Planarisation

Industry

CPC
H01L21/32115

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32115Planarisation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Source/drain contact structure
- Patent number 12,166,088
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing active areas
- Patent number 12,094,724
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to reduce transistor gate short defects
- Patent number 12,094,780
- Issue date Sep 17, 2024
- Intel Corporation
- Sridhar Govindaraju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer bonding method and semiconductor structure obtained by the same
- Patent number 11,978,641
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,935,757
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing active areas
- Patent number 11,830,744
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact architecture for capacitance reduction and satisfactory con...
- Patent number 11,824,097
- Issue date Nov 21, 2023
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to reduce transistor gate short defects
- Patent number 11,756,833
- Issue date Sep 12, 2023
- Intel Corporation
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure having void between bo...
- Patent number 11,676,857
- Issue date Jun 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-based method for delayering of circuits
- Patent number 11,664,238
- Issue date May 30, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Randy J. Shul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication thereof
- Patent number 11,640,936
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,626,293
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization apparatus, planarization process, and method of manuf...
- Patent number 11,562,924
- Issue date Jan 24, 2023
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate polishing apparatus
- Patent number 11,472,002
- Issue date Oct 18, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of semiconductor devices
- Patent number 11,456,185
- Issue date Sep 27, 2022
- Tokyo Electron Limited
- Ryan Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 11,450,544
- Issue date Sep 20, 2022
- Ebara Corporation
- Itsuki Kobata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,437,271
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Yixiong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming
- Patent number 11,424,364
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,404,283
- Issue date Aug 2, 2022
- Tokyo Electron Limited
- Shigeru Tahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Source/drain contact structure
- Patent number 11,387,331
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to reduce transistor gate short defects
- Patent number 11,380,592
- Issue date Jul 5, 2022
- Intel Corporation
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having metal layers enclosing a dielectric
- Patent number 11,373,949
- Issue date Jun 28, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zuopeng He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for planarization of spin-on and CVD-deposited organic films
- Patent number 11,335,566
- Issue date May 17, 2022
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including back-side conductive layer
- Patent number 11,328,955
- Issue date May 10, 2022
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dummy gate with an interlayer diel...
- Patent number 11,309,317
- Issue date Apr 19, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,295,961
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact architecture for capacitance reduction and satisfactory con...
- Patent number 11,282,930
- Issue date Mar 22, 2022
- Intel Corporation
- Rishabh Mehandru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semicondcutor package
- Patent number 11,233,019
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semi-dynamic bottom up reflow
- Patent number 11,222,816
- Issue date Jan 11, 2022
- Applied Materials, Inc.
- Lanlan Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250014944
- Publication date Jan 9, 2025
- SCREEN Holdings Co., Ltd.
- Kana TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Contact Plugs With Reduced R/C and the Methods of Forming The Same
- Publication number 20240413020
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID AND POLISHING METHOD
- Publication number 20240228830
- Publication date Jul 11, 2024
- Showa Denko Materials Co., Ltd.
- Hiroshi ONO
- B24 - GRINDING POLISHING
Information Patent Application
Display Apparatus
- Publication number 20240222417
- Publication date Jul 4, 2024
- LG Display Co., Ltd.
- Hyoungsun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240186148
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Stacked Package and Methods of Making the Same
- Publication number 20240096722
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING ACTIVE AREAS
- Publication number 20240038548
- Publication date Feb 1, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...
- Publication number 20240038857
- Publication date Feb 1, 2024
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20230395392
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING ACTIVE AREAS
- Publication number 20230386858
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20230360973
- Publication date Nov 9, 2023
- Intel Corporation
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...
- Publication number 20230317605
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20230260900
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230245900
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL PLANARIZATION
- Publication number 20230143013
- Publication date May 11, 2023
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NANOSTRUCTURE MATERIALS AND FABRICATION METHODS
- Publication number 20230135677
- Publication date May 4, 2023
- The Johns Hopkins University
- Lance H. Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION APPARATUS, PLANARIZATION PROCESS, AND METHOD OF MANUF...
- Publication number 20230061361
- Publication date Mar 2, 2023
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP-ATTACHED SUBSTRATE AND SUBSTRATE PROCE...
- Publication number 20220406603
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20220375775
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Itsuki KOBATA
- B24 - GRINDING POLISHING
Information Patent Application
Source/Drain Contact Structure
- Publication number 20220336592
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Ting Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20220262684
- Publication date Aug 18, 2022
- Intel Corporation
- Sridhar Govindaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20220230889
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Fabrication Thereof
- Publication number 20220223517
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...
- Publication number 20220165855
- Publication date May 26, 2022
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR STRUCTURE HAVING VOID BETWEEN BO...
- Publication number 20220044963
- Publication date Feb 10, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Contact Structure
- Publication number 20220028983
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Ting Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW
- Publication number 20210391214
- Publication date Dec 16, 2021
- Applied Materials, Inc.
- Lanlan ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAMLESS GAP FILL
- Publication number 20210351074
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Yixiong Yang
- H01 - BASIC ELECTRIC ELEMENTS

Planarisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Source/drain contact structure

Method of preparing active areas

Techniques and configurations to reduce transistor gate short defects

Substrate processing apparatus, substrate processing system, and su...

Wafer bonding method and semiconductor structure obtained by the same

Method of manufacturing a semiconductor device

Method of preparing active areas

Contact architecture for capacitance reduction and satisfactory con...

Techniques and configurations to reduce transistor gate short defects

Method for preparing semiconductor structure having void between bo...

Plasma-based method for delayering of circuits

Interconnect structures and methods of fabrication thereof

Method of manufacturing a semiconductor device

Planarization apparatus, planarization process, and method of manuf...

Substrate polishing apparatus

Planarization of semiconductor devices

Substrate processing apparatus, substrate processing system, and su...

Seamless gap fill

FinFET device and method of forming

Etching method

Source/drain contact structure

Techniques and configurations to reduce transistor gate short defects

Interconnect structure having metal layers enclosing a dielectric

Method for planarization of spin-on and CVD-deposited organic films

Semiconductor chip including back-side conductive layer

Semiconductor structure having a dummy gate with an interlayer diel...

Method of manufacturing a semiconductor device

Contact architecture for capacitance reduction and satisfactory con...

Manufacturing method of semicondcutor package

Methods and apparatus for semi-dynamic bottom up reflow

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

Contact Plugs With Reduced R/C and the Methods of Forming The Same

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

POLISHING LIQUID AND POLISHING METHOD

Display Apparatus

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Fan-Out Stacked Package and Methods of Making the Same

METHOD OF PREPARING ACTIVE AREAS

CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

METHOD OF PREPARING ACTIVE AREAS

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

CHEMICAL PLANARIZATION

NANOSTRUCTURE MATERIALS AND FABRICATION METHODS

PLANARIZATION APPARATUS, PLANARIZATION PROCESS, AND METHOD OF MANUF...

MANUFACTURING METHOD OF CHIP-ATTACHED SUBSTRATE AND SUBSTRATE PROCE...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

Source/Drain Contact Structure

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Interconnect Structures and Methods of Fabrication Thereof

CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...

METHOD FOR PREPARING SEMICONDUCTOR STRUCTURE HAVING VOID BETWEEN BO...

Source/Drain Contact Structure

METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW

SEAMLESS GAP FILL