FLUORORESIN FILM, METAL-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN...

STRETCHABLE LAMINATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

ALLYL-TYPE FLAME-RETARDANT PREPOLYMER, RESIN COMPOSITION, COMPOSITE...

FILM, LAMINATE, WIRING BOARD, LAMINATED WIRING BOARD, AND MANUFACTU...

SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD

THERMALLY CONDUCTIVE BOARD

Methods of Manufacturing Hybrid Magnetic Substrate, Via-based Ferri...

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...

Glass Bubbles and Articles Therefrom

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...

BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND...

System and Method for Physical Activity Performance Analysis

POLYESTERIMIDE RESIN COMPOSITION, POLYESTERIMIDE RESIN LAYER, FLEXI...

Circuit Board for Use at 5G Frequencies

MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTA...

CORE LAYER FOR INFORMATION CARRYING CARD, RESULTING INFORMATION CAR...

Fluoropolymer Compositions and Methods Suitable for Copper Substrat...

FLUORORESIN COMPOSITION, FLUORORESIN SHEET, LAMINATE AND SUBSTRATE...

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...