Polyester

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CPC
H05K2201/0145

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0145Polyester

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 12,052,814
- Issue date Jul 30, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent conductive film
- Patent number 12,046,392
- Issue date Jul 23, 2024
- Chasm Advanced Materials Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Backlit user interface
- Patent number 11,910,524
- Issue date Feb 20, 2024
- Molex, LLC
- Steven Fulton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin flexible structures with surfaces with transparent conductive...
- Patent number 11,910,525
- Issue date Feb 20, 2024
- C3 Nano, Inc.
- Xiaofeng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimization of high resolution digitally encoded laser scanners fo...
- Patent number 11,888,084
- Issue date Jan 30, 2024
- nLIGHT, Inc.
- Ken Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive film
- Patent number 11,751,327
- Issue date Sep 5, 2023
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method of providing a fluid bag heater
- Patent number 11,633,549
- Issue date Apr 25, 2023
- Jabil Inc.
- Mary Alice Gill
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Display device using semiconductor light emitting diode
- Patent number 11,605,757
- Issue date Mar 14, 2023
- LG Electronics Inc.
- Changseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlit user interface
- Patent number 11,589,456
- Issue date Feb 21, 2023
- Molex, LLC
- Steven Fulton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 11,516,904
- Issue date Nov 29, 2022
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable electronic device
- Patent number 11,516,909
- Issue date Nov 29, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Marco Barink
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 11,462,529
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jungpyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission apparatus and display apparatus
- Patent number 11,445,611
- Issue date Sep 13, 2022
- HKC CORPORATION LIMITED
- Huailiang He
- G02 - OPTICS
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of high resolution digitally encoded laser scanners fo...
- Patent number 11,411,132
- Issue date Aug 9, 2022
- nLIGHT, Inc.
- Ken Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of printing ultranarrow line
- Patent number 11,396,610
- Issue date Jul 26, 2022
- National Research Council of Canada
- Ta-Ya Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent conductive film
- Patent number 11,393,607
- Issue date Jul 19, 2022
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrically conductive film
- Patent number 11,388,814
- Issue date Jul 12, 2022
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Black liquid-crystal polymer film and multilayer board
- Patent number 11,365,353
- Issue date Jun 21, 2022
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive dry film and uses of the same
- Patent number 11,353,791
- Issue date Jun 7, 2022
- Eternal Materials Co., Ltd.
- Tsung-Hsiu Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407090
- Publication date Dec 5, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...
- Publication number 20240397604
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT
- Publication number 20240341031
- Publication date Oct 10, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...
- Publication number 20240314938
- Publication date Sep 19, 2024
- UNEO INC.
- Chih-Sheng HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA AND ELECTRONIC DEVICE
- Publication number 20240275053
- Publication date Aug 15, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Zhe CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
- Publication number 20240052093
- Publication date Feb 15, 2024
- DIC CORPORATION
- Ryuichi MATSUOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD
- Publication number 20230413420
- Publication date Dec 21, 2023
- AGC Glass Europe
- Mohsen YOUSEFBEIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...
- Publication number 20230317614
- Publication date Oct 5, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20230265246
- Publication date Aug 24, 2023
- FUJIFILM CORPORATION
- Shohei YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKLIT USER INTERFACE
- Publication number 20230120952
- Publication date Apr 20, 2023
- Molex, LLC
- Steven FULTON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE HYBRID INTERCONNECT CIRCUITS
- Publication number 20230116550
- Publication date Apr 13, 2023
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE WIRING BOARD
- Publication number 20230073700
- Publication date Mar 9, 2023
- Murata Manufacturing Co., Ltd.
- Ryo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE M...
- Publication number 20220418111
- Publication date Dec 29, 2022
- Denka Company Limited
- Naoki OGAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD MADE OF DIFFERENT MATERIALS AND M...
- Publication number 20220386478
- Publication date Dec 1, 2022
- TSE CO., LTD.
- Eun Ha PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Film
- Publication number 20220319734
- Publication date Oct 6, 2022
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
- Publication number 20220312598
- Publication date Sep 29, 2022
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM
- Publication number 20220287173
- Publication date Sep 8, 2022
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20220272845
- Publication date Aug 25, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE
- Publication number 20220153937
- Publication date May 19, 2022
- Sumitomo Chemical Company, Limited
- Shohei AZAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE HYBRID INTERCONNECT CIRCUITS
- Publication number 20220078902
- Publication date Mar 10, 2022
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE MODULE AND COMPUTING DEVICE USING SAME
- Publication number 20210382528
- Publication date Dec 9, 2021
- Primax Electronics Ltd.
- Wei-Ping Chan
- G06 - COMPUTING CALCULATING COUNTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curable resin, curable resin composition, and cured product

Multi-layer printed circuit board made of different materials and m...

Bent laminated printed circuit board

Flexible hybrid interconnect circuits

Transparent conductive film

Circuit structure

Methods of forming flexible interconnect circuits

Boron nitride nanotube coated substrates for sintering of metallic...

Protection tape for printed circuit board and display device includ...

Backlit user interface

Thin flexible structures with surfaces with transparent conductive...

Optimization of high resolution digitally encoded laser scanners fo...

Circuit board with embedded electronic component and method for man...

Electrically conductive film

Dual conductor laminated substrate

Circuit structure

Apparatus, system and method of providing a fluid bag heater

Display device using semiconductor light emitting diode

Backlit user interface

Flexible hybrid interconnect circuits

Stretchable electronic device

Electronic apparatus

Signal transmission apparatus and display apparatus

Resin composition, metal foil provided with resin layer, metal clad...

Optimization of high resolution digitally encoded laser scanners fo...

Method of printing ultranarrow line

Transparent conductive film

Electrically conductive film

Black liquid-crystal polymer film and multilayer board

Photosensitive dry film and uses of the same

Patents Applicationslast 30 patents

FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME

GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

Flexible Hybrid Interconnect Circuits

Transparent Conductive Film

COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT

EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Method for preparing novel material layer structure of circuit boar...

ANTENNA AND ELECTRONIC DEVICE

Interconnect Circuit Methods And Devices

INTERCONNECT CIRCUIT METHODS AND DEVICES

CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT

LAMINATED ASSEMBLY COMPRISING RADIO-FREQUENCY INTERFACE BOARD

Circuit Structure

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPR...

FILM, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

BACKLIT USER INTERFACE

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

FLEXIBLE WIRING BOARD

METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE M...

MULTI-LAYER PRINTED CIRCUIT BOARD MADE OF DIFFERENT MATERIALS AND M...

Transparent Conductive Film

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...

ELECTRICALLY CONDUCTIVE FILM

Method for preparing novel material layer structure of circuit boar...

FILM AND LAMINATE

MANUFACTURING METHOD OF PRINTED BOARD

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

LIGHT SOURCE MODULE AND COMPUTING DEVICE USING SAME