Pin grid array [PGA]

Industry

CPC
H05K2201/10704

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10704Pin grid array [PGA]

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Pluggable CPU modules with vertical power
- Patent number 12,002,795
- Issue date Jun 4, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a compression assembly for cable conn...
- Patent number 11,943,886
- Issue date Mar 26, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered dual-side multi-chip interconnect
- Patent number 11,798,923
- Issue date Oct 24, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component carrier board and a wiring method for the same
- Patent number 11,751,339
- Issue date Sep 5, 2023
- GLOBAL MASTER TECH. CO., LTD.
- Yao-Hua Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,696,396
- Issue date Jul 4, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,674,977
- Issue date Jun 13, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,562,970
- Issue date Jan 24, 2023
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,266,015
- Issue date Mar 1, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 11,114,421
- Issue date Sep 7, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-Package device ball map and layout optimization
- Patent number 11,032,910
- Issue date Jun 8, 2021
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,925,151
- Issue date Feb 16, 2021
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable socket connector assembly for an electronic
- Patent number 10,910,748
- Issue date Feb 2, 2021
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Socket connector for an electronic package
- Patent number 10,879,638
- Issue date Dec 29, 2020
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board
- Patent number 10,856,406
- Issue date Dec 1, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector assembly for an electronic package
- Patent number 10,741,951
- Issue date Aug 11, 2020
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array type discrete decoupling under BGA grid
- Patent number 10,743,408
- Issue date Aug 11, 2020
- ALCATEL LUCENT
- James M. Schriel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system interposer enabling specialty processor...
- Patent number 10,660,206
- Issue date May 19, 2020
- Dell Products, L.P.
- Kevin W. Mundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,517,167
- Issue date Dec 24, 2019
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SIP) with input/output (IO) board fo...
- Patent number 10,388,636
- Issue date Aug 20, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control circuit board and robot control device
- Patent number 10,251,275
- Issue date Apr 2, 2019
- Kawasaki Jukogyo Kabushiki Kaisha
- Yoshiki Santo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system interposer enabling specialty processor...
- Patent number 10,111,334
- Issue date Oct 23, 2018
- Dell Products, L.P.
- Kevin W. Mundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array formed on printed circuit board
- Patent number 9,955,586
- Issue date Apr 24, 2018
- Realtek Semiconductor Corp.
- Ting-Ying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable for alternative interconnect attachement
- Patent number 9,924,595
- Issue date Mar 20, 2018
- Intel Corporation
- Beom-Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,837,369
- Issue date Dec 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu Shimote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin connector structure and method
- Patent number 9,775,242
- Issue date Sep 26, 2017
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, wiring substrate, semiconductor apparatus and bump...
- Patent number 9,485,864
- Issue date Nov 1, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loadline impedance in a system
- Patent number 9,478,488
- Issue date Oct 25, 2016
- Intel Corporation
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and noise suppression method
- Patent number 9,313,877
- Issue date Apr 12, 2016
- NEC Corporation
- Hisashi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
- Publication number 20240266301
- Publication date Aug 8, 2024
- Juniper Networks, Inc.
- Gautam GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
- Publication number 20240006391
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Sangho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT
- Publication number 20230411365
- Publication date Dec 21, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS
- Publication number 20230380067
- Publication date Nov 23, 2023
- Intel Corporation
- Raul Enriquez Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS
- Publication number 20230363085
- Publication date Nov 9, 2023
- NVIDIA Corp.
- MingYi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pluggable CPU Modules With Vertical Power
- Publication number 20230335541
- Publication date Oct 19, 2023
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered Dual-Side Multi-Chip Interconnect
- Publication number 20230197696
- Publication date Jun 22, 2023
- NVIDIA Corp.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE AND POWER DEVICE
- Publication number 20230036995
- Publication date Feb 2, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220390488
- Publication date Dec 8, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220151063
- Publication date May 12, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING A COMPRESSION ASSEMBLY FOR CABLE CONN...
- Publication number 20220151095
- Publication date May 12, 2022
- TE Connectivity Services GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20210392746
- Publication date Dec 16, 2021
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20210366883
- Publication date Nov 25, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210358869
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...
- Publication number 20200146139
- Publication date May 7, 2020
- Eagle Technology, LLC
- Michael T. DeRoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20190378828
- Publication date Dec 12, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE
- Publication number 20190150311
- Publication date May 16, 2019
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION HANDLING SYSTEM INTERPOSER ENABLING SPECIALTY PROCESSOR...
- Publication number 20190053378
- Publication date Feb 14, 2019
- DELL PRODUCTS, L.P.
- KEVIN W. MUNDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20180331081
- Publication date Nov 15, 2018
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM INTERPOSER ENABLING SPECIALTY PROCESSOR...
- Publication number 20180288876
- Publication date Oct 4, 2018
- DELL PRODUCTS, L.P.
- KEVIN W. MUNDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID
- Publication number 20180242447
- Publication date Aug 23, 2018
- ALCATEL-LUCENT CANADA INC.
- James M. SCHRIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047695
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu SHIMOTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL CIRCUIT BOARD AND ROBOT CONTROL DEVICE
- Publication number 20170318679
- Publication date Nov 2, 2017
- KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Yoshiki SANTO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20160183374
- Publication date Jun 23, 2016
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT
- Publication number 20140283381
- Publication date Sep 25, 2014
- Fujitsu Limited
- Yoko MURATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSOLIDATED THERMAL MODULE
- Publication number 20140211415
- Publication date Jul 31, 2014
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reducing Loadline Impedance in a System
- Publication number 20140124942
- Publication date May 8, 2014
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delta Arrangement of Hexagonal-Close-Packed Signal Pairs
- Publication number 20130333933
- Publication date Dec 19, 2013
- Cisco Technology, Inc.
- Paul L. Mantiply
- H01 - BASIC ELECTRIC ELEMENTS

Pin grid array [PGA]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pluggable CPU modules with vertical power

Integrating system in package (SiP) with input/output (IO) board fo...

Electronic assembly including a compression assembly for cable conn...

Staggered dual-side multi-chip interconnect

Electronic-component carrier board and a wiring method for the same

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Semiconductor device and manufacturing method thereof

Short interconnect assembly with strip elastomer

Integrating system in package (SiP) with input/output (IO) board fo...

System-in-Package device ball map and layout optimization

Systems and methods for providing a high speed interconnect system...

Cable socket connector assembly for an electronic

Socket connector for an electronic package

Printed wiring board

Embedding component with pre-connected pillar in component carrier

Socket connector assembly for an electronic package

Array type discrete decoupling under BGA grid

Information handling system interposer enabling specialty processor...

Systems and methods for providing a high speed interconnect system...

Integrating system in package (SIP) with input/output (IO) board fo...

Control circuit board and robot control device

Information handling system interposer enabling specialty processor...

Ball grid array formed on printed circuit board

Cable for alternative interconnect attachement

Semiconductor device and manufacturing method thereof

Pin connector structure and method

Bump structure, wiring substrate, semiconductor apparatus and bump...

Reducing loadline impedance in a system

Electronic device and noise suppression method

Patents Applicationslast 30 patents

Pluggable CPU Modules with Vertical Power

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...

STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT

COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS

POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS

Pluggable CPU Modules With Vertical Power

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Staggered Dual-Side Multi-Chip Interconnect

POWER SUPPLY MODULE AND POWER DEVICE

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

ELECTRONIC ASSEMBLY INCLUDING A COMPRESSION ASSEMBLY FOR CABLE CONN...

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE

INFORMATION HANDLING SYSTEM INTERPOSER ENABLING SPECIALTY PROCESSOR...

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

INFORMATION HANDLING SYSTEM INTERPOSER ENABLING SPECIALTY PROCESSOR...

ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONTROL CIRCUIT BOARD AND ROBOT CONTROL DEVICE

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

METHOD OF MOUNTING ELECTRONIC COMPONENT

CONSOLIDATED THERMAL MODULE

Reducing Loadline Impedance in a System

Delta Arrangement of Hexagonal-Close-Packed Signal Pairs