Phenols

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CPC
C08G59/621

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CCHEMISTRY METALLURGY C08Organic compounds C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS C08G59/00Polycondensates containing more than one epoxy group per molecule Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups

Current Industry

C08G59/621Phenols

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, prepreg, laminate and metal foil-clad laminate
- Patent number 12,187,887
- Issue date Jan 7, 2025
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi Tang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Highly durable spring and method of coating the same
- Patent number 12,173,766
- Issue date Dec 24, 2024
- Chuo Hatsujo Kabushiki Kaisha
- Takayuki Okamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition
- Patent number 12,116,479
- Issue date Oct 15, 2024
- Sumitomo Bakelite Co., Ltd.
- Jun Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin, epoxy resin composition, epoxy resin cured product and...
- Patent number 12,049,538
- Issue date Jul 30, 2024
- SHOWA DENKO MATERIALS CO., LTD.
- Naoki Maruyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and cured product thereof
- Patent number 12,043,697
- Issue date Jul 23, 2024
- Sumitomo Chemical Company, Limited
- Hirofumi Kato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulation material and semiconductor device
- Patent number 12,033,907
- Issue date Jul 9, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Chika Arayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-resistant protective film forming composition containing h...
- Patent number 11,965,059
- Issue date Apr 23, 2024
- NISSAN CHEMICAL CORPORATION
- Shigetaka Otagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formulation and methods for coating metal surfaces
- Patent number 11,932,777
- Issue date Mar 19, 2024
- Winamac Coil Spring, Inc.
- Paul Thottathil
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High-thermal conductive epoxy compound and composition, material fo...
- Patent number 11,926,695
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Kyeong Pang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for curable resin, cured product of said composition, p...
- Patent number 11,897,998
- Issue date Feb 13, 2024
- ENEOS Corporation
- Yoshinori Nishitani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
SMA resin formulation
- Patent number 11,891,475
- Issue date Feb 6, 2024
- Isola USA Corp.
- Edward Kelley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Macromonomer copolymer, epoxy resin composition, adhesive, molding...
- Patent number 11,884,813
- Issue date Jan 30, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Eri Masuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy compound, composition prepared therefrom, semiconductor devic...
- Patent number 11,827,741
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Changho Noh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy compound, composition prepared therefrom, semiconductor devic...
- Patent number 11,827,742
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jonghoon Won
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and electronic component device
- Patent number 11,767,449
- Issue date Sep 26, 2023
- Resonac Corporation
- Hirokuni Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for encapsulation
- Patent number 11,760,870
- Issue date Sep 19, 2023
- Nagase Chemtex Corporation
- Yosuke Oi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable composition, prepreg, resin sheet, metal foil-clad laminate...
- Patent number 11,718,708
- Issue date Aug 8, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya Tomizawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition for printed wiring board, prepreg, laminate, meta...
- Patent number 11,702,504
- Issue date Jul 18, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Shohei Yamaguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for the production of epoxy resins
- Patent number 11,702,505
- Issue date Jul 18, 2023
- Vito N.V.
- Pablo Ortiz
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive material, device with thermally conductive lay...
- Patent number 11,702,578
- Issue date Jul 18, 2023
- FUJIFILM Corporation
- Seiichi Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy-functionalized novolak resin composition
- Patent number 11,674,035
- Issue date Jun 13, 2023
- Compagnie Generale des Etablissements Michelin
- Gael Pataut
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid molding compound for protecting five edges of semiconductor...
- Patent number 11,643,499
- Issue date May 9, 2023
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for strengthening of metal structures using toughened 2C-epo...
- Patent number 11,643,580
- Issue date May 9, 2023
- Sika Technology AG
- Christoph Mayer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 11,639,438
- Issue date May 2, 2023
- Samsung SDI Co., Ltd.
- Yong Yeop Park
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Porous body, and method for producing porous body
- Patent number 11,613,618
- Issue date Mar 28, 2023
- Emaus Kyoto, Inc.
- Norio Ishizuka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition for curable resin, cured product of said composition, p...
- Patent number 11,584,824
- Issue date Feb 21, 2023
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formulation and methods for coating metal surfaces
- Patent number 11,549,021
- Issue date Jan 10, 2023
- Winimac Coil Spring, Inc.
- Paul Thottathil
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin film for interlayer insulating layer with support, multilayer...
- Patent number 11,553,593
- Issue date Jan 10, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takayuki Suzukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multicomponent epoxide resin composition and curing agent component...
- Patent number 11,542,363
- Issue date Jan 3, 2023
- Hilti Aktiengesellschaft
- Nicole Behrens
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b...
- Patent number 11,535,700
- Issue date Dec 27, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideyuki Katagi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...
- Publication number 20240427246
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tomotada HIROHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COM...
- Publication number 20240409681
- Publication date Dec 12, 2024
- ADEKA CORPORATION
- Shota KOBAYASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, FIBER-REIN...
- Publication number 20240400750
- Publication date Dec 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Daiki WAKAHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...
- Publication number 20240368374
- Publication date Nov 7, 2024
- Namics Corporation
- Makoto SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING COMPOSITIONS
- Publication number 20240336803
- Publication date Oct 10, 2024
- SWIMC LLC
- Weih Q. LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Low Temperature Curable One Component Epoxy Compositions containing...
- Publication number 20240327567
- Publication date Oct 3, 2024
- Evonik Operations GmbH
- Shafiq Fazel
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING H...
- Publication number 20240301126
- Publication date Sep 12, 2024
- NISSAN CHEMICAL CORPORATION
- Shigetaka OTAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND METHOD FOR PRODUCING ADHESIVE COMPOSITION
- Publication number 20240254373
- Publication date Aug 1, 2024
- Toyobo Co., Ltd.
- Takuya SHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20240254279
- Publication date Aug 1, 2024
- Sumitomo Chemical Company, Limited
- Kenichi TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALING RESIN COMPOSITION
- Publication number 20240240011
- Publication date Jul 18, 2024
- SUMITOMO BAKELITE CO., LTD.
- Jun YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRE RETARDANT EPOXY RESIN
- Publication number 20240240012
- Publication date Jul 18, 2024
- SAFRAN CABIN INC.
- Bhaskar Biswas
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHENOL MIXTURE, EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT...
- Publication number 20240217907
- Publication date Jul 4, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Kazumasa OTA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
EPOXY RESIN FOR SEMICONDUCTOR ADHESIVE, PREPARING METHOD THEREOF AN...
- Publication number 20240166796
- Publication date May 23, 2024
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Hyun Aee CHUN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION,...
- Publication number 20240132701
- Publication date Apr 25, 2024
- ENEOS Corporation
- Tatsuki SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVIC...
- Publication number 20240067772
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Changho Noh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVIC...
- Publication number 20240059829
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jonghoon Won
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED PRODUCT, HEAT TRANSFE...
- Publication number 20240052225
- Publication date Feb 15, 2024
- Resonac Corporation
- Hajime YUKUTAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYHYDRIC HYDROXY RESIN, EPOXY RESIN, AND THEIR PRODUCTION METHODS...
- Publication number 20240043606
- Publication date Feb 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
- Publication number 20240034833
- Publication date Feb 1, 2024
- Resonac Corporation
- Yuta SUKEGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
AROMATIC DIOL COMPOUNDS, DIEPOXIDE COMPOUNDS, POLYMERS PREPARED FRO...
- Publication number 20230416449
- Publication date Dec 28, 2023
- SWIMC LLC
- Benoit PROUVOST
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN...
- Publication number 20230272155
- Publication date Aug 31, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- B32 - LAYERED PRODUCTS
Information Patent Application
COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ADHESIVE SURFACE-CO...
- Publication number 20230250323
- Publication date Aug 10, 2023
- NIPPON STEEL CORPORATION
- Kazutoshi TAKEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ESTER COMPOUND AND RESIN COMPOSITION
- Publication number 20230242705
- Publication date Aug 3, 2023
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20230227603
- Publication date Jul 20, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMA Resin Formulation
- Publication number 20230141772
- Publication date May 11, 2023
- Isola USA Corp.
- Edward Kelley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin, Epoxy Compounds, Epoxy Resin Composition, Resin Sheet,...
- Publication number 20230143162
- Publication date May 11, 2023
- NIPPON KAYAKU KABUSHIKI KAISHA
- Yusuke Kawano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN, PREPARING METHOD THEREOF, EPOXY COMPOSITION COMPRISING...
- Publication number 20230146767
- Publication date May 11, 2023
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Hyun Aee CHUN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION
- Publication number 20230134713
- Publication date May 4, 2023
- BASF SE
- Miran YU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTROLYTIC CAPACITOR
- Publication number 20230110194
- Publication date Apr 13, 2023
- NIPPON CHEMI-CON CORPORATION
- Kenta SATO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, prepreg, laminate and metal foil-clad laminate

Highly durable spring and method of coating the same

Sealing resin composition

Epoxy resin, epoxy resin composition, epoxy resin cured product and...

Epoxy resin composition and cured product thereof

Semiconductor encapsulation material and semiconductor device

Chemical-resistant protective film forming composition containing h...

Formulation and methods for coating metal surfaces

High-thermal conductive epoxy compound and composition, material fo...

Composition for curable resin, cured product of said composition, p...

SMA resin formulation

Macromonomer copolymer, epoxy resin composition, adhesive, molding...

Epoxy compound, composition prepared therefrom, semiconductor devic...

Epoxy compound, composition prepared therefrom, semiconductor devic...

Epoxy resin composition and electronic component device

Resin composition for encapsulation

Curable composition, prepreg, resin sheet, metal foil-clad laminate...

Resin composition for printed wiring board, prepreg, laminate, meta...

Process for the production of epoxy resins

Thermally conductive material, device with thermally conductive lay...

Epoxy-functionalized novolak resin composition

Liquid molding compound for protecting five edges of semiconductor...

Method for strengthening of metal structures using toughened 2C-epo...

Epoxy resin composition for encapsulating semiconductor device and...

Porous body, and method for producing porous body

Composition for curable resin, cured product of said composition, p...

Formulation and methods for coating metal surfaces

Resin film for interlayer insulating layer with support, multilayer...

Multicomponent epoxide resin composition and curing agent component...

Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b...

Patents Applicationslast 30 patents

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...

CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COM...

EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, FIBER-REIN...

EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...

EPOXY COATING COMPOSITIONS

Low Temperature Curable One Component Epoxy Compositions containing...

CHEMICAL-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING H...

ADHESIVE COMPOSITION AND METHOD FOR PRODUCING ADHESIVE COMPOSITION

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

SEALING RESIN COMPOSITION

FIRE RETARDANT EPOXY RESIN

PHENOL MIXTURE, EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT...

EPOXY RESIN FOR SEMICONDUCTOR ADHESIVE, PREPARING METHOD THEREOF AN...

COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION,...

EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVIC...

EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVIC...

THERMALLY CONDUCTIVE RESIN COMPOSITION, CURED PRODUCT, HEAT TRANSFE...

POLYHYDRIC HYDROXY RESIN, EPOXY RESIN, AND THEIR PRODUCTION METHODS...

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

AROMATIC DIOL COMPOUNDS, DIEPOXIDE COMPOUNDS, POLYMERS PREPARED FRO...

PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN...

COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ADHESIVE SURFACE-CO...

ESTER COMPOUND AND RESIN COMPOSITION

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

SMA Resin Formulation

Epoxy Resin, Epoxy Compounds, Epoxy Resin Composition, Resin Sheet,...

EPOXY RESIN, PREPARING METHOD THEREOF, EPOXY COMPOSITION COMPRISING...

EPOXY RESIN COMPOSITION

ELECTROLYTIC CAPACITOR