Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof

Industry

CPC
Y10S525/928

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series

Current Industry

Y10S525/928Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof

Industries

Patents Grantslast 30 patents

Information Patent Grant
Organic electroluminescence display and method of producing same
- Patent number 8,062,774
- Issue date Nov 22, 2011
- Canon Kabushiki Kaisha
- Katsumi Nakagawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Organic electroluminescence display and method of producing same
- Patent number 7,790,297
- Issue date Sep 7, 2010
- Canon Kabushiki Kaisha
- Katsumi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High molecular weight stereoregular head-tail poly(glucaramides)
- Patent number 7,314,906
- Issue date Jan 1, 2008
- The University of Montana
- Donald E. Kiely
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alignment film and LCD made of the same
- Patent number 7,211,303
- Issue date May 1, 2007
- Chi Mei Optoelectronics Inc.
- Yuichi Momoi
- G02 - OPTICS
Information Patent Grant
Soluble polyimide for photosensitive polyimide precursor and photos...
- Patent number 7,157,204
- Issue date Jan 2, 2007
- Samsung Electronics Co., Ltd.
- Myung Sup Jung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer dicing/die bonding sheet
- Patent number 7,147,920
- Issue date Dec 12, 2006
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition and adhesive film
- Patent number 6,808,819
- Issue date Oct 26, 2004
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides having high Tg, high TOS, and low moisture regain
- Patent number 6,127,509
- Issue date Oct 3, 2000
- E. I. Du Pont de Nemours and Company
- James F. Pratte
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flame retardant resin composition
- Patent number 6,117,542
- Issue date Sep 12, 2000
- Asahi Kasei Kogyo Kabushiki Kaisha
- Nobutsugu Nanba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optical fibre and optical fibre tape, and method for making same
- Patent number 5,990,267
- Issue date Nov 23, 1999
- Alcatel Cable
- Christopher McNutt
- G02 - OPTICS
Information Patent Grant
Photosensitive polyimide precursors
- Patent number 5,866,627
- Issue date Feb 2, 1999
- International Business Machines Corporation
- George Czornyj
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant polymer composition, alignment layer formed using th...
- Patent number 5,866,034
- Issue date Feb 2, 1999
- Samsung Display Devices Co., Ltd.
- Kwan-young Han
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,667,899
- Issue date Sep 16, 1997
- Hitachi Chemical Co. Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,605,763
- Issue date Feb 25, 1997
- Hitachi Chemical Company Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide based resin composition
- Patent number 5,571,875
- Issue date Nov 5, 1996
- Mitsui Toatsu Chemicals, Inc.
- Toshihiko Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide based resin composition
- Patent number 5,516,837
- Issue date May 14, 1996
- Mitsui Toatsu Chemicals, Inc.
- Toshihiko Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,510,425
- Issue date Apr 23, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,508,357
- Issue date Apr 16, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide precursors
- Patent number 5,446,074
- Issue date Aug 29, 1995
- International Business Machines Corporation
- George Czornyj
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting polyimide composition, thermoset product thereof and...
- Patent number 5,401,812
- Issue date Mar 28, 1995
- Matsushita Electric Works, Ltd.
- Hiroshi Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unreinforced polyamide molding materials
- Patent number 5,332,777
- Issue date Jul 26, 1994
- BASF Aktiengesellschaft
- Walter Goetz
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide based resin composition
- Patent number 5,312,866
- Issue date May 17, 1994
- Mitsui Toatsu Chemicals, Incorporated
- Toshihiko Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-resistant adhesive and method of adhesion by using adhesive
- Patent number 5,300,620
- Issue date Apr 5, 1994
- Mitsui Toatsu Chemicals, Incorporated
- Hideaki Okikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin systems of improved toughness and high temperature performanc...
- Patent number 5,278,224
- Issue date Jan 11, 1994
- Hexcel Corporation
- Karen A. Olesen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-resistant adhesive and method of adhesion by using adhesive
- Patent number 5,252,700
- Issue date Oct 12, 1993
- Mitsui Toatsu Chemicals, Inc.
- Hideaki Okikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Toughened resin systems for composite applications
- Patent number 5,248,711
- Issue date Sep 28, 1993
- Hexcel Corporation
- Robert A. Buyny
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide resin composition
- Patent number 5,157,085
- Issue date Oct 20, 1992
- Mitsui Toatsu Chemicals, Incorporated
- Masahiro Ohta
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide resins prepared by addition reactions
- Patent number 5,132,395
- Issue date Jul 21, 1992
- TRW Inc.
- Tito T. Serafini
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Soluble and/or fusible polyamidoimide-polyimide block copolymers
- Patent number 5,118,765
- Issue date Jun 2, 1992
- Chemie Holding Aktiengesellschaft
- Gerd Greber
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bismaleimide compositions containing high glass transition temperat...
- Patent number 5,112,924
- Issue date May 12, 1992
- Hercules Incorporated
- Sung G. Chu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC ELECTROLUMINESCENCE DISPLAY AND METHOD OF PRODUCING SAME
- Publication number 20100171115
- Publication date Jul 8, 2010
- Canon Kabushiki Kaisha
- Katsumi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic electroluminescence display and method of producing same
- Publication number 20070001595
- Publication date Jan 4, 2007
- Canon Kabushiki Kaisha
- Katsumi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment film and LCD made of the same
- Publication number 20060134348
- Publication date Jun 22, 2006
- Yuichi Momoi
- G02 - OPTICS
Information Patent Application
High molecular weight stereoregular head-tail poly(glucaramides)
- Publication number 20040143089
- Publication date Jul 22, 2004
- Donald E. Kiely
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer dicing/die bonding sheet
- Publication number 20040105990
- Publication date Jun 3, 2004
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Soluble polyimide for photosensitive polyimide precursor and photos...
- Publication number 20040096773
- Publication date May 20, 2004
- Myung Sup Jung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat resistant resin composition and adhesive film
- Publication number 20030158350
- Publication date Aug 21, 2003
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Organic electroluminescence display and method of producing same

Organic electroluminescence display and method of producing same

High molecular weight stereoregular head-tail poly(glucaramides)

Alignment film and LCD made of the same

Soluble polyimide for photosensitive polyimide precursor and photos...

Wafer dicing/die bonding sheet

Heat resistant resin composition and adhesive film

Polyimides having high Tg, high TOS, and low moisture regain

Flame retardant resin composition

Optical fibre and optical fibre tape, and method for making same

Photosensitive polyimide precursors

Heat resistant polymer composition, alignment layer formed using th...

Electrically conductive bonding films

Electrically conductive bonding films

Polyimide based resin composition

Polyimide based resin composition

Polyimides, thermosetting resin compositions containing the polyimi...

Polyimides, thermosetting resin compositions containing the polyimi...

Photosensitive polyimide precursors

Thermosetting polyimide composition, thermoset product thereof and...

Unreinforced polyamide molding materials

Polyimide based resin composition

Heat-resistant adhesive and method of adhesion by using adhesive

Resin systems of improved toughness and high temperature performanc...

Heat-resistant adhesive and method of adhesion by using adhesive

Toughened resin systems for composite applications

Polyimide resin composition

Polyimide resins prepared by addition reactions

Soluble and/or fusible polyamidoimide-polyimide block copolymers

Bismaleimide compositions containing high glass transition temperat...

Patents Applicationslast 30 patents

ORGANIC ELECTROLUMINESCENCE DISPLAY AND METHOD OF PRODUCING SAME

Organic electroluminescence display and method of producing same

Alignment film and LCD made of the same

High molecular weight stereoregular head-tail poly(glucaramides)

Wafer dicing/die bonding sheet

Soluble polyimide for photosensitive polyimide precursor and photos...

Heat resistant resin composition and adhesive film