Plating poison

Industry

CPC
H05K2203/0713

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0713Plating poison

Industries

Patents Grantslast 30 patents

Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,765,827
- Issue date Sep 19, 2023
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,665,829
- Issue date May 30, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,820,427
- Issue date Oct 27, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,667,390
- Issue date May 26, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing customized PCB via creation through use of magnetic pads
- Patent number 10,433,431
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,362,687
- Issue date Jul 23, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,201,098
- Issue date Feb 5, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,123,432
- Issue date Nov 6, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,034,391
- Issue date Jul 24, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 9,781,830
- Issue date Oct 3, 2017
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 9,781,844
- Issue date Oct 3, 2017
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing a patterned electric circuit
- Patent number 9,000,303
- Issue date Apr 7, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoresist-free metal deposition
- Patent number 8,500,985
- Issue date Aug 6, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic articles, optionally with partial metal coating
- Patent number 8,207,261
- Issue date Jun 26, 2012
- E. I. Du Pont de Nemours and Company
- Andri E Elia
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Photoresist-free metal deposition
- Patent number 7,947,163
- Issue date May 24, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Local electroless plating process for plastics
- Patent number 4,940,608
- Issue date Jul 10, 1990
- Okuno Chemical Industry Co., Ltd.
- Shigemitsu Kawagishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, process for preparing the same and resist in...
- Patent number 4,610,910
- Issue date Sep 9, 1986
- Hitachi, Ltd.
- Mineo Kawamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for production of printed circuits by electroless metal plating
- Patent number 4,293,592
- Issue date Oct 6, 1981
- Hitachi, Ltd.
- Hirosada Morishita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of printed circuits by electroless metal plat...
- Patent number 4,151,313
- Issue date Apr 24, 1979
- Hitachi, Ltd.
- Motoyo Wajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3799816
- Patent number 3,799,816
- Issue date Mar 26, 1974
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3775121
- Patent number 3,775,121
- Issue date Nov 27, 1973
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3672925
- Patent number 3,672,925
- Issue date Jun 27, 1972
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3443988
- Patent number 3,443,988
- Issue date May 13, 1969
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200383204
- Publication date Dec 3, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200015364
- Publication date Jan 9, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS
- Publication number 20190254176
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20190075662
- Publication date Mar 7, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180317327
- Publication date Nov 1, 2018
- Sanmina Corporation
- Shinichi IKETANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS
- Publication number 20180310418
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig KALLMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED
- Publication number 20180237917
- Publication date Aug 23, 2018
- SEMBLANT LIMITED
- Gianfranco ARESTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20180098426
- Publication date Apr 5, 2018
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20140262455
- Publication date Sep 18, 2014
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20140251663
- Publication date Sep 11, 2014
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20140014401
- Publication date Jan 16, 2014
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Pen-Yi LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTORESIST-FREE METAL DEPOSITION
- Publication number 20140014522
- Publication date Jan 16, 2014
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTRIC CIRCUIT DEPOSITION
- Publication number 20110292622
- Publication date Dec 1, 2011
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Arjan Hovestad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT
- Publication number 20110017495
- Publication date Jan 27, 2011
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASTIC ARTICLES, OPTIONALLY WITH PARTIAL METAL COATING
- Publication number 20100255325
- Publication date Oct 7, 2010
- E.I. Du Pont De Nemours and Company
- Andri E. Elia
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090277801
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090280243
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Preventing Plating on a Portion of a Molded Plastic Part
- Publication number 20090239079
- Publication date Sep 24, 2009
- Mark Wojtaszek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Plating poison

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Simultaneous and selective wide gap partitioning of via structures...

Method for manufacturing wiring board

Simultaneous and selective wide gap partitioning of via structures...

Simultaneous and selective wide gap partitioning of via structures...

Simultaneous and selective wide gap partitioning of via structures...

Implementing customized PCB via creation through use of magnetic pads

Simultaneous and selective wide gap partitioning of via structures...

Selective partitioning of via structures in printed circuit boards

Simultaneous and selective wide gap partitioning of via structures...

Selective partitioning of via structures in printed circuit boards

Simultaneous and selective wide gap partitioning of via structures...

Simultaneous and selective wide gap partitioning of via structures...

Method for preparing a patterned electric circuit

Photoresist-free metal deposition

Plastic articles, optionally with partial metal coating

Photoresist-free metal deposition

Local electroless plating process for plastics

Printed circuit board, process for preparing the same and resist in...

Method for production of printed circuits by electroless metal plating

Method for production of printed circuits by electroless metal plat...

3799816

3775121

3672925

3443988

Patents Applicationslast 30 patents

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS

SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS

ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME

PHOTORESIST-FREE METAL DEPOSITION

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT

PLASTIC ARTICLES, OPTIONALLY WITH PARTIAL METAL COATING

Photoresist-free metal deposition

Photoresist-free metal deposition

Process for Preventing Plating on a Portion of a Molded Plastic Part