Polyalkene or polyolefin

Industry

CPC
H05K2201/0158

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0158Polyalkene or polyolefin

Industries

Patents Grantslast 30 patents

Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate
- Patent number 12,041,716
- Issue date Jul 16, 2024
- LG Innotek Co., Ltd
- Nam Heon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric resin composition, molded article, film, multilayer...
- Patent number 11,993,740
- Issue date May 28, 2024
- Kaneka Corporation
- Yuichi Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organic insulating body, metal-clad laminate, and wiring board
- Patent number 11,879,049
- Issue date Jan 23, 2024
- Kyocera Corporation
- Satoshi Kajita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermally conductive thermoplastic compositions with good dielectri...
- Patent number 11,643,586
- Issue date May 9, 2023
- SHPP Global Technologies B.V.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,600,936
- Issue date Mar 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor bridge and electronic device
- Patent number 11,497,114
- Issue date Nov 8, 2022
- Murata Manufacturing Co., Ltd.
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 11,401,393
- Issue date Aug 2, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive dry film and uses of the same
- Patent number 11,353,791
- Issue date Jun 7, 2022
- Eternal Materials Co., Ltd.
- Tsung-Hsiu Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, and laminated film including base material film, resin...
- Patent number 11,330,721
- Issue date May 10, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible prepreg and uses thereof
- Patent number 11,312,829
- Issue date Apr 26, 2022
- Taiwan Union Technology Corporation
- Shur-fen Liu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition, prepreg, laminate, and printed cir...
- Patent number 11,261,305
- Issue date Mar 1, 2022
- Shengyi Technology Co., Ltd.
- Guangbin Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 11,147,166
- Issue date Oct 12, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing circuit board structure
- Patent number 11,114,782
- Issue date Sep 7, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor bridge and electronic device
- Patent number 11,083,083
- Issue date Aug 3, 2021
- Murata Manufacturing Co., Ltd.
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyphenylene ether resin composition, prepreg, metal-clad laminate...
- Patent number 11,066,548
- Issue date Jul 20, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flexible substrate and a method thereof
- Patent number 11,057,990
- Issue date Jul 6, 2021
- WELLNESYS INC.
- Muralidhar Somisetty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible printed circuit board and flexibl...
- Patent number 11,013,128
- Issue date May 18, 2021
- AMOSENSE CO., LTD
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible printed circuit board and flexibl...
- Patent number 11,006,531
- Issue date May 11, 2021
- AMOGREENTECH CO., LTD.
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation of high conductivity copper films
- Patent number 10,954,406
- Issue date Mar 23, 2021
- Chantal Paquet
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Primer composition and copper foil substrate using the same
- Patent number 10,917,964
- Issue date Feb 9, 2021
- Industrial Technology Research Institute
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive layer-equipped laminate, and flexible copper-clad laminate...
- Patent number 10,875,283
- Issue date Dec 29, 2020
- Toagosei Co., Ltd.
- Yuya Okimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Forming electrical connections in fabric-based items
- Patent number 10,844,524
- Issue date Nov 24, 2020
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE WIRING BOARD
- Publication number 20250106986
- Publication date Mar 27, 2025
- Murata Manufacturing Co., Ltd.
- Hayato KATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS SILICA FIBER REINFORCED COMPOSITES FOR HIGH-FREQUENCY PR...
- Publication number 20240179837
- Publication date May 30, 2024
- Corning Incorporated
- Joseph Edward McCarthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC INSULATOR AND WIRING BOARD
- Publication number 20230209708
- Publication date Jun 29, 2023
- KYOCERA CORPORATION
- Chie CHIKARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING BOARD
- Publication number 20230073700
- Publication date Mar 9, 2023
- Murata Manufacturing Co., Ltd.
- Ryo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin Sheet and Circuit Board Material Using the Same
- Publication number 20230007767
- Publication date Jan 5, 2023
- MCPP Innovation LLC
- Yuuko Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20220361318
- Publication date Nov 10, 2022
- LG Innotek Co., Ltd.
- Nam Heon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20220192033
- Publication date Jun 16, 2022
- Idemitsu Kosan Co.,Ltd
- Fumioki FUKATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRIM ELEMENT COMPRISING A FUNCTIONAL LAYER MADE OF CARBON MATERIAL
- Publication number 20220161741
- Publication date May 26, 2022
- FAURECIA INTERIEUR INDUSTRIE
- Godefroy BEAU
- B60 - VEHICLES IN GENERAL
Information Patent Application
INDUCTOR BRIDGE AND ELECTRONIC DEVICE
- Publication number 20210315098
- Publication date Oct 7, 2021
- Murata Manufacturing Co., Ltd.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME
- Publication number 20210307164
- Publication date Sep 30, 2021
- Shengyi Technology Co., Ltd.
- Weifeng YIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210273356
- Publication date Sep 2, 2021
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...
- Publication number 20210176854
- Publication date Jun 10, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki TAKAHASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...
- Publication number 20210127501
- Publication date Apr 29, 2021
- AMOGREENTECH CO., LTD.
- Sung-Baek DAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming Electrical Connections in Fabric-Based Items
- Publication number 20210079569
- Publication date Mar 18, 2021
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Application
FLEXIBLE SUBSTRATE AND A METHOD THEREOF
- Publication number 20210068245
- Publication date Mar 4, 2021
- WELLNESYS INC.
- Muralidhar SOMISETTY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE THERMOPLASTIC COMPOSITIONS WITH GOOD DIELECTRI...
- Publication number 20210009886
- Publication date Jan 14, 2021
- SABIC Global Technologies B.V.
- Jian WANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE NANOTUBE COATED SUBSTRATES FOR SINTERING OF METALLIC...
- Publication number 20200407565
- Publication date Dec 31, 2020
- National Research Council of Canada
- Chantal PAQUET
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200366012
- Publication date Nov 19, 2020
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...
- Publication number 20200337158
- Publication date Oct 22, 2020
- AMOSENSE CO., LTD.
- Sung-Baek DAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR BRIDGE AND ELECTRONIC DEVICE
- Publication number 20200305277
- Publication date Sep 24, 2020
- Murata Manufacturing Co., Ltd.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...
- Publication number 20200283615
- Publication date Sep 10, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
- Publication number 20200270411
- Publication date Aug 27, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...
- Publication number 20200253059
- Publication date Aug 6, 2020
- Hitachi Chemical Company, Ltd.
- Tomoaki SHIBATA
- G01 - MEASURING TESTING
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIR...
- Publication number 20200247970
- Publication date Aug 6, 2020
- Shengyi Technology Co., Ltd.
- Guangbin CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE PREPREG AND USES THEREOF
- Publication number 20200216626
- Publication date Jul 9, 2020
- Taiwan Union Technology Corporation
- Shur-fen LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE MATERIAL MADE OF THERMOSETTING RESIN COMPOSITION
- Publication number 20200165446
- Publication date May 28, 2020
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MAKING FLEXIBLE CIRCUIT BOARD
- Publication number 20200068715
- Publication date Feb 27, 2020
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20200068716
- Publication date Feb 27, 2020
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CONDUCTIVE ELEMENT AND SHAPING METHOD THEREOF
- Publication number 20190378637
- Publication date Dec 12, 2019
- I.R.C.A. S.P.A. INDUSTRIA RESISTENZE CORAZZATE AFFINI
- Omar Rispoli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Polyalkene or polyolefin

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Trim element comprising a functional layer made of carbon material

Flexible wiring board

Substrate

Low dielectric resin composition, molded article, film, multilayer...

Boron nitride nanotube coated substrates for sintering of metallic...

Circuit material and circuit board containing the same

Organic insulating body, metal-clad laminate, and wiring board

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Thermally conductive thermoplastic compositions with good dielectri...

Circuit board structure

Inductor bridge and electronic device

Prepreg, metal-clad laminate, and wiring board

Fluororesin base material, printed wiring board, and circuit module

Photosensitive dry film and uses of the same

Resin film, and laminated film including base material film, resin...

Flexible prepreg and uses thereof

Thermosetting resin composition, prepreg, laminate, and printed cir...

Printing of nanowire films

Method for producing semiconductor device

Method of manufacturing circuit board structure

Inductor bridge and electronic device

Polyphenylene ether resin composition, prepreg, metal-clad laminate...

Flexible substrate and a method thereof

Method for manufacturing flexible printed circuit board and flexibl...

Method for manufacturing flexible printed circuit board and flexibl...

High-speed interconnects for printed circuit boards

Preparation of high conductivity copper films

Primer composition and copper foil substrate using the same

Adhesive layer-equipped laminate, and flexible copper-clad laminate...

Forming electrical connections in fabric-based items

Patents Applicationslast 30 patents

STRETCHABLE WIRING BOARD

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

CONTINUOUS SILICA FIBER REINFORCED COMPOSITES FOR HIGH-FREQUENCY PR...

ORGANIC INSULATOR AND WIRING BOARD

FLEXIBLE WIRING BOARD

Resin Sheet and Circuit Board Material Using the Same

SUBSTRATE

CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD

TRIM ELEMENT COMPRISING A FUNCTIONAL LAYER MADE OF CARBON MATERIAL

INDUCTOR BRIDGE AND ELECTRONIC DEVICE

CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BO...

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...

Forming Electrical Connections in Fabric-Based Items

FLEXIBLE SUBSTRATE AND A METHOD THEREOF

THERMALLY CONDUCTIVE THERMOPLASTIC COMPOSITIONS WITH GOOD DIELECTRI...

BORON NITRIDE NANOTUBE COATED SUBSTRATES FOR SINTERING OF METALLIC...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...

INDUCTOR BRIDGE AND ELECTRONIC DEVICE

POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE...

PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIR...

FLEXIBLE PREPREG AND USES THEREOF

COMPOSITE MATERIAL MADE OF THERMOSETTING RESIN COMPOSITION

METHOD OF MAKING FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT BOARD

FLEXIBLE CONDUCTIVE ELEMENT AND SHAPING METHOD THEREOF